Nyob rau hauv lub siab zaus thiab siab - teb ceev xws li 5G kev sib txuas lus, kev lag luam tswj, thiab RF modules, lub dielectric zog thiab ib puag ncig stability ntawm lub substrate ncaj qha txiav txim siab qhov tseem ceeb ntawm cov khoom. Rogers RO4350B, raws li tus paub tab siab zaus sib xyaw substrate, tau dhau los ua cov khoom siv rau nruab nrab mus rau siab kawg siab zaus luam tawm Circuit Court boards vim nws qhov ruaj khov dielectric tsis, zoo heev kub adaptability, thiab kev ua tau zoo compatibility. Hauv qab no, los ntawm kev paub txog kev ua tau zoo, kev xaiv cov laj thawj, kev siv thev naus laus zis mus rau kev ua pov thawj zoo, peb tsom mus rau kev siv cov xwm txheej thiab muab cov ntaub ntawv siv tau rau cov kws tshaj lij kev lag luam.
1, RO4350B Core Performance thiab Technical Value
RO4350B yog raws li cov khoom siv epoxy resin thiab cov iav fiber ntau cov qauv, ua tiav qhov sib npaug ntawm qhov kev ua haujlwm siab thiab kev ua tau zoo. Nws cov txiaj ntsig tseem ceeb ntawm kev ua tau zoo tuaj yeem muab faib ua peb lub ntsiab lus:
(1) ruaj khov siab zaus dielectric kev ua tau zoo
Cov khoom no nthuav tawm zoo heev dielectric qhov tsis tu ncua thiab tsis zoo nyob rau hauv feem ntau siv ntau zaus, thiab qhov dielectric tas li yog qhov cuam tshuam tsawg heev los ntawm qhov kub thiab qhov hloov zaus. Qhov no txhais tau hais tias nyob rau hauv ntau qhov ntau zaus thiab qhov kub thiab txias ib puag ncig, cov teeb liab kis tau tus mob ceev thiab cov yam ntxwv tsis zoo nyob hauv qhov chaw ruaj khov, uas tuaj yeem txo qhov attenuation thiab theem hloov ntawm cov teeb liab zaus, tshwj xeeb tshaj yog tsim rau cov xwm txheej uas yuav tsum tau nruj me ntsis rau cov teeb liab kev ncaj ncees.
(2) Muaj kev ntseeg siab nyob rau hauv qhov chaw kub kub
Lub iav hloov pauv kub ntawm RO4350B yog qhov siab, thiab nws nthuav tawm cov thermal expansion coefficient zoo tshaj qhov kev khiav hauj lwm kub ntau, nrog rau thermal compatibility zoo nrog tooj liab ntawv ci. Nyob rau hauv qhov kub thiab txias kev vibration ib puag ncig, kev ntxhov siab ntawm qhov vuam interface tuaj yeem txo qis, zam kev sib koom ua ke qaug zog thiab Circuit Court tawg. Tom qab ntau qhov kev sib tw ntawm kev ntsuas kub hnyav, qhov kev tiv thaiv kev tiv thaiv ntawm cov ntawv luam tawm Circuit Court boards siv cov txheej txheem no tseem tuaj yeem khaws cia nyob rau theem siab, nrog rau kev ua haujlwm siab dhau, ua tau raws li qhov xav tau ntawm ib puag ncig kev lag luam, tsheb hluav taws xob, thiab lwm yam.
(3) Kev ua tau zoo heev compatibility
Piv nrog rau cov ntaub ntawv siab zaus xws li cov ceramics ntshiab, RO4350B muaj lub zog siv tshuab ntau dua thiab sib haum nrog cov txheej txheem xws li drilling, etching, thiab laminating rau cov ntawv luam tawm Circuit Board, tsis tas yuav tsum tau hloov kho tshwj xeeb rau cov khoom siv uas twb muaj lawm. Nws cov yam ntxwv saum npoo yog haum rau hom tooj liab ntawv ci, thiab nws muaj qhov zoo adhesion nrog solder mask number case thiab solder, uas tuaj yeem txo cov txheej txheem poob thiab qhov hloov pauv zoo thaum lub sijhawm tsim khoom ntau.
