Hauv kev tsim cov txheej txheem ntawm pcb, hardness ntawm cov ntaub ntawv yog ib qho yooj yim overlooked tab sis tseem ceeb heev. Los ntawm substrate mus rau cov ntawv ci tooj liab, thiab tom qab ntawd mus rau ntau yam khoom siv, cov yam ntxwv sib txawv ntawm qhov sib txawv yuav muaj kev cuam tshuam ncaj qha rau ntau yam txheej txheem txuas los ntawm kev ua ntej -kev ua ntej mus rau kev sib sau, uas cuam tshuam rau qhov zoo thiab kev ua haujlwm ntawm cov khoom kawg. Tshwj xeeb tshaj yog nyob rau hauv kev tsim khoom ntawm high-kawg cov khoom xws li multi- txheej hybrid boards, siab - zaus siab- ceev boards, HDI luam Circuit Court board, thiab lwm yam., kev tswj ntawm cov khoom hardness yog tus yuam sij rau kev ua tiav precision machining.
Compatibility ntawm substrate hardness thiab pre{0}}processing
Raws li cov cab kuj tseem ceeb ntawm pcb, lub hardness ntawm lub substrate ncaj qha cuam tshuam rau kev ua tau zoo thiab kev ua haujlwm ntawm cov txheej txheem ua ntej xws li txiav thiab polishing. Lub substrate nrog cov hardness nruab nrab tuaj yeem tswj tau qhov tsis tu ncua ntawm cov npoo thaum lub sij hawm txiav, txo qhov tshwm sim ntawm burrs thiab fragmentation, tsis tsuas yog txo qhov nyuaj ntawm kev ua haujlwm tom ntej, tab sis kuj muab lub hauv paus tiaj tus rau cov txheej txheem txuas ntxiv tom ntej.
Yog tias lub substrate nyuaj dhau, nws yuav ua rau kom hnav cov cuab yeej txiav, txo cov kev ua haujlwm, thiab tseem tuaj yeem ua rau cov kab nrib pleb me me hauv cov substrate vim kev txiav ntau dhau, cuam tshuam rau tag nrho cov qauv ntawm lub zog ntawm pcb. Txawm li cas los xij, yog tias lub substrate yog mos heev, nws yooj yim rau deform thaum lub sij hawm ua, ua rau nws nyuaj los xyuas kom meej qhov tseeb ntawm txiav qhov ntev, uas nyob rau hauv lem cuam tshuam rau interlayer alignment raug raug thaum lub sij hawm multi- txheej board lamination. Rau ntau- txheej txheej boards, kev ruaj ntseg ntawm substrate hardness yog ib qho tseem ceeb tshwj xeeb, vim nws xyuas kom meej tias txhua txheej ntawm substrate tuav ib tug zoo sib xws thaum lub sij hawm ua, nteg ib tug zoo lub hauv paus rau tom ntej interlayer bonding.
Lub luag haujlwm tseem ceeb ntawm tooj liab foil hardness hauv Circuit Court txoj kev
Copper foil, raws li cov khoom tseem ceeb ntawm pcb conductive kab, plays lub luag haujlwm tseem ceeb hauv cov yam ntxwv hardness ntawm etching, lamination thiab lwm yam txheej txheem. Lub hardness ntawm tooj liab ntawv yuav tsum tau sib xws nrog cov txheej txheem etching kom paub meej thiab meej cov npoo ntawm lub voj voog.
Cov ntawv ci tooj liab nrog qhov tsim nyog hardness tuaj yeem sib npaug los ntawm cov tshuaj etching thaum lub sij hawm etching, tsim cov kab du thiab zoo nkauj npoo ntawm cov qauv hauv Circuit Court. Qhov no yog qhov yuav tsum tau ua ua ntej txhawm rau ua kom ntseeg tau qhov kev ua tau zoo thiab kev rwb thaiv tsev ntawm cov khoom nrog siab - ntom thiab nyias kab nta xws li HDI luam tawm Circuit Board. Yog tias cov ntawv ci tooj liab nyuaj dhau, qhov tsis sib xws etching tuaj yeem tshwm sim thaum lub sij hawm etching, uas ua rau muaj qhov tsis xws luag ntawm cov npoo ntawm lub voj voog; Yog tias cov ntawv ci tooj liab yog mos heev, nws yuav wrinkle vim qhov kev ntxhov siab tsis sib xws thaum lub sij hawm nias, cuam tshuam rau kev ncaj ncees ntawm Circuit Court. Nyob rau hauv siab - zaus siab- ceev boards, kev ruaj ntseg ntawm tooj liab ntawv tawv hardness kuj muaj feem xyuam rau qhov sib xws ntawm cov teeb liab kis tau tus mob, txo cov teeb liab poob los ntawm cov duab hluav taws xob tsis zoo.
Hardness ntawm auxiliary cov ntaub ntawv thiab txheej txheem synergy
Ntxiv rau ntau yam khoom siv pabcuam siv hauv substrate thiab tooj liab ntawv ci pcb kev tsim khoom, xws li cov nplaum, solder resist, thiab lwm yam, lawv cov yam ntxwv hardness kuj muaj feem cuam tshuam rau cov txheej txheem cuam tshuam. Lub hardness ntawm cov nplaum yuav tsum tau sib phim nrog lub hardness ntawm lub substrate thiab tooj liab ntawv ci thiaj li ua tau zoo bonding nyhuv thaum lub sij hawm lamination txheej txheem, xyuas kom meej interlayer bonding, thiab tsis txhob delamination, uas yog ib qho tseem ceeb rau cov qauv stability ntawm high multi- txheej hybrid laminates.
Lub hardness ntawm solder resist yog txuam nrog kev tiv thaiv kev ua tau zoo ntawm pcb nto. Lub solder tiv nrog lub zog me ntsis tuaj yeem tiv thaiv kev sib txhuam sab nraud thiab kev sib tsoo thaum lub sij hawm sib dhos thiab siv tom ntej, thaum tseem tuav lub meej meej ntawm cov qauv thaum luam ntawv, ua rau nws tsis tshua muaj tev tawm vim khawb. Yog hais tias lub solder tiv taus nyuaj heev, nws yuav tawg nyob rau hauv dabtsi yog khoov los yog vibration ib puag ncig; Yog hais tias nws yog mos heev, nws yog ib qho yooj yim mus stain thiab cuam tshuam cov tsos thiab rwb thaiv tsev kev ua tau zoo ntawm pcb.