Multilayer Flexibre Printred Circuit Coffic Camfaces (FPCS) tau siv dav hauv ntau yam khoom siv hluav taws xob vim lawv cov txheej txheem sib cuam tshuam, thiab lawv cov txheej txheem cuam tshuam, thiab lawv cov txheej txheem sib txuam tau ua qhov tseem ceeb ntawm kev lag luam kev lag luam. With the rapid development of technology, the demand for multi-layer FPC in cutting-edge fields such as 5G communication, foldable screen smartphones, wearable devices, and automotive electronics is increasing, and the requirements for interlayer interconnection processes are becoming increasingly stringent.
Tus interlayer interconnection cuam tshuam ntawm ntau {{0} txheej txheej FPC thawj zaug yuav tsum tau txiav txim siab xaiv cov khoom xaiv. Tshiab hom ntawm substrates thiab cov nplaum txuas ntxiv tawm, txhua tus nrog nws tus kheej cov yam ntxwv ntawm tshav kub tiv thaiv, noo noo tsis kam, thiab lub zog ua haujlwm. Piv txwv li, qee qhov siab- Kev Ua Yeeb Yam Polyimide cov yeeb yaj kiab tuaj yeem tsis tsuas yog tswj cov teeb meem kub thiab txhim kho kev cuam tshuam kev ntseeg tau. Lub caij no, kev xaiv ntawm cov nplaum kuj tseem ceeb heev, txhawm rau ua kom ruaj khov ntawm interlayer tsev thaum tsis txhob muaj kev puas tsuaj rau lub sijhawm kho tus txheej txheem.
Cov txheej txheem sib thooj yog lwm qhov tseem ceeb hauv kev sib txuas ntawm ntau txheej ntawm FPC. Nrog rau kev txhim kho cov khoom siv hluav taws xob ntawm miniaturization thiab kev sib koom ua ke, qhov loj ntawm FPC tseem yuav ua rau cov kab ke sib txuas lus tau mus txog qhov ntsuas qib. Cov cuab yeej ua ntej, xws li high- precision alignment systems raws cov qhab nia ntawm txhua txheej ntawm FPC, ua tiav cov kev ua tiav. Nyob rau tib lub sijhawm, nws yog ib qho tsim nyog los txiav txim siab txog qhov cuam tshuam ntawm lwm qhov kub thiab av noo hauv cov txheej txheem ntau lawm thiab ua raws li kev ntsuas them nqi.
Tus txheej txheem lamination yog qhov txuas tseem ceeb hauv kev tsim khoom ntawm ntau {{txheej} txheej txheej FPC. Thaum lub sij hawm lamination txheej txheem, kev tswj hwm kev ua kom muaj kev kub siab, thiab lub sijhawm thiab lub sijhawm ncaj qha cuam tshuam qhov zoo ntawm intercatect interconnection.
Drilling thiab los ntawm - lub qhov sib xyaw ua ke cov txheej txheem ntawm interconnection intconnection hauv multi}} txheej FPC. Nrog rau kev nce ntawm kab ntom, micro aperture drilling thev naus laus zis tau dhau los ua cov kev tshawb nrhiav hotspot. Siab precision laser drilling cov khoom tuaj yeem ua tiav cov khoom siv micro nrog lub cheeb tsam tsuas yog ob peb txoj kev thov rau kev sib txuas lus siab. Qhov dhau los ntawm - lub qhov txheej txheem plating uas lub tooj liab txheej ntawm lub qhov ntsa yog qhov sib txuas zoo thiab ntom kom paub meej qhov kev sib txuas hluav taws xob zoo. Kev ua haujlwm ua kom zoo dua ntawm cov txheej txheem electroplating tshiab thiab tshuaj txhuam cov txheej txheem tau txhim kho qhov zoo thiab kev ntseeg tau ntawm cov txheej txheem.
Nyob rau hauv mult - txheej FPC interconnection Interconpection Interconpection kev txhim kho, kev kho tshuab deg tsis tuaj yeem tsis quav ntsej. Nrog rau kev siv nce ntxiv rau kev tiv thaiv ib puag ncig, cov txheej txheem kev kho vaj tse ib txwm muaj rau cov tshuaj phem xws li cov hmoov txhuas thiab chromium tau maj mam raug muab ntsuas. Cov txheej txheem ib puag ncig ib puag ncig kev kho mob ib puag ncig, xws li cov txhuas-}}} imm} surface surface} requir free} requir and} but and, tsis tuaj yeem txo cov pa phem ib puag ncig thiab ua tau raws li lub sijhawm.