RF chav tsev ntawm 5G lub hauv paus chaw nres tsheb yog lub luag haujlwm rau lub luag haujlwm tseem ceeb ntawm kev xa tawm, txais, thiab nthuav tawm 5G teeb liab. Nws qhov chaw ua haujlwm yuav tsum tau tiv nrog cov kev cov nyom xws li cov teeb liab zaus kis tau tus mob, siab - lub zog cua sov, thiab cov teeb meem sab nraum zoov nyuaj (xws li kub hloov pauv, av noo hloov pauv, cuam tshuam electromagnetic). Raws li "lub teeb liab kis tau tus mob" thiab "cov khoom thauj khoom platform" ntawm RF chav tsev, kev xaiv ntawm PCB ncaj qha cuam tshuam rau lub teeb liab kev ncaj ncees, kev ua kom sov dissipation, thiab ntev - lub sij hawm cia siab ntawm RF unit. Cov hauv qab no qhia txog cov ntsiab lus xaiv tseem ceeb rau 5G hauv paus chaw nres tsheb RF chav tsev PCB los ntawm tsib qhov loj me kom ntseeg tau tias muaj kev sib raug zoo nrog cov kev xav tau ntawm kev siv.
1, Kev xaiv substrate: ua ntej kom ntseeg tau siab -frequency signal kis tau tus mob
RF chav tsev ntawm 5G lub hauv paus chaw nres tsheb yuav tsum xa ntau qhov siab ntawm - zaus cov cim qhia, thiab cov khoom hluav taws xob ntawm cov khoom siv hluav taws xob ncaj qha txiav txim siab cov teeb liab kis tau tus mob thiab ruaj khov. Thaum xaiv, tshwj xeeb yuav tsum tau them rau qhov siab - zaus adaptability ntawm substrate.
Txawm hais tias zoo tib yam FR-4 substrates muaj tus nqi qis, lawv raug kev txom nyem los ntawm cov teeb liab tseem ceeb thiab kev cuam tshuam hauv siab - zaus, ua rau nws nyuaj rau ua tau raws li cov cai ntawm 5G RF units. Qhov tseem ceeb yuav tsum tau muab rau kev xaiv cov substrates tshwj xeeb uas tsim los rau cov zaus siab. Cov substrates no tuaj yeem txo cov dielectric poob thiab dielectric tsis tu ncua kev ruaj ntseg ntawm high-frequency signals los ntawm optimizing resin muaj pes tsawg leeg thiab iav fiber ntau qauv. Tsawg dielectric poob tuaj yeem txo qhov kev siv hluav taws xob ntawm cov teeb liab thaum lub sij hawm kis tau tus mob, kom ntseeg tau tias cov teeb liab muaj zog raws li cov qauv; Qhov ruaj khov dielectric tsis tu ncua tuaj yeem zam cov teeb liab sib kis ceev hloov pauv los ntawm kev hloov pauv ib puag ncig (xws li kub nce), ua kom cov synchronization thiab raug ntawm 5G cov teeb liab.
Lub caij no, lub thermal stability ntawm lub substrate kuj yuav tsum tau ua tib zoo xav txog. Thaum lub sijhawm ua haujlwm ntawm 5G RF units, ib qho tseem ceeb ntawm cov cua sov yog tsim. Yog hais tias lub thermal expansion coefficient ntawm lub substrate yog siab dhau lawm, nws yog ib qho yooj yim rau lub rooj tsavxwm deform nyob rau hauv high kub, uas yuav ua rau cov khoom siv solder pob qij txha poob los yog luv luv circuits. Yog li ntawd, nws yog ib qho tsim nyog yuav tau xaiv lub substrate uas tsis tshua muaj thermal expansion coefficient thiab kub kub kuj zoo heev los xyuas kom meej tias lub substrate tuaj yeem tswj cov qauv kev ruaj ntseg nyob rau hauv ntev -lub sij hawm kub kub yam tsis muaj kev cuam tshuam rau kev ua haujlwm ntawm RF unit.
2, Copper thickness xaiv: haum rau ob qho kev xav tau ntawm lub zog siab thiab teeb liab kis
RF chav tsev ntawm 5G hauv paus chaw nres tsheb yuav tsum tau xa high- zaus cov cim qhia thiab nqa ib lub zog (xws li kev xa tawm tam sim no ntawm lub zog amplification modules). Kev xaiv ntawm tooj liab thickness yuav tsum sib npaug ntawm cov teeb liab kis tau tus mob zoo thiab lub peev xwm nqa tam sim no kom tsis txhob muaj kev ua haujlwm tsis zoo los ntawm qhov tsis zoo tooj liab thickness.
