Kev tsim khoom ntawm 6-txheej PCB yuav tsum tau cov kauj ruam xws li pawg tsim, txheej thiab hluav taws xob, drilling, drilling thiab tooj tso tawm. Cov txheej txheem tshwj xeeb yog raws li hauv qab no:
1, fawm txheej txheej txheem tsim (cov kauj ruam tseem ceeb)
Cov kev daws teeb meem (ntsuas tus nqi thiab cov txheej txheem hluav taws xob): Txheej Txheem) → Txheej Nruab Nrab → Txheej Txheej → Txheej 2 → Cov Txheej Txheem Txheej (teeb liab)
Cov txiaj ntsig zoo: Cov teeb liab teeb liab muaj ib lub dav hlau ua tiav, kev cuam tshuam nrog kev cuam tshuam tsawg, thiab haum rau feem ntau cov xwm txheej.
Cov kev cai sib tw: ua ntej siv cov txheej txheem teeb liab, ua raws li txheej saum toj / hauv qab.
Siab anti -} txheej txheem EMI (muaj zog EMI xav tau): Txheej txheem (teeb liab txheej →
Cov txiaj ntsig: Qhov rhiab teeb liab txheej yog qhwv rau hauv av dual hauv av, loj dua rau kev cuam tshuam lub suab sib cuam tshuam nrog dhau EMI kuaj.
Txheej txheej kev hloov kho kev hloov kho: nce cov spacing ntawm txheej txheem hluav taws xob thiab cov teeb liab uas nyob ib sab ntawm lwm txheej los ua kom cov impedance.
2, kev teeb tsa thiab cov xov xwm txuas ntxiv
Teeb qauv hauv paus ntsiab lus: faib raws li cov yam ntxwv hluav taws xob (xws li cov khoom siv hluav taws xob nyob ze cov tswv yim ze cov chaw nres nkoj), thiab ua kom siab} zaus / rhiab ntawm cov suab nrov. Interface khoom siv (USB, khawm, thiab lwm yam) yuav tsum tau muab tso tawm tsam ntawm ntug kev kom tau raws li ergonomic kev ua haujlwm.
Cov ntsiab lus txuas: Lub cim tseem ceeb (moos, kab sib txawv) yuav tsum tau ua ntej hauv txheej sab hauv kom tsis txhob hla lub dav hlau. Lub zog txheej txheem segentation xav tau xav txog txoj kev tam sim no kom tsis txhob muaj voj voos siab.
3, kev tsim cov txheej txheem tseem ceeb
Khoom npaj: Siv iav Fiber Epoxy Resin substrate thiab ob npaug {}} clad laminate raws li thawj zaug.
Txawv hloov chaw thiab etching: tooj - clad laminates qhuav zaj duab xis → exposed cov txheej tooj liab qhuav → tsim rau hauv cov qauv xov hlau.
Zov txheej Lamination: Ua kom haum thiab tso sab hauv cov pawg thawj coj ntawm "
DRILLING THIAB QHOV METALALLISHING: NEEG KHO TSHUAB DRILLING (los ntawm {lub qhov / Buried lub qhov / Buried Lub Qhov / Buried Lub Qhov / Buried Lub Qhov / Buried Lub Qhov / Buried Lub Qhov Ciaj Ua Kom Tau Cov Phab Ntsa Qhov Ua tiav Intercontomection.
Taus Taus Taw thiab Deg Kho Mob: Siv Daim Ntawv Qhia Txog Cov Ncaws Pob (xws li txheej kub (xws li kub kub, tshuaj tsuagin) kom tiv thaiv oxidation.
4, kev txheeb xyuas thiab kuaj
Tsis siv neeg kho qhov muag (AOI): scan kab tsis xws luag tom qab etching.
Kev soj ntsuam hluav taws xob: ntawm - tawm kev xeem, impedance tswj kev kuaj xyuas (tshwj xeeb yog siab} zaus lub teeb liab txheej).
EMI Testing: Txheeb xyuas qhov ua tau zoo ntawm cov qauv stacked (piv txwv li ob txhais tau yooj yim kom dhau).