Qhov muag tsis pom faus qhov pcb boardstau dhau los ua tus neeg nqa khoom tseem ceeb hauv siab -kawg teb xws li 5G kev sib txuas lus, aerospace, kev kho mob hluav taws xob, thiab lwm yam, ua tsaug rau nws cov txiaj ntsig tseem ceeb ntawm "txuag qhov chaw hauv pawg thawj coj saib, txo cov teeb liab cuam tshuam, thiab txhim kho kev sib koom ua ke". Txawm li cas los xij, piv rau ib txwm dhau los ntawm - qhov pcb boards, cov qauv "tsis nkag mus" thiab "ntau- txheej kev sib txuas" cov yam ntxwv ntawm qhov muag tsis pom kev ua rau muaj ntau yam kev tsis sib haum xeeb hauv lawv cov kev ua, thiab kev sib txawv ntawm txhua qhov txuas tuaj yeem ua rau cov khoom tsis ua haujlwm.
1, Lub hauv paus ua rau kev ua haujlwm nyuaj
Qhov nyuaj ntawm qhov muag tsis pom faus qhov pcb board nyob rau hauv nws qhov yuav tsum tau rau "spatial dimension raug". Qhov qhov muag tsis pom kev thiab qhov faus qhov tawg ua rau qhov yooj yim logic ntawm cov tsoos los ntawm qhov nkag mus rau tag nrho lub rooj tsavxwm, yuav tsum muaj kev sib txuas ncaj nraim ntawm qhov tob thiab qhov chaw nyob rau hauv qhov txwv thickness substrate, thaum tseem xav txog kev sib koom ua ke ntawm ntau - txheej circuits. Cov qauv no coj ob qho kev sib tw tseem ceeb: ua ntej, qhov nyuaj ntawm kev tswj qhov tob - qhov tob tob ntawm qhov muag tsis pom qhov yuav tsum tau ua kom raug raws li qhov kev ncua deb ntawm qhov chaw mus rau lub hom phiaj sab hauv txheej, thiab kev sib txawv dhau ntawm qhov tsim nyog yuav ua rau "tsis nkag mus" lossis "xws li txheej sab hauv"; Qhov thib ob yog qhov teeb meem ntawm interlayer alignment - kev ua ntawm faus qhov yuav tsum tau hla ntau lub puab substrates, thiab qhov sib txawv ntawm shrinkage npaum li cas thiab positioning reference offset ntawm lub laminated substrate yuav ua rau lub faus qhov yuav misaligned nrog lub puab solder pads, thaum kawg ua rau qhib circuits los yog luv luv circuits.
2, Kev tawg ntawm kev nyuaj hauv cov txheej txheem tseem ceeb
(1) Drilling txheej txheem:
Drilling yog "thawj lub neej" ntawm qhov muag tsis pom kev faus qhov ua tiav, thiab nws qhov tseeb ncaj qha txiav txim siab qhov cuam tshuam kev cuam tshuam tom ntej. Nws feem ntau ntsib peb qhov teeb meem loj:
Qhov nyuaj ntawm kev tswj qhov qhov muag tsis pom qhov tob: Ib txwm dhau los ntawm - qhov drilling tsuas yog yuav tsum tau "drilling los ntawm substrate", thaum lub qhov muag tsis pom qhov yuav tsum tau nruj tswj ntawm qhov tob drilling. Ntawm qhov tod tes, qhov "thaws nyhuv" ntawm siab -kev sib hloov ceev ntawm rab koob drilling tuaj yeem ua rau qhov sib txawv ntawm qhov tob, tshwj xeeb tshaj yog thaum cov khoom siv substrate siab - cov khoom siv zaus, cov khoom siv tsis tshua muaj zog yuav ua rau muaj kev vibration ntawm rab koob drilling; Ntawm qhov tod tes, qhov tsis sib xws ntawm ntau- txheej txheej substrates tuaj yeem ua rau muaj qhov sib txawv ntawm qhov tseeb qhov tob tob thiab qhov theoretical qhov tob, uas tuaj yeem nkag mus ncaj qha rau sab hauv Circuit Court thiab ua rau cov qauv sab hauv ntawm lub substrate.
Qhov nyuaj hauv kev ua kom "secondary drilling" ntawm faus qhov: Kev ua cov faus qhov feem ntau yog siv cov txheej txheem ntawm "drilling lub puab txheej ntawm faus qhov ua ntej, ces laminating, thiab thaum kawg drilling txheej txheej ntawm qhov muag tsis pom qhov", ntawm cov uas "aligning lub puab txheej ntawm faus qhov nrog rau txheej txheej ntawm qhov muag tsis pom qhov tseem ceeb". Vim lub thermal shrinkage ntawm lub substrate thaum lub sij hawm lamination txheej txheem, yog hais tias muaj ib tug deviation ntawm lub positioning siv ntawm lub puab faus qhov thiab cov ntaub ntawv ntawm lub qhov muag qhov muag qhov, nws yog heev yuav ua rau "qhov misalignment". Thaum qhov kev hloov pauv ntau tshaj qhov tsim nyog, thaj chaw sib tshooj ntawm lub qhov muag tsis pom sab nraud thiab lub qhov faus sab hauv yuav raug txo kom tsawg, ua rau tsis zoo tam sim no kis tau tus mob thiab txawm tias qhib Circuit Court.