Los ntawm qhov kev xav ntawm cov teeb liab kis tau tus mob, cov ntawv ci tooj liab ntau dhau tuaj yeem ua rau cov tawv nqaij ua rau poob siab ntawm - zaus cov cim, cuam tshuam rau cov teeb liab kev ua haujlwm; Cov ntawv ci tooj liab nyias tuaj yeem ua rau lub teeb liab cuam tshuam los yog crosstalk vim tsis ruaj khov impedance. Kev xaiv sib txawv ntawm tooj liab tuab yog yuav tsum tau ua raws li qhov yuav tsum tau ua ntawm thaj chaw sib txawv hauv RF chav tsev - piv txwv li, xaiv qhov tsim nyog tooj liab thickness rau siab -frequency signal transmission paths kom ntseeg tau tias tsis tshua muaj teeb liab kis tau tus mob; Txoj kev tam sim no ntawm lub hwj chim amplification module yuav tsum tau ua kom haum rau hauv cov tooj liab tuab kom txhim khu lub peev xwm nqa tam sim no thiab tsis txhob muaj cov ntawv ci tooj liab overheating thiab hlawv vim tam sim no ntau dhau.
Tsis tas li ntawd, lub zog adhesion ntawm tooj liab ntawv tseem xav tau kev saib xyuas. Lub 5G xov tooj cua zaus yog raug rau kev co (xws li kev vibrations me ntsis thaum lub sij hawm ua hauj lwm ntawm lub hauv paus chaw nres tsheb cov cuab yeej) thiab kub cycling rau lub sij hawm ntev. Yog tias cov ntawv ci tooj liab tsis ruaj khov rau hauv lub substrate, nws yooj yim rau cov ntawv ci tooj liab kom tev tawm, ua rau kev tawg. Yog li ntawd, thaum xaiv, nws yog ib qho tsim nyog yuav tsum tau lees paub qhov kev ua tau zoo ntawm kev ua tau zoo ntawm cov ntawv ci tooj liab kom ntseeg tau tias nws ua tau raws li qhov yuav tsum tau muaj kev ntseeg siab rau ntev - lub sijhawm ua haujlwm ntawm 5G hauv paus chaw nres tsheb.
3, Xaiv lub npog ntsej muag: Sib npaug tiv thaiv kev tiv thaiv thiab siab - zaus hloov
Lub ntsej muag lub ntsej muag tsis yog tsuas yog xav tau los tiv thaiv PCB tooj liab ntawv ci los ntawm oxidation thiab corrosion, tab sis kuj yuav tsum tau hloov mus rau qhov siab - zaus ib puag ncig ntawm 5G RF units kom tsis txhob ua haujlwm tsis zoo ntawm daim npog ntsej muag uas cuam tshuam rau cov teeb liab kis.
Tej yam yooj yim solder tiv taus tej zaum yuav ua rau kom cov teeb liab kis tsis tau thiab txawm ua rau muaj teeb meem cuam tshuam nyob rau hauv siab - zaus scenarios vim siab dielectric tas li los yog ntau dhau dielectric poob. High zaus adaptive solder tiv thaiv yuav tsum tau xaiv, uas muaj ntau dua dielectric zog thiab substrate compatibility, yuav txo tau cov kev cuam tshuam rau siab - zaus signals, thiab xyuas kom meej ruaj khov teeb liab kis tau tus mob. Nyob rau tib lub sijhawm, qhov ntsuas kub thiab huab cua tsis kam ntawm lub npog ntsej muag yuav tsum ua kom tau raws li cov qauv -5G cov chaw nres tsheb feem ntau yog siv rau sab nraum zoov, thiab lub npog ntsej muag yuav tsum tiv thaiv cov cheeb tsam nyuaj xws li kub, tsis tshua muaj kub, av noo, thiab ultraviolet hluav taws xob kom tsis txhob tawg, tev, thiab corrosion ntawm tooj liab foil raug.
Tsis tas li ntawd, qhov flatness ntawm daim npog ntsej muag yog qhov tseem ceeb. Precision RF Cheebtsam (xws li cov ntxaij lim dej thiab cov khoom sib txuas) feem ntau yog soldered rau RF units. Yog tias qhov saum npoo ntawm lub npog ntsej muag tsis sib xws, nws yuav ua rau tsis ruaj khov ntawm cov khoom, cuam tshuam rau kev ruaj ntseg ntawm cov teeb liab sib txuas. Thaum xaiv, nws yog ib qho tsim nyog kom paub meej tias txheej txheej txheej txheej thiab cov qauv ntsuas kev sib tw ntawm cov txheej txheem vuam txheej los xyuas kom meej tias cov khoom siv vuam yuav tsum tau ua tiav.
