Tooj liab deposition, tseem hu ua chemical tooj liab plating, abbreviated li PTH. Nws lub hom phiaj tseem ceeb yog tso cov txheej nyias thiab cov xim tooj liab rau ntawm cov khoom tsis yog -cov khoom siv hluav taws xob ntawm cov ntawv luam tawm Circuit Court boards, xws li insulated lub qhov phab ntsa thiab qee qhov tshwj xeeb uas tsis yog tooj liab ntawv ci, los ntawm cov tshuaj tiv thaiv, endowing cov khoom qub uas tsis yog -conductive qhov chaw nrog conductivity, nteg lub hauv paus rau tom ntej electroplating interconnection hluav taws xob cov txheej txheem ntawm kev sib txuas ntawm cov khoom siv hluav taws xob. lub rooj tsavxwm.
Siv ntau- txheej txheej luam tawm Circuit Board ua piv txwv, kev sib txuas hluav taws xob ntawm cov txheej yuav tsum tau ua los ntawm vias. Tom qab drilling, lub qhov phab ntsa yog insulated, thiab tsis muaj tooj liab immersion kev kho mob, tam sim no tsis tuaj yeem hla lub qhov kom ua tiav interlayer conduction. Cov txheej tooj liab zoo li lub tsev "choj", tso cai rau tam sim no ntws mus rau hauv nruab nrab ntawm cov khaubncaws sab nraud povtseg, ua kom muaj kev ncaj ncees thiab kev ua haujlwm ntawm tag nrho cov khoom siv hluav taws xob hauv Circuit Court. Yog tias muaj teeb meem nrog cov txheej txheem tooj liab deposition, xws li cov txheej txheem tooj liab tsis sib npaug, cov tuab tsis txaus, lossis qhov tsis xws li cov voids, nws yuav ua rau cov teeb liab tsis ruaj khov, luv Circuit Court, los yog qhib circuits, cuam tshuam rau kev ua haujlwm thiab kev pab cuam lub neej ntawm cov ntawv luam tawm Circuit Board.
Copper deposition process flow
ua ntej
Deburring: Tom qab drilling, luam ntawv lub rooj tsav xwm lub qhov yuav ua rau burrs, thiab cov khib nyiab drilling yuav nyob hauv lub qhov. Tshem tawm cov burrs thiab laum chips los ntawm kev txhuam txhuam thiab sib tsoo kom ntseeg tau tias kev ua haujlwm zoo tom qab, tsis txhob muaj kev puas tsuaj rau lub qhov phab ntsa thiab qhov chaw, thiab cuam tshuam rau cov tooj liab deposition nyhuv.
o: Rau ntau- txheej boards, epoxy resin nyob rau hauv lub puab txheej yuav puas thaum lub sij hawm drilling txheej txheem. Siv cov tshuaj o tshwj xeeb, xws li ether raws li cov organic tebchaw, kom muag thiab o ntawm cov epoxy resin, npaj rau cov kauj ruam tom ntej ntawm qhov drilling kom paub tseeb tias tshem tawm cov khib nyiab zoo thiab txhim kho qhov adhesion ntawm phab ntsa pore thiab tooj liab txheej.
Tshem tawm cov kua nplaum thiab cov khib nyiab pov tseg: Siv cov khoom muaj zog oxidizing ntawm poov tshuaj permanganate, nyob rau hauv qhov kub thiab txias thiab muaj zog alkaline tej yam kev mob, nws undergoes oxidative cracking cov tshuaj tiv thaiv nrog o thiab softened epoxy resin drilling khib nyiab kom tshem tawm nws. Piv txwv li, ntawm qee qhov kub thiab alkaline ib puag ncig, poov tshuaj permanganate reacts nrog cov pa roj carbon chains hauv epoxy resin, ua rau lawv tawg thiab decompose, yog li ua tiav lub hom phiaj ntawm kev ntxuav lub pore phab ntsa.
