Kev kho deg yog ib qho tseem ceeb thiab tseem ceeb hauv cov txheej txheemluam Circuit board manufacturing txheej txheem. Nws tsis tsuas yog cuam tshuam qhov vuam zoo ntawm cov khoom siv hluav taws xob thiab cov khoom siv hluav taws xob, tab sis kuj muaj kev cuam tshuam loj heev rau kev tiv thaiv corrosion, hluav taws xob kev ua tau zoo, thiab kev pab cuam lub neej ntawm circuit boards. Nrog rau txoj kev loj hlob sai ntawm kev siv tshuab hluav taws xob, luam tawm Circuit Board board txoj kev kho saum npoo av tau dhau los ua ntau haiv neeg, txhua tus nrog nws cov txheej txheem tshwj xeeb, cov yam ntxwv ua tau zoo, thiab cov xwm txheej siv tau.
1, Kub kub
Txoj Cai Txheej Txheem
Lub npe tag nrho ntawm immersion kub plating yog tshuaj npib tsib xee plating, uas yuav tso ib txheej ntawm npib tsib xee rau saum npoo ntawm tooj liab liab ntawm lub rooj tsavxwm luam tawm los ntawm cov tshuaj oxidation -txo cov tshuaj tiv thaiv, los thaiv cov diffusion ntawm tooj liab ions thiab txhim khu cov adhesion ntawm txheej kub; Tom qab ntawd tso ib txheej kub rau saum npoo ntawm nickel txheej. Cov khoom siv tshuaj ntawm cov txheej kub yog qhov ruaj khov thiab tuaj yeem tiv thaiv cov txheej tooj liab sab hauv los ntawm oxidation.
Cov yam ntxwv ntawm kev ua haujlwm thiab kev siv
Cov ntawv luam tawm Circuit Board nto ntawm cov txheej txheem immersion kub yog tiaj tus thiab tsis sib xws, nrog zoo solderability. Cov txheej kub tuaj yeem yaj sai sai rau hauv cov khoom siv los ua kom muaj kev sib txuas zoo, ua rau nws haum rau cov khoom siv hluav taws xob uas xav tau cov khoom siv hluav taws xob zoo heev, xws li smartphones, ntsiav tshuaj, thiab lwm yam khoom siv hluav taws xob. Meanwhile, kub muaj qhov zoo thiab ruaj khov conductivity, haum rau siab - zaus thiab siab -ceev teeb liab kis tau tus mob, thiab yog dav siv nyob rau hauv 5G cov khoom sib txuas lus thiab siab - kev ua tau zoo servers motherboards. Tsis tas li ntawd, nws zoo nkauj golden tsos kuj yooj yim rau kev sim ntau lawm.
2, Txau tin
Txoj Cai Txheej Txheem
Tin spraying, tseem hu ua cua kub leveling, yog cov txheej txheem ntawm immersing ib tug luam Circuit Court board nyob rau hauv molten tin lead alloy solder, thiab ces siv cov cua kub los tshuab tawm tshaj solder nyob rau saum npoo thiab nyob rau hauv lub qhov, yog li tsim ib tug uniform txheej ntawm solder ntawm tooj liab nto. Nrog rau qhov kev thov ntau ntxiv rau kev tiv thaiv ib puag ncig, cov hmoov lead- cov tshuab tin dawb yog tam sim no siv dav, hloov cov tshuaj txhuas uas muaj cov hlau nplaum nrog cov hlau xws li tin silver tooj liab.
Cov yam ntxwv ntawm kev ua haujlwm thiab kev siv
Cov txheej txheem tin txau muaj tus nqi qis, kev ua haujlwm siab ntau lawm, thiab ua cov txheej txheem tuab tuab nrog cov khoom zoo thiab cov khoom siv tiv thaiv, ua rau nws tsim nyog rau cov txheej txheem vuam xws li yoj soldering. Feem ntau siv rau hauv cov khoom siv hluav taws xob siv hluav taws xob uas raug nqi thiab xav tau kev ntseeg siab, xws li qis- cov xov tooj ntawm tes thiab cov khoom siv hauv tsev me me. Txawm li cas los xij, vim yog qhov tsis zoo ntawm qhov chaw tiaj tus, muaj qee qhov kev txwv hauv kev sib txuas ntawm cov khoom sib txuas zoo thiab siab - cov teeb liab kis tau zoo.
3, Organic solderability tiv thaiv
Txoj Cai Txheej Txheem
OSP yog ib zaj duab xis nyias nyias uas tsim los ntawm cov tooj liab dawb huv los ntawm kev kho tshuaj. Cov yeeb yaj kiab no tuaj yeem tiv thaiv tooj liab nto los ntawm oxidation thiab tuaj yeem raug tshem tawm los ntawm kev sib tsoo thaum lub sij hawm vuam, nthuav tawm cov tooj liab tshiab rau vuam.
