Rogers siab- lub rooj tsav xwm zaus yog lub npe hu ua "siab nplua nuj zoo nraug" hauv kev lag luam PCB - boards ntawm tib qhov loj yog luv nqi 5 txog 25 npaug siab dua li niaj zaus FR-4. Qhov no tsis yog tsuas yog "hom hwm hwm", tab sis qhov tshwm sim ntawm ntau tus nqi xws li cov khoom siv, txheej txheem, khoom siv, tawm los, thiab kev sim.
Rogers siab-frequency board tsis yog ib qho yooj yim ua ke ntawm epoxy resin thiab iav ntaub, tab sis ib tug tshwj xeeb formula system:
PTFE (polytetrafluoroethylene) substrate (RO3000 series, RT / duroid series):
Tus nqi ntawm PTFE ntshiab resin raw cov ntaub ntawv yog hais txog 200-350 yuan / kg, uas yog ob peb zaug ntau dua li ntawm epoxy resin.
Cov tshuaj inertness tsis tshua muaj zog, lub npe hu ua "yas huab tais", tab sis kev ua haujlwm nyuaj kuj yog siab heev.
Df (poob qhov tseem ceeb) tuaj yeem qis li 0.0009 (ntawm 10GHz), uas yog ib qho ntawm cov qib qis tshaj hauv kev lag luam
Carbon hydrogen resin + ceramic filling (RO4000 series, xws li RO4350B):
Ceramic fillers txiav txim siab qhov dielectric tas li - txhuas oxide (Al ₂ O3), txhuas nitride (AlN), strontium titanate, thiab lwm yam
Qhov siab dua qhov sib piv ntawm ceramic filling, qhov ruaj khov dua Dk, tab sis qhov kev ua haujlwm nyuaj thiab kim dua
Piv rau PTFE ntshiab, nws muaj kev ua tau zoo dua thiab tuaj yeem siv cov txheej txheem zoo ib yam li FR-4, nrog rau cov nqi zoo
Core technical barriers: dielectric tsis tu ncua kam rau ua nyob rau hauv ± 0.05 (RO4000 series), PTFE series txawm ± 0.02. Qhov no txhais tau hais tias cov khoom siv mis, sib tov sib xyaw, thiab cov txheej txheem sintering yuav tsum tau ua kom tag nrho, thiab ib qho kev sib txawv me ntsis yuav ua rau tag nrho cov khoom pov tseg.
Cov txheej txheem txheej txheem ntawm FR zoo tib yam -4 yog txav mus rau lub rooj tsavxwm siab, thiab yuav luag txhua kauj ruam yuav tsum tau hloov kho thiab hloov kho:
1. Drilling: Laum khoom yog cov khoom siv
Ordinary FR-4: Ordinary hard alloy laum ntsis yog txaus, nrog tus nqi qis
High zaus board (xws li ceramic filling): Ceramic hais muaj siab hardness, thiab zoo tib yam laum khoom hnav sai heev
Pob zeb diamond coated laum khoom yuav tsum tau siv, thiab tus nqi ib ntsis yog ob peb zaug siab dua li cov laum zoo tib yam
Kev sib hloov ceev ntawm 30000 ~ 40000 rpm, pub tus nqi ntawm 5 ~ 8mm / min (ib txwm FR-4 pub sai)
Drilling nqi nce 20% mus rau 100%
PTFE substrate: Cov khoom yog mos thiab muaj zog toughness. Drilling yog nquag burrs, thiab qhov roughness ntawm lub qhov phab ntsa yuav tsum yog Ra Less tshaj los yog sib npaug rau 1.5 μ m
Aluminium npog phaj yuav tsum tau siv los tiv thaiv overheating thiab cua txias kom tsis txhob siab -kub deformation
Lub roughness ntawm lub qhov phab ntsa yog tswj ntawm Ra Less tshaj los yog sib npaug rau 1.2 μ m, thiab lub aperture kam rau ua yog ± 0.01 hli
2. Qhov metallization (tooj liab deposition): ib qho ntxiv "ua kom" barrier
PTFE cov khoom muaj zog heev inertness, thiab cov pa tooj liab deposition txheej txheem txheej tsis tuaj yeem lo ntawm tag nrho - tev txheej ntawm lub qhov phab ntsa yog ib qho ntawm cov laj thawj tseem ceeb rau siab - zaus board seem.
Kev daws:
Kev kho mob ntshav plasma: siv plasma los tsoo lub phab ntsa pore, roughening saum npoo thiab nce kev ua si.
Cov khoom siv plasma tshwj xeeb yuav tsum tau ua, nrog rau ib qho khoom siv txij li kaum tawm txhiab mus rau lab
Ua kom lub sijhawm txheej txheem los ntawm 2-4 teev nce tus nqi los ntawm 30% mus rau 60%
Sodium naphthalene daws kev kho mob (txheej txheem txheej txheem): Muaj zog corrosiveness, ib puag ncig siab, maj mam hloov los ntawm cov ntshav.
3. Txheej: txheej los ntawm txheej foaming cia li ob peb degrees Celsius deb
Cov resin flowability thiab coefficient ntawm thermal expansion (CTE) ntawm siab -frequency board txawv heev ntawm FR-4, thiab ncaj qha siv cov compression tsis zoo ib yam yuav inevitably ntsib teeb meem:
Tag nrho cov khoom siv ntau zaus board: compression nqi nce 40% ~ 80%
High zaus + FR-4 hybrid stacking (sib xyaw compression): tus nqi nce ntawm 60% ~ 120%
Cov ntaub ntawv sib txawv muaj qhov sib txawv tseem ceeb hauv CTE, asynchronous thermal expansion thiab contraction, thiab siab sab hauv
Ib segmented gradient cua sov thiab pressurization tswvyim yuav tsum tau saws, thiab qhov kub thiab txias nkhaus yuav tsum tau kho tshwj xeeb.
Siv RO4350B ua piv txwv: lub laminating kub yog 185 ± 5 degree, lub siab yog 35 ± 5kg / cm ², thiab lub sij hawm rwb thaiv tsev yog 90 ± 10s. Yog tias qhov ntsuas kub thiab siab tswj tsis tau meej, cov teeb meem xws li kev sib txuas tsis txaus, txheej txheej foaming, tsis sib npaug ntawm cov txheej nruab nrab, thiab board warping yuav tshwm sim.