The wiring density of circuit boards has become a key bottleneck that restricts performance. Lub 0.15mm mechanical dig muag faus qhov phaj, nrog nws cov aperture me me, ua kom muaj txiaj ntsig interlayer kev sib txuas raws hauv ntau- txheej Circuit Court boards, daws qhov teeb meem ntawm cov tsoos los ntawm qhov nyob hauv qhov chaw thaiv thiab ua tiav cov teeb liab tsis tshua muaj.
1, Core nta:
Aperture raug thiab sib xws: 0.15mm mechanical dig muag qhov faus qhov tsis yog tsuas yog qhov me me ua, tab sis yuav tsum tau siab -precision processing nrog aperture kam rau ua tswj nyob rau hauv ± 0.01mm ntawm multi- txheej substrates. Qhov kev nruj nruj no ua kom muaj kev sib raug zoo ntawm lub qhov phab ntsa thiab cov txheej tooj liab, kom tsis txhob muaj cov teeb liab tsis ruaj khov los ntawm kev sib txawv ntawm aperture. Hauv kev tsim khoom tiag tiag, txoj kab sib txawv ntawm txhua 1000 qhov tsis tshaj 0.005mm, ua kom muaj kev ua tau zoo ib yam thaum lub sijhawm tsim khoom loj.
Qhov phab ntsa zoo: Qhov muag tsis pom kev faus qhov ua tiav los ntawm siab -CNC drilling cov cuab yeej tuaj yeem tswj qhov roughness ntawm phab ntsa hauv qab 1.5 microns, tsis muaj burrs lossis dents. Cov phab ntsa du du tuaj yeem txo qhov kev xav thiab poob thaum lub teeb liab kis tau tus mob, tshwj xeeb tshaj yog nyob rau hauv siab -frequency scenarios saum 10GHz. Piv rau qhov zoo tib yam los ntawm qhov, teeb liab attenuation tuaj yeem txo los ntawm ntau dua 30%. Nyob rau tib lub sij hawm, lub uniformity ntawm tooj liab txheej thickness ntawm lub qhov phab ntsa (deviation<5%) ensures the stability of current conduction and avoids local overheating phenomena.
Lub peev xwm tswj qhov tob: qhov tseeb qhov tob ntawm qhov qhov muag tsis pom ncaj qha cuam tshuam rau kev ntseeg tau ntawm kev sib txuas sib txuas . 0.15mm mechanical dig muag qhov faus qhov tuaj yeem ua tiav qhov tob ntawm ± 0.02mm. Piv txwv li, nyob rau hauv 6- txheej board, qhov tob ntawm qhov muag tsis pom qhov ntawm qhov chaw mus rau txheej thib ob yuav tsum tau tswj nruj me ntsis ntawm 0.2-0.24mm, uas tsis tuaj yeem nkag mus rau hauv txheej txheej hauv Circuit Court thaum ua kom muaj kev sib txuas txaus. Qhov kev tswj xyuas meej no nce qhov chaw siv ntawm ntau txheej boards ntau dua 40%.
Cov khoom siv sib xws: Txawm hais tias nws yog FR-4 epoxy substrate lossis cov khoom siv siab xws li polytetrafluoroethylene, 0.15mm mechanical dig muag qhov tshuab tuaj yeem ua tiav kev ua haujlwm ruaj khov. Los ntawm kev kho qhov ntsuas qhov ntsuas xws li qhov ceev ntawm 200000 revolutions ib feeb thiab pub tus nqi ntawm 5mm / s, nws muaj peev xwm hloov mus rau substrates ntawm cov thicknesses sib txawv, kom ntseeg tau tias cov duab zoo tagnrho tuaj yeem tau txais hauv qhov tuab ntawm 0.2-1.6mm.
2, Technological breakthrough:
Kauj ruam los ntawm kauj ruam drilling txheej txheem: Rau qhov muag tsis pom qhov faus qhov ua ntawm ntau- txheej boards, ib kauj ruam - los ntawm - cov txheej txheem ntawm "drilling ua ntej thiab ces nias" yog saws. Ua ntej, qhov muag tsis pom kev yog ua tiav ntawm ib qho - txheej txheej substrate, ua raws li kev kho cov tooj liab plating, thiab tom qab ntawd laminated nrog lwm cov txheej txheem los ua ib qho tag nrho. Tom qab ntawd, faus qhov yog ua tiav. Cov txheej txheem no tuaj yeem zam qhov kev hloov pauv los ntawm ib qho -lub sijhawm drilling, thiab qhov sib npaug ntawm qhov sib npaug tuaj yeem ncav cuag ± 0.03mm.