Neutralization: Tshem tawm cov khoom seem xws li poov tshuaj permanganate, poov tshuaj permanganate, thiab manganese dioxide los ntawm cov txheej txheem ntawm kev siv poov tshuaj permanganate kom tshem tawm cov khib nyiab. Vim hais tias manganese ions nyob rau hauv cov hlau hnyav ions, lawv tuaj yeem ua rau "palladium lom" hauv cov kauj ruam tom ntej, ua rau palladium ions lossis atoms poob lawv qhov kev ua kom muaj zog, yog li cuam tshuam cov txiaj ntsig ntawm pore metallization. Yog li ntawd, lawv yuav tsum tau muab tshem tawm kom huv si.
Kev tshem tawm roj / qhov ntxuav: Siv cov tshuaj tshem tawm cov roj tshwj xeeb kom tshem tawm cov roj stains thiab lwm yam impurities ntawm lub rooj tsavxwm. Nyob rau tib lub sijhawm, los ntawm qhov kev txiav txim ntawm tus pore forming tus neeg sawv cev, tus nqi zog ntawm lub pore phab ntsa tau hloov kho kom nws qhov chaw zoo, txhawb nqa cov txheej txheem catalyst adsorption.
Micro etching: Siv cov tshuaj micro etching tshem tawm oxides thiab lwm yam impurities ntawm tooj liab, thiab micro roughening ntawm tooj liab. Qhov no tsis yog tsuas yog txhim kho lub peev xwm ntawm kev sib khi ntawm tooj liab nto thiab tom qab electrolytic tooj liab, tab sis kuj muab qhov chaw zoo dua rau qhov adsorption ntawm catalysts.
Acid immersion: Ntxuav cov hmoov tooj liab uas txuas rau ntawm qhov chaw tooj liab tom qab micro etching kom ntseeg tau tias qhov purity ntawm tooj liab nto thiab tsim cov kev mob zoo rau cov kauj ruam tom ntej.
catalysis
Pre immersion: tiv thaiv kev tu tsis tiav ntawm cov txheej txheem dhau los thiab impurities los ntawm kev nkag mus rau hauv lub tank kim palladium, thaum ntub cov epoxy resin pore phab ntsa los txhawb adsorption ntawm cov catalyst ntawm lub phaj nto. Lub tank ua ntej soaking thiab tom qab ua kom lub tank muaj qhov sib xyaw ua ke tshwj tsis yog qhov tsis muaj palladium.
Kev Ua Haujlwm: Cov kauj ruam no feem ntau yog siv cov catalysts xws li Pd / Sn lossis Pd / Cu kom tso cai rau cov palladium micelles tsis zoo rau ntawm qhov chaw kom ua raws li cov phab ntsa pore vim yog kev ua ntawm cov polymer mesoporous. Los ntawm kev ua kom muaj kev kho mob, cov chaw catalytic active chaw yog muab rau cov tshuaj tooj liab tso rau tom ntej, tso cai rau tooj liab ions kom txo qis cov tshuaj tiv thaiv ntawm cov chaw nquag no.
Acceleration: Tshem tawm cov colloidal feem ntawm txheej txheej ntawm colloidal palladium hais, nthuav tawm cov catalytic palladium core, kom ntseeg tau zoo adhesion ntawm electroless tooj liab plating txheej thiab lub pore phab ntsa. Piv txwv li, palladium micelles ua raws li lub rooj tsavxwm, thiab tom qab ntxuav dej thiab aeration, lub plhaub Sn (OH) 4 yog tsim sab nraum Pd hais, uas yog tshem tawm los ntawm HBF4 hom accelerator kom nthuav tawm palladium core.