2, RO4350B cov qauv xaiv thiab cov xwm txheej siv tau
Kev xaiv yuav tsum yog raws li cov kev xav tau ntawm kev ua haujlwm, ib puag ncig, thiab cov nqi siv nyiaj ntawm daim ntawv thov scenario, thiab qhia meej txog kev hloov pauv thiab lwm cov laj thawj ntawm RO4350B:
(1) Core xaiv qhov ntev
Qhov yuav tsum tau ua thiab poob: Thaum daim ntawv thov zaus siab thiab qhov kev xav tau ntawm dielectric poob yog nruj, RO4350B yog qhov zoo tshaj rau cov pa substrates; Tab sis nyob rau hauv tshwj xeeb scenarios nrog nruj poob yuav tsum tau, tshwj xeeb cov ntaub ntawv nrog qis dielectric poob yuav raug xam tias yog.
Environmental nruj: Nyob rau hauv dav kub los yog kev vibration ib puag ncig xws li industrial controllers thiab tsheb mounted radars, RO4350B yog nyiam; Tsawg mus rau nruab nrab zaus modules rau cov neeg siv khoom siv hluav taws xob zoo tib yam tuaj yeem siv cov khoom hloov pauv nrog cov nqi qis.
Kev ua haujlwm nyuaj: Yog tias lub rooj tsav xwm luam tawm muaj cov micropores ntom ntom, cov kab nyias, lossis ntau- txheej txheej txheej txheej, kev ua haujlwm ruaj khov ntawm RO4350B tuaj yeem txo cov kev pheej hmoo ntau lawm, tshwj xeeb tshaj yog tsim rau siab -precision RF luam ntawv Circuit Court board manufacturing.
(2) Cov xwm txheej ntawm daim ntawv thov
Hauv kev sib txuas lus: RF pem hauv ntej- kawg modules rau 5G hauv paus chaw nres tsheb, miniaturized kav hlau txais xov arrays, thiab repeater core boards;
Muaj kev tswj hwm: photovoltaic inverter txhawb cov maub los, cov ntaub ntawv ntau zaus tau txais module;
RF cov khoom siv: microwave lim, qis- suab nrov amplifiers, luam tawm Circuit Court boards rau satellite kev sib txuas lus receivers.
3, Cov ntsiab lus tseem ceeb ntawm RO4350B luam tawm Circuit Board ua tshuab
Cov txheej txheem ua tiav yuav tsum tau ua kom zoo dua qhov tsis zoo raws li cov yam ntxwv ntawm cov khoom siv, nrog rau kev tsom mus rau kev tswj cov lamination, etching, thiab cov txheej txheem kho saum npoo kom ntseeg tau cov khoom zoo.
(1) Kev tswj cov txheej txheem lamination
Kev teeb tsa Parameter: Txais yuav cov cua sov nkhaus kom tswj tau qhov cua sov, tsis txhob kub dhau, thiab teeb lub sij hawm rwb thaiv tsev kom tsim nyog; Lub laminating siab yog kho raws li lub thickness ntawm lub substrate los xyuas kom meej tias tsis muaj npuas los yog qhov khoob ntawm cov khaubncaws sab nraud povtseg, kom ntseeg tau qhov zoo ntawm lamination.
Alignment thiab pressurization: Siv siab- cov cuab yeej muab qhov tseeb los xyuas kom meej qhov sib txawv ntawm qhov sib txawv, thiab maj mam nce lub siab thaum lub sij hawm lub zog siab kom tsis txhob muaj kev sib hloov ntawm substrate los ntawm kev ntxhov siab tsis sib xws, uas yuav cuam tshuam rau kev ua haujlwm thiab siv tom qab.