Cov yam ntxwv ntawm kev ua haujlwm thiab kev siv
OSP thev naus laus zis yog qhov yooj yim, qis- tus nqi, thiab ua cov txheej txheem nyias nyias uas tsis hloov qhov tseeb qhov tseeb ntawm lub rooj tsav xwm Circuit Court. It is suitable for high-density wiring and fine pitch component soldering, such as BGA packaging components. Feem ntau siv nyob rau hauv siab -kawg smartphones, ntsiav tshuaj, thiab lwm yam khoom uas yuav tsum tau nruj ntim thiab kev ua tau zoo yuav tsum tau. Txawm li cas los xij, qhov kev tiv thaiv corrosion ntawm OSP zaj duab xis txheej yog qhov tsis muaj zog thiab lub sijhawm cia yog txwv, yog li nws yuav tsum tau welded thiab sib dhos sai li sai tau.
4, Sinking tin
Txoj Cai Txheej Txheem
Tin deposition yog txheej txheem ntawm depositing ib txheej ntawm tin nyob rau saum npoo ntawm tooj liab los ntawm cov tshuaj displacement tshuaj, uas ua rau ib tug uniform thickness ntawm tin txheej.
Cov yam ntxwv ntawm kev ua haujlwm thiab kev siv
Cov ntawv luam tawm Circuit Board nto ntawm cov txheej txheem tin deposition muaj siab flatness thiab zoo solderability, ua rau nws haum rau Circuit Court boards uas yuav tsum tau ntau yam soldering los yog kho. Nws yog siv rau hauv qee cov khoom siv hluav taws xob uas yuav tsum tau ua kom lub ntsej muag siab, xws li LED zaub tsav tsheb. Txawm li cas los xij, txheej txheej tin tuaj yeem ntsib tin whisker loj hlob ntawm qhov kub thiab txias, uas tuaj yeem cuam tshuam rau hluav taws xob kev ua tau zoo thiab kev ntseeg tau. Yog li ntawd, yuav tsum ceev faj thaum siv nws.
5, Sinking nyiaj
Txoj Cai Txheej Txheem
Silver deposition yog txheej txheem ntawm depositing ib txheej ntawm cov nyiaj nyob rau saum npoo ntawm tooj liab los ntawm cov tshuaj displacement tshuaj.
Cov yam ntxwv ntawm kev ua haujlwm thiab kev siv
Qhov saum npoo ntawm cov ntawv luam tawm Circuit Board nrog cov txheej txheem nyiaj tso tawm muaj qhov zoo conductivity thiab solderability. Cov oxidation tsis kam ntawm cov nyiaj txheej yog zoo dua li cov liab liab liab, thiab qhov chaw tiaj tus yog siab, haum rau siab - zaus teeb liab kis tau tus mob thiab nplua qhov sib txawv soldering. Nws yog siv rau hauv qee yam khoom siv sib txuas lus siab, khoom siv hluav taws xob kho mob thiab lwm yam khoom uas xav tau kev ua haujlwm siab thiab kev ntseeg siab. Tab sis tus nqi ntawm cov txheej nyiaj yog qhov siab, thiab ntev - lub sij hawm raug rau huab cua yuav ua rau sulfurization discoloration, cuam tshuam rau kev ua tau zoo.
6, Tshuaj lom neeg nickel palladium plating
Txoj Cai Txheej Txheem
ENEPIG yog raws li cov txheej txheem kub deposition los ntawm kev ntxiv ib txheej palladium ntawm cov nickel txheej thiab txheej kub. Cov txheej palladium tuaj yeem tiv thaiv oxidation ntawm cov nickel txheej thiab txhim kho qhov adhesion ntawm txheej kub.
Cov yam ntxwv ntawm kev ua haujlwm thiab kev siv
ENEPIG txheej txheem luam ntawv Circuit Court boards muaj zoo corrosion kuj thiab kev ntseeg tau, zoo heev solderability, thiab yog tshwj xeeb tshaj yog haum rau cov khoom siv hluav taws xob uas raug rau ib puag ncig hnyav rau lub sijhawm ntev, xws li aerospace, automotive electronics, thiab lwm yam. Nws cov txheej txheem ntau- txheej hlau tuaj yeem ua kom ruaj khov ntawm kev ua haujlwm hluav taws xob zoo dua, tab sis cov txheej txheem nyuaj thiab tus nqi siab.