Cov khoom tseem ceeb ntawm cov ntawv luam tawm Circuit Board, tooj liab, nws yooj yim rau oxidation, uas cuam tshuam rau nws cov khoom siv hluav taws xob thiab kev ua haujlwm hluav taws xob. Kev kho deg lub hom phiaj los tsim cov txheej txheem tiv thaiv ntawm tooj liab kom ntseeg tau tias nws txoj haujlwm ruaj khov. Tam sim no, cov txheej txheem xws li cua kub leveling, organic txheej, thiab electroless npib tsib xee / kub plating yog dav siv, txhua tus muaj nws tus kheej zoo, qhov tsis zoo, thiab cov xwm txheej.
Cov khoom tseem ceeb ntawm cov ntawv luam tawm Circuit Board, tooj liab, nws yooj yim rau oxidation, uas cuam tshuam rau nws cov khoom siv hluav taws xob thiab kev ua haujlwm hluav taws xob. Kev kho deg lub hom phiaj los tsim cov txheej txheem tiv thaiv ntawm tooj liab kom ntseeg tau tias nws txoj haujlwm ruaj khov. Tam sim no, cov txheej txheem xws li cua kub leveling, organic txheej, thiab electroless npib tsib xee / kub plating yog dav siv, txhua tus muaj nws tus kheej zoo, qhov tsis zoo, thiab cov xwm txheej.
1, Kub cua leveling txheej txheem
Cov cua kub theem yog ua tiav los ntawm txheej txheej ntawm lub rooj tsav xwm luam tawm nrog cov molten tin lead solder thiab siv cua sov compressed cua mus rau theem, tsim cov tshuaj tiv thaiv - oxidation thiab solderable txheej txheej. Thaum lub sij hawm tus txheej txheem, ib tug 1-2mil tuab tooj liab tin intermetallic compound yog generated. Cov txheej txheem no tau muab faib ua hom ntsug thiab kab rov tav, nrog rau tom kawg tau txais kev nyiam ntau dua vim nws cov txheej txheej tsis sib xws thiab yooj yim ntawm kev tsim khoom siv.
Cov txheej txheem muaj xws li micro etching, preheating, flux txheej, tin spraying, thiab tu. Cov txheej txheem no muaj tus nqi qis, zoo weldability, thiab paub tab technology, tab sis nws muaj teeb meem xws li tsis zoo nto flatness, yooj yim zus tau tej cov tin hlaws, thiab tsis zoo ib puag ncig tus phooj ywg. Nws yog qhov tsim nyog rau cov neeg siv khoom siv hluav taws xob thiab kev lag luam tswj kev lag luam uas yog tus nqi rhiab, muaj qhov yuav tsum tau qis rau flatness thiab zoo vuam, xws li cov tswj vaj huam sib luag hauv tsev.
2, Organic txheej txheej txheem
OSP chemically tsim cov organic zaj duab xis nyob rau saum npoo ntawm liab qab tooj liab, uas feem ntau tiv taus oxidation thiab tuaj yeem raug tshem tawm los ntawm kev sib tsoo thaum lub sij hawm vuam. Niaj hnub no, benzimidazole tau siv dav, thiab txhawm rau tiv thaiv ntau yam reflow soldering, ntau txheej txheej txheej organic yuav tsum tau tsim. Cov txheej txheem ntws npog degreasing, micro etching, acid ntxuav, ntxuav, organic txheej, thiab lwm yam kev tu, thiab cov txheej txheem tswj yog ib qho yooj yim.
OSP thev naus laus zis yog qhov yooj yim thiab tus nqi- siv tau, nrog kwv yees li 25% -30% ntawm cov ntawv luam tawm Circuit Court boards txais yuav nws thiab qhov kev faib ua feem ntau ntxiv, muaj qhov zoo ntawm cov tooj liab liab soldering. Txawm li cas los xij, nws muaj kev cuam tshuam rau cov kua qaub thiab cov av noo, ua rau cov khoom siv tsis zoo ntawm cov khoom siv rov ua dua tshiab, txwv kev cia thiab siv sijhawm, thiab qee qhov teeb meem hauv kev sim thiab sib dhos. Haum rau cov xwm txheej uas tsis tshua muaj qhov yuav tsum tau ua rau kev sib txuas ntawm qhov chaw ua haujlwm thiab lub neej cia, xws li cov ntawv luam tawm Circuit Board rau TV, cov khoom ntim ntim ntim siab, thiab lwm yam.