(2) Etching thiab drilling txheej txheem optimization
Etching tsis: Siv ib hom tshuaj etching tsim nyog, tswj qhov kub thiab txias, kho qhov etching ceev kom tsim nyog (me ntsis qis dua li cov pa substrates), txo cov kab dav sib txawv los ntawm segmented etching, thiab xyuas kom meej tias Circuit Court raug raws li qhov yuav tsum tau ua.
Drilling txheej txheem: Xaiv qhov tsim cov tho me me, tswj kev nrawm nrawm thiab pub tus nqi; Tom qab drilling, kev kho deburring yuav tsum tau ua kom cov phab ntsa du thiab zam kom tsis txhob muaj teeb liab ntau ntxiv vim yog cov phab ntsa ntxhib.
(3) Kev kho deg thiab txheej txheem daim npog ntsej muag
Kev xaiv kev kho deg: Ua ntej siv cov txheej txheem immersion kub, uas muaj qhov chaw siab flatness thiab tuaj yeem txo cov nyhuv ntawm daim tawv nqaij poob ntawm cov teeb liab ntau zaus; Tsis txhob siv cov txheej txheem kho saum npoo uas yuav ua rau muaj teeb meem tawg.
Kev qhia tshwj xeeb rau cov txheej txheem ntawm lub npog ntsej muag: Lub ntsej muag lub ntsej muag yuav tsum tau xaiv nrog cov kev hloov pauv ntau zaus, thiab cov txheej txheej yuav tsum tau tswj. Lub npog ntsej muag lub ntsej muag saum toj kawg nkaus ntawm cov kab sib kis tau zoo yuav tsum tau ua kom zoo ib yam kom tsis txhob muaj qhov sib txawv hauv zos uas cuam tshuam rau dielectric ib puag ncig thiab cuam tshuam nrog cov teeb liab kis.
4, RO4350B Printed Circuit Board Testing and Verification Plan
Qhov kev ntsuam xyuas yuav tsum tau them rau dielectric kev ua tau zoo, impedance yam ntxwv, thiab ib puag ncig kev ntseeg tau los xyuas kom meej tias cov khoom ua tau raws li qhov yuav tsum tau thiab cov kev xav tau ntawm daim ntawv thov:
(1) Kev ntsuas kev ua haujlwm siab
Dielectric parameter pov thawj: Siv cov txheej txheem kev tshaj lij, qhov dielectric qhov tsis tu ncua thiab qhov poob yog ntsuas nyob rau hauv qhov kev khiav hauj lwm zaus los xyuas kom meej tias lawv cov kev sib txawv nyob rau hauv qhov kev pom zoo, ua kom muaj kev ruaj ntseg ntawm cov khoom siv ntau zaus.
Kev ntsuas impedance thiab teeb liab: Siv sijhawm-txoj kev xav txog kev sau npe txhawm rau txheeb xyuas qhov impedance ntawm cov kab sib kis, kom ntseeg tau tias impedance sib txawv ntawm tag nrho pawg thawj coj ua tau raws li qhov yuav tsum tau ua; Ntsuam xyuas qhov poob thiab rov poob los ntawm lub network analyzer kom ntseeg tau tias cov teeb liab kis tau zoo.
(2) Kev ntsuam xyuas ib puag ncig kev ntseeg siab
Kev ntsuas kub thiab av noo: Ua kev ntsuas kev caij tsheb kauj vab nyob rau hauv simulated hnyav kub thiab av noo, thiab xyuas qhov kev ncaj ncees thiab rwb thaiv tsev tiv thaiv ntawm cov pob qij txha tom qab kuaj xyuas kom ntseeg tau tias cov khoom lag luam nyob hauv ib puag ncig sib txawv.