4, Ua tib zoo saib xyuas cov cua sov dissipation tsim adaptation: pab ua kom muaj cua sov zoo
Lub zog ntom ntom ntawm RF chav nyob hauv 5G cov chaw nres tsheb yog qhov siab heev thaum lub sijhawm ua haujlwm, uas tuaj yeem tsim kom muaj cua sov ntau. Yog tias qhov kub tsis tuaj yeem ua tiav raws sijhawm, nws yuav ua rau muaj qhov kub thiab txias, cuam tshuam rau kev ua haujlwm thiab lub neej ntev. Kev xaiv ntawm PCB yuav tsum ua tib zoo xav txog qhov kev hloov pauv ntawm cov khoom siv hluav taws xob tsim hluav taws xob kom yooj yim rau kev siv hluav taws xob zoo.
Ntawm ib sab, cov txheej txheem tshwj xeeb tuaj yeem raug xaiv raws li qhov yuav tsum tau ua kom sov, xws li siv cov hlau raws PCBs (xws li txhuas lossis tooj liab substrates) hauv cov chaw tsim hluav taws xob siab (xws li hauv qab fais fab amplification modules). Cov substrates no muaj cov thermal conductivity zoo heev thiab tuaj yeem hloov cov cua sov uas tsim los ntawm cov khoom siv rau cov cua sov dissipation (xws li cov dab dej kub thiab cov kiv cua), txo qhov kub hauv zos. Yog tias cov khoom siv sib xyaw ua ke siv tag nrho, thermal conductive vias kuj tseem tuaj yeem muab ntxiv rau hauv cov chaw tsim hluav taws xob siab lossis cov txheej txheem tooj liab hauv zos tuaj yeem siv los txhim kho cov hluav taws xob muaj peev xwm.
Ntawm qhov tod tes, qhov layout adaptability ntawm PCB kuj yuav tsum tau xav txog. Thaum xaiv, nws yog ib qho tsim nyog kom paub meej tias qhov tuab thiab qhov loj ntawm PCB haum rau cov qauv hluav taws xob ntawm RF, xws li seb PCB thickness puas tuaj yeem ua tau raws li qhov yuav tsum tau ua ntawm lub dab dej kub, thiab seb puas muaj cov cua kub txaus txaus kom tsis txhob muaj kev tsis sib haum xeeb ntawm PCB tsim thiab cov qauv hluav taws xob, uas yuav cuam tshuam rau cov cua sov dissipation efficiency.
5, Ua kom pom tseeb kev ntseeg tau: xyuas kom ntev - lub sijhawm ua haujlwm ruaj khov
Lub neej kev pab cuam ntawm 5G lub hauv paus chaw nres tsheb feem ntau yog ob peb xyoos lossis ntau tshaj kaum xyoo, thiab tus nqi tu tom qab xa tawm yog siab. RF chav tsev PCB yuav tsum muaj kev ntseeg siab ntev ntev heev -. Thaum xaiv, yuav tsum tau ua tib zoo saib xyuas cov qauv kev ntseeg siab thiab cov txiaj ntsig ntawm PCB.
Ua ntej, nws yog ib qho tsim nyog kom paub tseeb tias PCB tau dhau qhov kev ntsuam xyuas ntawm ib puag ncig kev ntseeg siab, xws li kev ntsuas kub thiab av noo siab, ntsuas ntsuas kub, ntsuas kev vibration, ntsuas tshuaj ntsev, thiab lwm yam . - cov kev ntsuam xyuas no tuaj yeem simulate ib puag ncig ntawm qhov chaw nres tsheb sab nraum zoov, txheeb xyuas qhov kev ua haujlwm ruaj khov ntawm PCB nyob rau hauv ntev - lub sij hawm tsis ua hauj lwm ntawm PCB.
Qhov thib ob, kev ntsuas hluav taws xob kev ntseeg siab tsis tuaj yeem tsis quav ntsej, xws li tiv thaiv kev ntsuas hluav taws xob, kev ntsuas kev tiv thaiv hluav taws xob, kev ntsuas hluav taws xob, thiab lwm yam, kom ntseeg tau tias kev ua haujlwm hluav taws xob ntawm PCB ua tau raws li cov qauv thiab tsis muaj kev pheej hmoo xws li luv luv lossis qhib circuits. Nyob rau tib lub sijhawm, kev saib xyuas yuav tsum tau them rau cov txheej txheem kev ntseeg siab ntawm PCB, xws li interlayer bonding zog, solder joint kev ntseeg tau, thiab lwm yam, kom tsis txhob muaj teeb meem xws li interlayer peeling thiab solder joint detachment los ntawm cov txheej txheem tsis xws luag thaum lub sij hawm ntev - siv PCB.