Qhov teeb meem ntawm "drill pin poob" nyob rau hauv micro dig muag qhov ua: Nrog rau qhov nce ntawm pcb board ntom, daim ntawv thov ntawm micro dig muag qhov yog nce zuj zus. Txawm li cas los xij, qhov rigidity ntawm micro laum pins yog qhov tsis zoo, thiab "tus pin breakage" lossis "hnav" yog qhov tshwm sim thaum lub sijhawm ua haujlwm. Ntawm qhov tod tes, qhov "ntev mus rau txoj kab uas hla" ntawm micro laum koob feem ntau yog loj, thiab lawv nquag "khoov deformation" thaum lub sij hawm siab - kev sib hloov ceev, uas ua rau ntau dhau roughness ntawm lub qhov phab ntsa; Ntawm qhov tod tes, qhov txiav ntawm micro laum koob hnav tawm sai sai thiab yuav tsum tau hloov ntau zaus, uas tsis yog tsuas yog nce nqi xwb tab sis kuj yuav ua rau cov seem "drilling slag" nyob rau hauv qab ntawm lub qhov vim "tsis ua hauj lwm los hloov cov tho tho koob hauv lub sijhawm", cuam tshuam rau qhov zoo ntawm cov txheej tom ntej.
(2) Txheej txheej txheej:
Qhov "tsis nkag mus" ntawm qhov muag tsis pom qhov faus ua rau "qhov nyuaj ntawm kev sib pauv hloov" thaum lub sij hawm txheej txheej txheej, thiab nws yog "tsis muaj tooj liab rau ntawm phab ntsa ntawm lub qhov" los yog "tsis sib xws txheej thickness". Cov teeb meem tseem ceeb yog tshwm sim hauv:
Qhov teeb meem ntawm "cov npuas seem" nyob rau hauv qab ntawm qhov muag tsis pom qhov: Tshuaj tooj liab deposition yog cov txheej txheem tseem ceeb rau kev ua tiav conductivity ntawm lub qhov phab ntsa. Lub substrate yuav tsum tau immersed nyob rau hauv ib tug tooj liab deposition tov kom tso ib tug nyias txheej ntawm tooj liab rau ntawm qhov chaw ntawm lub qhov phab ntsa. Txawm li cas los xij, qhov "kaw kawg" ntawm qhov muag qhov muag tsis yooj yim rau cov huab cua seem, tsim " npuas" uas tiv thaiv thaj chaw los ntawm kev sib cuag nrog cov tshuaj tooj liab, thaum kawg ua rau "tsis muaj tooj liab nyob hauv qab ntawm lub qhov". Tshwj xeeb tshaj yog thaum txoj kab uas hla thiab qhov tob ntawm qhov muag tsis pom qhov me me thiab tob dua, nws nyuaj dua rau cov npuas kom tshem tawm. Yog tias tsis ua raws sijhawm raws sijhawm, nws yuav ncaj qha mus rau qhov qhib Circuit Court.
Qhov nyuaj ntawm kev hloov kho cov tshuaj nyob rau hauv lub qhov faus: Lub qhov faus yog nyob rau hauv lub substrate, thiab tom qab lamination, muaj kev pheej hmoo siab ntawm residual "semi cured film residue" los yog "drilling slag" hauv lub qhov. Yog tias qhov kev kho ua ntej - kho tsis zoo, nws yuav cuam tshuam rau qhov adhesion ntawm txheej. Nyob rau tib lub sijhawm, thaum lub sijhawm txheej txheem ntawm electroplating tooj liab, cov electrolyte hauv lub qhov faus tau maj mam, ua rau qis qis ntawm cov tooj liab ions hauv lub qhov dua li ntawm cov phaj saum npoo, thaum kawg tsim qhov tshwm sim ntawm "nyias txheej ntawm lub qhov phab ntsa thiab tuab txheej ntawm lub phaj saum npoo", uas tsis tuaj yeem ua tau raws li qhov yuav tsum tau nqa tam sim no thiab yog nquag siv thiab kub hnyiab. 3.
Qhov teeb meem ntawm "txhim kho cov kauj ruam" hauv micro qhov muag tsis pom qhov: Qhov sib txuas ntawm "qhov qhib" thiab "phaj nto" ntawm micro dig muag qhov yog qhov ua rau "txhim kho cov kauj ruam" - vim qhov ceev dua tam sim no ntawm ntug ntawm lub qhov qhib piv rau lub qhov phab ntsa, "ntug txheej tsub zuj zuj" yuav tshwm sim thaum lub sij hawm electroplating ntawm ntau qhov siab, uas ua rau muaj qhov siab ntawm qhov siab. Cov kauj ruam no tsis tsuas yog cuam tshuam rau txheej txheej tom ntej ntawm lub npog ntsej muag, tab sis kuj tseem tuaj yeem ua rau tsis sib xws thaum lub sij hawm tom ntej soldering, ua rau lub ntsej muag virtual.
