Core parameter sib piv cov rooj
| chaw ua uas tsis tau haus | Cov lus qhia tshwj xeeb ntawm cov khoom no | Kev Lag Luam Cov Qauv Kev Lag Luam Qhov tseem ceeb | Qhov zoo heev |
| Tus naj npawb ntawm txheej | 32 txheej | 32 txheej | Txhawb 50- txheej ultra-complex kev tsim qauv muaj peev xwm |
| Substrate | S 1000-2 m (tg 180 Qib) | Fr -4 (tg 130-140 degree) | Cov dej kub siab kuj, cov khoom poob qis (DK =3. 2) |
| Nto Kho | Xaiv nyuaj plating (50μ "" ") | ENIG (3-5 μ ") | High wear resistance (>10, {000} xob zug thiab unplugging tsheb mus) |
| Phaj Thickness | 5. {0 hli ± 5% | Tsawg dua los yog sib npaug rau 3. 0 hli (pa ntaub tuab) | Ultra-Tick Pawg Thawj Zaug Laminion Technology |
| Qhov tsawg kawg nkaus drilling loj | {{0 {}}. 4mm (xyaum xyaum) | {{0 {0}}. 5mm (cov pa roj multilayer board) | Laser micro-qhov tuaj yeem nthuav dav rau 0. 075 hli |
| Sab Hauv Kab Txhawj | 0. 17mm | 0. 20mm | 3μm laser imaging qhov tseeb |
| Kev ua warpage | Tsawg dua los yog sib npaug rau 0. 3% | IPc txheem tsawg dua los yog sib npaug rau 0. 75% | Symmetricys symmetricy + Kev ntxhov siab sib npaug |
| Resin ntsaws cov txheej txheem | TSIS MUAJ VOID FILLT | Cov pa txhaws (tsis muaj peev xwm tsawg dua lossis muaj sib npaug rau 5%) | Txhim kho cov teeb tsa kev ncaj ncees siab |
Siab ntseeg tau tsim
Kev Tshaj Tawm Kev Nyab Xeeb: Txhawb 40GPPS Kev Ntsuas Hluav Taws Xob Kev Ntsuas Hluav Taws Xob Kub, Kev Kho Mob Tswj ± 5% 5
Kev Tswj thermal: {{-55 degree ~ {{}}}}}}}} degree ntsuas kub (passed 1000 thermal kuaj)
Mechanical Zog: 5. {{{Mm th phaj tuab bists zog dua los yog sib luag rau 200mpa (30% siab dua li kev lag luam nruab nrab)
Advanced tsim cov txheej txheem
Kev Tswj Lamination: Txais Symmetrical Progined Qauv ({}} txheej teeb tsom iav symmetry) kom txo thermal ntxhov siab8
Drilling Txhim Kho: Nruab nrog tungsten steel laum + Aluminium lub hau}. 4 hli lub hau hluav taws xob tsawg dua los yog sib npaug rau 25μm2
Anti-Warping Technology: 150 Degree Baking phaj rau 8 teev ua ntej tsis muaj + kev ntxhov siab tso cov txheej txheem tom qab nias tus nqi, ua raws li tus nqi 99.8% 8
Cov ntawv pov thawj zoo
AS9100D (AERPARACACE), ITAF 16949 (Automotive), ISO 13485 (Kho Mob) Lees Meem
100% AOI kuaj + Flying sojntsuam kuaj, puas tus nqi tsawg dua lossis sib npaug nrog 50ppm
Raug Daim Ntawv Teev Lus
| tshav pob | Cov Khoom Siv Thov | Kev Kawm Ua Tau |
| Ib tug tub rog | Satellite Kev Sib Txuas Lus RF Module | Tsawg poob substrate + ultra-tsawg warpage |
| Cov ntaub ntawv chaw | 100g oftware muab cab kuj | 40GPPS Kev piav qhia kev ncaj ncees |
| Kev Tswj Xyuas | Multi-Core Processor Backplane | {{0 {}} txheej high-density interconnection |
| TSEV LOJ | Hauv tsheb sau motoller motherboard | IACHF 16949 Ua Raws |
Kev Txhawb Nqa:
Dawb DFM tsom xam (suav nrog kev ua kom muaj kev txwv thiab simulation)
24-} teev ntau dua cov lus teb engineering) (Suav / lus Askiv / Japan)
Cim npe nrov: Nchuav ua 32- txheej HDI, Tuam Tshoj Tuam Tshoj, Chaw Tsim Khoom, Chaw Tsim Tshuaj, Khoom Siv, Qis Qis, Cov Khoom Siv Qiv, Zoo, Hais