3, Tshuaj nickel plating / immersion kub txheej txheem
ENIG tsim cov nickel kub alloy txheej ntawm tooj liab, uas tuaj yeem tiv thaiv lub rooj tsav xwm luam tawm rau lub sijhawm ntev. Piv nrog OSP, nws cov kev ua haujlwm hluav taws xob thiab kev tiv thaiv ib puag ncig zoo dua. Nickel plating tuaj yeem tiv thaiv kev tawg ntawm kub thiab tooj liab, thiab tseem tswj tau Z- kev taw qhia nthuav dav ntawm qhov kub thiab txias, uas yog qhov zoo rau cov hlau lead- dawb soldering. Cov txheej txheem muaj xws li pickling thiab tu, micro etching, pre immersion, activation, tshuaj nickel plating, thiab tshuaj kub immersion, uas yog complex thiab nyuaj rau tswj.
Cov txheej txheem no tsis yooj yim rau oxidize, tuaj yeem khaws cia rau lub sijhawm ntev, muaj lub ntsej muag du, tsim nyog rau soldering zoo qhov sib txawv pins, tuaj yeem tiv taus ntau yam reflow soldering, thiab tuaj yeem siv los ua substrate rau COB hlau sib txuas. Txawm li cas los xij, tus nqi siab, lub zog vuam tsis muaj zog, thiab qhov cuam tshuam rau cov teeb meem dub disk ua rau ntev - lub sij hawm kev ntseeg tau questionable. Feem ntau siv nyob rau hauv cov teb uas yuav tsum tau muaj kev sib txuas ua haujlwm siab thiab lub neej ntev, xws li cov xov tooj ntawm tes khawm, thaj chaw sib txuas ntawm router, thiab lwm yam. Tam sim no, kwv yees li 10% -20% ntawm cov ntawv luam tawm Circuit Board yuav raug siv.
4, Silver sinking txheej txheem
Cov txheej txheem nyiaj tso nyiaj yog nruab nrab ntawm OSP thiab ENIG, yooj yim thiab ceev. Txawm hais tias nws tsis tuaj yeem tsim cov txheej tiv thaiv tuab, nws tuaj yeem tswj tau cov hluav taws xob zoo thiab kev sib txuas. Txawm li cas los xij, qhov saum npoo yuav plam luster thiab lub cev lub zog tsis zoo. Nws tsim ib qib submicron ntshiab nyiaj txheej txheej los ntawm kev hloov pauv cov tshuaj tiv thaiv, qee zaum ntxiv cov organic tebchaw los tiv thaiv nyiaj corrosion thiab tsiv teb tsaws.
Cov txheej txheem nyiaj tso nyiaj yog qhov yooj yim, nrog cov khoom siv hluav taws xob zoo thiab kev sib txuas, thiab muaj peev xwm khaws cia zoo, tab sis nws tsis haum rau cov xwm txheej uas yuav tsum tau muaj zog txhua yam. Nws yog feem ntau siv nyob rau hauv cov teb uas yuav tsum tau muaj hluav taws xob kev ua tau zoo thiab weldability thiab yog tus nqi rhiab, xws li qee cov khoom siv hluav taws xob thiab cov khoom siv sib txuas lus.
5, Tin deposition txheej txheem
Vim lub fact tias solder feem ntau raws li tin, theoretical prospects ntawm tin deposition technology yog dav. Vim muaj kev txwv ntawm tin whiskers thiab tin migration, tom qab ntawd nws tau daws los ntawm kev ntxiv cov organic additives los muab cov thermal stability thiab weldability, tsim cov tooj liab tin intermetallic tebchaw, zam qhov flatness teeb meem ntawm huab cua kub leveling, thiab tsis muaj hlau diffusion teeb meem. Txawm li cas los xij, lub sij hawm cia ntawm aluminium ntawv ci yog luv luv, thiab kev sib dhos yuav tsum tau ua nyob rau hauv ib ntus. Tsim nyog rau cov xwm txheej uas yuav tsum tau ua kom muaj kev sib txuas siab, flatness, thiab sib dhos ceev, xws li cov khoom siv hluav taws xob nruab nrab mus rau qis kawg.