Chemical tooj liab deposition: Muab cov catalytically kho cov ntawv luam tawm Circuit Court rau hauv cov tshuaj tooj liab deposition tank uas muaj tooj liab ntsev (xws li tooj liab sulfate) thiab txo cov tshuaj (xws li formaldehyde). Nyob rau hauv qhov kev txiav txim catalytic ntawm palladium core, tooj liab ions raug txo los ntawm formaldehyde thiab tso rau ntawm phab ntsa pore ntawm lub rooj tsav xwm luam tawm thiab cov ntawv tsis tooj liab uas yuav tsum tau ua kom muaj zog, maj mam tsim cov txheej tooj liab nyias. Raws li cov tshuaj tiv thaiv kev loj hlob, cov tshuaj tshiab tsim cov tooj liab thiab cov tshuaj tiv thaiv los ntawm cov khoom siv hydrogen tuaj yeem ua cov tshuaj tiv thaiv catalysts, ntxiv dag zog rau kev nce qib ntawm cov tshuaj tiv thaiv thiab ua kom cov tuab ntawm cov txheej tooj liab. Hom tshuaj tooj liab deposition yuav muab faib ua nyias tooj liab (0.25-0.5 μ m), nruab nrab tooj liab (1-1.5 μ m), thiab tuab tooj liab (2-2.5 μ m) raws li kev thov.
post- ua
Kev ntxuav dej: Tom qab ua tiav cov tooj liab tso tawm, cov tshuaj seem ntawm cov ntawv luam tawm ntawm lub rooj tsav xwm tau muab tshem tawm kom huv si los ntawm ntau- theem dej ntxuav kom tsis txhob muaj qhov cuam tshuam ntawm cov khoom seem ntawm cov txheej txheem tom ntej.
Kev ziab: Siv cov txheej txheem xws li cua kub ziab kom tshem tawm cov dej noo los ntawm qhov chaw ntawm lub rooj tsav xwm luam tawm, ua kom nws nyob hauv lub xeev qhuav rau kev khaws cia thiab ua haujlwm tom ntej.
kev soj ntsuam zoo
Backlight qib xeem: Ua lub qhov phab ntsa hlais thiab saib xyuas qhov kev pab cuam ntawm cov tooj liab tso rau ntawm lub qhov phab ntsa siv lub tshuab ntsuas metallographic. Lub backlight theem feem ntau muab faib ua 10 qib, thiab qib siab dua, qhov zoo dua qhov kev pab cuam ntawm cov tooj liab tso rau ntawm phab ntsa ntawm lub qhov. Nquag, cov qauv kev lag luam yuav tsum muaj qhov ntsuas ntau dua lossis sib npaug rau 8.5. Los ntawm kev ntsuas backlight, qhov sib xws thiab kev ncaj ncees ntawm cov txheej txheem tooj liab tso rau ntawm lub qhov phab ntsa tuaj yeem nkag siab qhov tseeb, thiab qhov zoo ntawm cov tooj liab tso tawm tuaj yeem txiav txim kom tau raws li qhov yuav tsum tau ua.
Copper txheej thickness nrhiav tau: Siv cov cuab yeej tshaj lij xws li X-ray thickness gauges los ntsuas qhov tuab ntawm cov txheej txheej tooj liab, kom ntseeg tau tias nws ua tau raws li qhov thickness ntau yam xav tau los ntawm tus tsim. Sib txawv daim ntawv thov scenarios thiab cov khoom yuav tsum tau muaj cov qauv sib txawv rau lub thickness ntawm tooj liab deposition txheej.
Kev kuaj adhesion: Siv txoj hauv kev xws li kev kuaj kab xev los kuaj qhov adhesion ntawm cov txheej tooj liab thiab cov ntawv luam tawm hauv Circuit Board substrate. Piv txwv li, siv ib daim kab xev nplaum tshwj xeeb los lo rau saum npoo ntawm txheej tooj liab, tom qab ntawd sai sai tev tawm thiab saib seb cov txheej tooj liab puas tau tev tawm, txhawm rau ntsuas seb qhov adhesion puas ua tau raws li tus qauv. Zoo adhesion yog ib qho tseem ceeb qhia kom muaj kev ruaj ntseg thiab kev cia siab ntawm cov txheej tooj liab deposited.
Kev tshuaj xyuas cov phab ntsa hauv qhov: Siv lub tshuab tsom iav lossis lwm yam cuab yeej, ua tib zoo tshuaj xyuas cov txheej tooj liab ntawm lub qhov phab ntsa kom txuas mus ntxiv, qhov tsis xws luag xws li voids thiab cov kab nrib pleb, kom ntseeg tau tias qhov zoo ntawm cov txheej tooj liab ntawm lub qhov phab ntsa ua tau raws li qhov yuav tsum tau muaj ntawm Circuit Court kev ntseeg tau.