Kev kub siab tooj liab plating tshuab: Txhawm rau kom ntseeg tau tias qhov tuab ntawm cov txheej tooj liab ntawm phab ntsa ntawm 0.15mm lub qhov me me ua tau raws li tus qauv (feem ntau yuav tsum muaj ntau dua lossis sib npaug li 18 microns), kev siv cov txheej txheem kub siab tooj liab plating ntawm 200A / dm ². Los ntawm kev ntxiv tshwj xeeb brighteners, tooj liab ions tuaj yeem muab tso rau hauv qhov pores kom tsis txhob "dog pob txha nyhuv" (cov tooj liab ntau dhau ntawm qhov pore qhib). Qhov kev tiv thaiv ntawm tooj liab plated qhov tuaj yeem tswj tau qis dua 5 milliohms kom ua tau raws li cov kev xav tau ntawm kev sib kis tam sim no.
Laser pre positioning + mechanical drilling composite technology: Ua ntej, siv lub laser los tsim 0.05mm qhov chaw tso rau ntawm lub substrate, thiab tom qab ntawd siv cov cuab yeej laum me ntsis kom ntev raws li qhov chaw rau 0.15mm. Cov tshuab sib xyaw no tswj lub qhov sib txawv ntawm 0.015mm, tshwj xeeb tshaj yog tsim rau BGA ntim cov chaw nrog siab -pins ceev. Ntawm 100mm × 100mm substrate, qhov ntom ntom ntawm 100 qhov muag tsis pom faus qhov ib square centimeter tuaj yeem ua tiav, tsis muaj kev pheej hmoo ntawm luv luv Circuit Court ntawm lub qhov.
Kev ntsuas qhov ntsuas kub ntawm qhov ntsuas kub: Tag nrho cov qhov muag tsis pom kev faus cov paib yuav tsum tau kuaj mob khaub thuas thiab kub kub (1000 cycles) ntawm -55℃txog 125 degree, nrog rau kev ntsuas kub siab (2 teev) ntawm 121℃thiab 100% av noo. Tom qab kev sim, los ntawm kev soj ntsuam slicing, lub tev lub zog ntawm lub qhov phab ntsa thiab lub substrate yuav tsum tau khaws cia ntawm 0.8N / mm los yog saum toj no kom ntseeg tau tias kev sib raug zoo nyob rau hauv huab ib puag ncig.
3, Daim ntawv thov scenarios:
Smartphone motherboard: Hauv cov xov tooj foldable, 0.15mm mechanical dig muag faus qhov phaj tuaj yeem ua tiav ntau dua 5000 cov ntsiab lus txuas hauv qhov chaw ntawm 70mm × 100mm, txhawb ntau dua 1600 tus pin qhov hluav taws xob rau siab -kawg chips xws li Snapdragon 8Gen3.
Kev lag luam neeg hlau maub los: Lub multi axis maub los ntawm industrial robots yuav tsum tau ua ntau ntau ntawm cov cim sensor ib txhij. Qhov ntau- txheej txheej ntawm 0.15mm qhov muag tsis pom qhov faus phaj tuaj yeem npaj cov cim analog, cov teeb liab digital, thiab cov kab hluav taws xob hauv cov khaubncaws sab nraud povtseg, thiab ua tiav kev sib cais los ntawm qhov faus.
Cov cuab yeej siv kho mob ultrasound: Lub teeb liab ua lub rooj tsav xwm ntawm lub ntsuas ntsuas ultrasound yuav tsum xa 64 lub cim ultrasound rau tus tswv tsev, thiab qhov 0.15 hli qhov muag tsis pom kev tuaj yeem ua tiav kev tiv thaiv ntawm txhua lub teeb liab. Tom qab siv cov thev naus laus zis no hauv B- cov cuab yeej siv ultrasound, lub teeb liab - mus rau - suab nrov piv ntawm daim duab tau txhim kho los ntawm 15dB, thiab qhov kev kuaj pom ntawm qhov mob me me tau nce ntxiv.
Lub tsheb mounted radar module: RF pem hauv ntej- kawg ntawm millimeter yoj radar yuav tsum muaj siab - xov hlau ceev, thiab 0.15 hli qhov muag tsis pom qhov faus qhov yuav txo tau cov teeb liab txuas ntev thiab qhov poob.
Tus nqi ntawm 0.15mm mechanical dig muag faus orifice phaj nyob rau hauv nws lub peev xwm los daws cov kev xav tau ntawm cov khoom siv hluav taws xob rau "denser, thinner, thiab sai dua" nrog millimeter qib raug. Nrog rau kev txhim kho ntawm 3D ntim, Chiplet thiab lwm yam thev naus laus zis, qhov kev sib txuas me me aperture no yuav dhau los ua tus qauv teeb tsa rau siab - circuits ceev,