Kev ntsuam xyuas kev ntseeg tau ntawm cov tshuab: Los ntawm kev siv cov kev vibration uas tsim nyog rau cov xwm txheej siv tiag tiag los ntawm cov khoom siv vibration, simulating mechanical impacts, checking structural damage and functional failure of the product, and verify nws mechanical performance.
(3) Kev tshuaj xyuas zoo
Siv cov khoom siv kho qhov muag tsis siv neeg los kuaj xyuas qhov zoo ntawm cov khoom siv hluav taws xob, kom tsis txhob muaj qhov tsis xws luag xws li tooj liab lossis cov xov hlau tawg; Los ntawm kev siv cov txheej txheem kev sim los xyuas qhov kev sib raug zoo ntawm cov khaubncaws sab nraud povtseg thiab qhov zoo ntawm metallization, xyuas kom tsis muaj voids lossis virtual soldering, thiab lav tag nrho cov txheej txheem zoo ntawm cov ntawv luam tawm Circuit Board.
5, Tej teeb meem thiab kev daws teeb meem
Thaum siv RO4350B, qee qhov teeb meem tshwm sim yuav tshwm sim uas xav tau cov kev daws teeb meem:
Kev poob siab ntau dhau: tej zaum yuav tshwm sim los ntawm kev sib txawv ntau dhau ntawm etching kab dav lossis tsis sib xws ntawm cov npog ntsej muag. Yuav tsum tau optimize etching tsis thiab tswj Circuit Court raug; Siv cov cuab yeej siv siab - txheej txheej los xyuas kom meej qhov sib xws ntawm lub npog ntsej muag thiab txo qhov poob.
Warping tom qab lamination: feem ntau tshwm sim los ntawm tsis tsim nyog lamination kub nkhaus los yog mismatched thermal expansion coefficients ntawm txhua txheej khoom. Lub sij hawm cua sov thiab lub sij hawm rwb thaiv tsev yuav tsum tau kho kom zoo dua qhov kub ntawm lub laminating nkhaus; Xaiv tib batch ntawm substrate los xyuas kom meej qhov sib xws hauv thermal expansion coefficient thiab tsis txhob warping.
Welding point cracking: feem ntau yog tshwm sim los ntawm qhov kub thiab txias los yog tsis zoo thermal txuam ntawm substrate thiab solder. Nws yog ib qho tsim nyog los txo qhov kub siab ntawm reflow soldering, xaiv solder nrog zoo thermal txuam nrog substrate, thiab txhim kho kev ntseeg siab ntawm cov pob qij txha.
Kev hloov pauv loj impedance: tej zaum yuav yog vim qhov tsis sib xws ntawm qhov nruab nrab lossis qhov cuam tshuam ntawm cov av noo ntawm qhov dielectric tas li. Yuav tsum tau ntxiv dag zog rau kev tswj ntawm laminating siab los xyuas kom meej uniform thickness ntawm nruab nrab; Ua cov dej noo- pov thawj kev kho mob ntawm cov ntawv luam tawm ua tiav, tswj cov av noo ib puag ncig, thiab txhim kho kev ua haujlwm ntawm impedance.
RO4350B muaj qhov zoo tshaj plaws nyob rau hauv nruab nrab mus rau qhov kawg siab zaus luam tawm Circuit Court board teb vim nws ruaj khov siab zaus ua haujlwm, dav kub kev ntseeg siab, thiab kev ua tau zoo. Nws daim ntawv thov yuav tsum tsim kom muaj tag nrho cov txheej txheem tswj kev xav ntawm "kev xaiv kev sim": kev sib txuam ntawm qhov kev xav tau ntawm qhov chaw nyob rau theem xaiv, kev tswj nruj ntawm cov txheej txheem tsis sib txawv hauv cov txheej txheem ua tiav, thiab kev pabcuam kev ua tau zoo thiab kev ntseeg siab nyob rau hauv qhov kev xeem kom paub tseeb tias cov khoom ua tau raws li cov kev xav tau ntawm daim ntawv thov.