(3) Laminated txheej txheem:
Shrinkage ntawm lamination ua rau "qhov hloov chaw": Thaum lub sij hawm lamination txheej txheem, lub substrate yuav tsum tau khaws cia nyob rau hauv ib tug kub thiab siab kub ib puag ncig rau ib lub sij hawm ntawm lub sij hawm, thiab epoxy resin semi cured ntawv yuav undergo "ntws" thiab "kho shrinkage". Yog hais tias cov khoom ntawm lub puab substrate tsis sib xws tus nqi shrinkage ntawm daim ntawv semi-kho, nws yuav ua rau lub laminated substrate rau warp, uas ua rau kev hloov ntawm cov faus qhov. Thaum lub substrate warpage tshaj tus qauv ntau, qhov sib txawv ntawm qhov sib txawv ntawm qhov faus thiab cov qhov muag tsis pom sab nraud yuav ncaj qha tshaj qhov kev lag luam yuav tsum tau ua, cuam tshuam rau kev ua haujlwm hauv Circuit Court.
Qhov teeb meem ntawm "glue flow blockage" nyob rau hauv faus qhov: Semi kho cov yeeb yaj kiab yuav tsim "cov kua nplaum ntws" thaum lub sij hawm lamination, thiab yog tias cov kua nplaum ntws ntau dhau lawm, nws yuav ua rau lub qhov faus rau ntawm cov khoom thaiv; Yog hais tias tus nqi ntawm cov nplaum ntws tsawg dhau lawm, nws yuav tsis tuaj yeem sau qhov khoob ntawm sab hauv substrates, ua rau tsis txaus interlayer bonding. Thaum lub qhov faus yog thaiv rau qee yam los ntawm cov resin, tooj liab tsis tuaj yeem sau lub qhov thaum lub sij hawm tom qab electroplating, ua rau conductivity tsis ua hauj lwm.
Nyuaj hauv kev tswj cov "thickness uniformity" ntawm ntau- txheej substrates: Qhov muag tsis pom kev faus qhov pcb boards feem ntau yog ntau- txheej txheej, thiab thaum lub sij hawm lamination, nws yog ib qho tsim nyog los xyuas kom meej tias lub thickness sib txawv ntawm txhua txheej yog nyob rau hauv ib tug tsim nyog ntau yam. Tab sis yog tias qhov sib txawv ntawm qhov sib txawv ntawm cov ntawv ci tooj liab sab hauv thiab qhov kev txiav txim siab ntawm cov nplooj ntawv ib nrab kho tsis tsim nyog, nws yuav ua rau "lub zos tuab tuab heev" los yog "nyias dhau" ntawm laminated substrate. Piv txwv li, yog tias muaj ntau ntau stacking ntawm semi-kho zaj duab xis nyob rau hauv ib cheeb tsam, lub thickness yuav deviate los ntawm cov txheej txheem, thiab tus nqi pub ntawm drilling koob yuav tsum tau kho thaum lub sij hawm tom ntej drilling, uas yuav yooj yim ua rau dig muag qhov tob tshaj tus qauv.
Txoj kev daws teeb meem nyuaj
Hauv kev teb rau cov teeb meem saum toj no, kev lag luam tau tsim cov txheej txheem kev daws teeb meem, nyob ib puag ncig "precision tswj" thiab "kev txhim kho kev ua tau zoo":
Drilling txheej txheem: Kev siv cov cuab yeej sib xyaw ntawm "laser drilling + mechanical drilling" - laser drilling tuaj yeem ua tiav qhov kev ua tiav ntawm micro dig muag qhov, nrog qhov sib txawv ntawm qhov tob tswj nyob rau hauv ib qho me me thiab tsis muaj qhov drilling koob hnav teeb meem; Tshuab drilling yog siv rau txoj kab uas hla loj faus qhov, ua ke nrog "CCD qhov pom qhov system", uas tuaj yeem ua tau tiag tiag - lub sijhawm kho lub qhov qhov sib txawv tom qab lamination, zoo heev txhim kho qhov kev sib raug zoo.
Txheej txheej: Qhia txog "mem tes electroplating" thev naus laus zis, los ntawm kev hloov kho qhov ceev tam sim no, txhawb kev ntws ntawm electrolyte hauv qhov faus, ua kom zoo dua qub ntawm txheej txheej ntawm lub qhov phab ntsa; Hauv kev teb rau qhov teeb meem ntawm qhov muag tsis pom qhov npuas, cov khoom siv "nqus tshuaj tooj liab deposition" yog siv los tso cov npuas hauv lub qhov nyob rau hauv qhov tsis zoo ntawm ib puag ncig, txhim kho cov kev pab cuam ntawm tooj liab deposition.
Txheej txheej txheej: Tsim "tsawg shrinkage semi-kho zaj duab xis", ua ke nrog "theem-los ntawm- txheej txheem laminating", los tswj substrate warpage ntawm qib qis heev; Nyob rau tib lub sijhawm, "flow rate simulation software" yog siv los xam cov nqi ntws ntawm cov ntawv kho ib nrab ua ntej kom tsis txhob muaj qhov thaiv ntawm qhov faus.