Cov ntsiab lus tseem ceeb ntawm kev tswj cov txheej txheem tooj liab deposition
Kev tswj qhov kub thiab txias: Cov tshuaj tiv thaiv tus nqi thaum lub sij hawm chemical tooj liab deposition yog rhiab heev rau kub. Qhov kub thiab txias ntau dhau tuaj yeem ua rau qhov tsis sib xws ntawm cov txheej tooj liab, uas ua rau muaj qhov tsis xws luag xws li roughness thiab voids; Qhov kub thiab txias yog qis heev, cov tshuaj tiv thaiv tus nqi qeeb, cov tooj liab deposition efficiency yog tsawg, thiab lub thickness ntawm tooj liab txheej yog nyuaj rau ua tau raws li qhov yuav tsum tau. Piv txwv li, qhov kub ntawm cov tshuaj tooj liab plating tank feem ntau yuav tsum tau tswj hwm ntawm 25-35 degree, nyob ntawm seb cov qauv ntawm cov tshuaj siv tshuaj thiab cov txheej txheem yuav tsum tau ua.
PH tswj: Tus nqi pH ntawm cov tshuaj tuaj yeem cuam tshuam rau daim ntawv ntawm tooj liab ions thiab kev ua haujlwm ntawm cov neeg ua haujlwm txo qis. Tsis tsim nyog pH qhov tseem ceeb tuaj yeem tiv thaiv cov tshuaj tiv thaiv los ntawm kev ua kom zoo lossis ua rau txo qis ntawm cov txheej tooj liab zoo. Nyob rau hauv tus txheej txheem ntawm tooj liab deposition, nws yog feem ntau yuav tsum tau tswj tus nqi pH nyob rau hauv lub alkaline ntau ntawm 11-13 thiab tuav ib tug ruaj khov pH nqi los ntawm kev ntxiv pH adjusters.
Kev tswj cov concentration: Cov concentration ntawm tooj liab ntsev, txo cov neeg ua haujlwm, cov tshuaj chelating, thiab lwm yam ntawm cov tshuaj yuav tsum tau tswj nruj me ntsis raws li qhov teev tseg. Cov concentration ntau dhau los yog tsis txaus tuaj yeem cuam tshuam tus nqi thiab qhov zoo ntawm tooj liab deposition. Piv txwv li, qhov tsawg concentration ntawm tooj liab ntsev yuav ua rau qeeb tooj liab deposition tus nqi thiab tsis txaus tooj liab txheej thickness; Cov concentration ntau dhau ntawm tus neeg sawv cev txo qis tuaj yeem ua rau cov tshuaj tiv thaiv ntau dhau thiab cuam tshuam rau qhov sib xws ntawm txheej tooj liab. Nws yog ib qho tsim nyog yuav tsum tsis tu ncua kuaj thiab kho qhov concentration ntawm cov tshuaj kom ntseeg tau tias nws nyob rau hauv cov txheej txheem zoo tshaj plaws.
Kev tswj lub sij hawm tiv thaiv: Lub sij hawm tooj liab deposition txiav txim siab kawg thickness ntawm txheej tooj liab. Lub sij hawm luv luv, thiab lub thickness ntawm cov tooj liab txheej tsis ua raws li cov qauv tsim; Lub sij hawm ntau dhau tsis tsuas yog khib nyiab, tab sis kuj tseem tuaj yeem ua rau cov txheej tooj liab tuab, ua rau coarse crystallization thiab txo adhesion. Raws li ntau hom tooj liab deposition thiab cov txheej txheem yuav tsum tau, lub sij hawm tooj liab deposition yuav tsum precisely tswj. Piv txwv li, lub sij hawm tooj liab deposition rau nyias tooj liab yog feem ntau 10-15 feeb, thaum rau nruab nrab thiab tuab tooj liab, nws yuav tsum tau txuas mus ntxiv.