High kawg HDI boardyog ib qho khoom lag luam siab heev ntawm -kev sib cuam tshuam kev sib txuas thev naus laus zis, thiab tau dhau los ua ib qho tseem ceeb ntawm kev txhawb nqa siab -kawg hluav taws xob hauv qab kev txhim kho txuas ntxiv ntawm cov khoom siv hluav taws xob sib txuas. Nws cov qauv tsim thiab cov txheej txheem tsim khoom yog ob qho tib si tsom rau siab - cov teeb liab ceev kis tau tus mob thiab cov kev xav tau me me, uas txawv ntawm cov yam ntxwv ntawm cov pa hluav taws xob Circuit Court boards, ua rau nws tsis tuaj yeem hloov pauv hauv cov khoom siv hluav taws xob precision.
Cov yam ntxwv ntawm microporous qauv
Qhov tseem ceeb ntawm HDI boards siab heev yog lawv cov qauv microporous. Hom micropore no yog tsim los ntawm laser direct drilling tshuab, thiab roughness ntawm lub qhov phab ntsa yog tswj nyob rau hauv qis qis kom ntseeg tau tias lub zog sib txuas ntawm lub qhov phab ntsa thiab txheej. Tsis zoo li lub qhov los ntawm qhov tsim los ntawm cov khoom siv kho tshuab ib txwm siv, cov micro qhov nyob rau hauv siab - xaj HDI boards feem ntau yog qhov muag tsis pom qhov lossis cov qauv faus, uas tsuas yog ua tiav kev sib txuas ntawm cov txheej txheej hauv Circuit Court thiab zam kev ua haujlwm ntawm lub rooj tsavxwm qhov chaw los ntawm qhov.
Kev faib tawm ntawm micropores nthuav tawm ib qho array zoo li feature, nrog rau me me nyob deb ntawm qhov chaw pore. Ua ke nrog kev tsim hluav taws xob zoo, nws txhim kho qhov kev sib txuas ceev ntawm ib cheeb tsam. Hauv ntau- txheej txheej, micropores tau teeb tsa hauv ib kauj ruam lossis staggered kom ua tiav peb - qhov sib txuas ntawm qhov sib txawv ntawm cov qib sib txawv, muab lub hauv paus tsim rau siab - ntom ntom tivthaiv layout.
Kab density parameters
Kab ceev yog ib qho kev qhia tseem ceeb rau siab - xaj HDI boards. Kev ua raws li qhov ntsuas no yog nyob ntawm siab -txheej txheem photolithography technology thiab etching txheej txheem, nrog me me deviations nyob rau hauv lub verticality ntawm kab ntug, kom ntseeg tau tias impedance sib xws nyob rau hauv cov teeb liab kis tau tus mob.
Qhov kev teeb tsa hauv Circuit Court feem ntau yog siv cov qauv sib txawv, thiab cov impedance tswj Circuit Court tshwj xeeb raug teeb tsa kom ua tau raws li qhov yuav tsum tau muaj ntawm siab -ceev teeb liab kis tau tus mob, nrog rau cov yam ntxwv impedance sib txawv tswj nyob rau hauv ib qho me me. Kev sib hloov ntawm cov dav hlau hauv av thiab cov teeb liab txheej tau zoo txo cov kev sib tham ntawm cov kab thiab ua tau raws li cov kev xav tau ntawm electromagnetic compatibility rau siab -frequency signal kis.
Stacked qauv layout
Lub siab -kev txiav txim HDI board txais ntau- txheej txheej laminated nrog ntau txheej txheej. Lub stacked layout ua raws li lub hauv paus ntsiab lus ntawm teeb liab kev ncaj ncees, thiab lub hwj chim thiab hauv av txheej yog symmetrically faib los tsim ib tug ruaj khov fais fab faib network. Lub impedance ntawm lub dav hlau fais fab yog tswj nyob rau theem qis.
Cov khoom siv rwb thaiv tsev interlayer yog ua los ntawm kev hloov kho epoxy resin los yog polyimide cov khoom uas tsis tshua muaj dielectric tsis tu ncua, uas ua rau tsis tshua muaj dielectric poob ntawm cov zaus siab thiab ua tau zoo txo qhov kev sib kis ntawm siab -frequency signals. Cov txheej txheem lamination tau txais ib kauj ruam -los ntawm- txheej txheem lamination, thiab qhov sib txawv ntawm thickness tom qab lamination yog tswj nyob rau hauv ib qho me me los xyuas kom meej tag nrho cov tuab tuab.
Kev xaiv cov khoom siv
Nyob rau hauv cov nqe lus ntawm substrate, advanced HDI boards tau tawg los ntawm cov kev txwv ntawm tsoos FR-4, thiab mainstream siv halogen-dawb nplaim taws- retardant composite cov ntaub ntawv nrog siab iav hloov kub thiab tsis tshua muaj thermal expansion coefficient nyob rau hauv lub Z-axis kev taw qhia, ua tau raws li thermal stability thaum lub sij hawm reflow soldering.
Cov khoom siv hluav taws xob yog ua los ntawm siab -purity electrolytic tooj liab ntawv ci, thiab qhov saum npoo yog roughened los ua ib tug micro scale concave convex qauv, txhim khu kev sib raug zoo nrog lub substrate. Rau siab - zaus daim ntawv thov scenarios, annealed ultra- qis profile tooj liab ntawv ci tuaj yeem raug xaiv los txo cov tawv nqaij poob thaum lub teeb liab kis tau tus mob.
Cov txheej txheem kho deg
Cov txheej txheem kho saum npoo yuav tsum sib npaug ntawm cov vuam kev ua tau zoo thiab kev cia siab ntev ntev -. Txoj kev tseem ceeb yog cov txheej txheem tshuaj immersion kub, nrog lub thickness ntawm txheej kub thiab hauv qab nickel txheej tswj nyob rau hauv ib qho kev tsim nyog. Lub purity ntawm cov npib tsib xee txheej yog siab los xyuas kom meej corrosion kuj thiab weldability ntawm lub solder sib koom.
Lub npog ntsej muag lub ntsej muag siv cov duab thaij duab epoxy resin number case, nrog lub thickness tswj nyob rau hauv ib qho kev tsim nyog thiab kev daws teeb meem siab, uas tuaj yeem npog thaj tsam hauv cheeb tsam thiab nthuav tawm cov ntaub qhwv. Lub npog ntsej muag lub ntsej muag yuav tsum tau kuaj xyuas qhov kub thiab txias yam tsis muaj kev tawg kom ntseeg tau tias nws muaj kev tiv thaiv kev ua haujlwm hauv qhov chaw hnyav.
Lub Rooj Tswjhwm Saib HDI qib siab ua tiav miniaturization thiab kev ua haujlwm siab ntawm cov tshuab hluav taws xob los ntawm cov khoom siv xws li microporous interconnection, siab -cov circuits ceev, thiab ntau- txheej txheej. Nws cov txheej txheem tsim khoom suav nrog kev sib koom ua ke ntawm ntau txoj haujlwm thev naus laus zis xws li cov ntaub ntawv science, precision machining, thiab kev tshuaj ntsuam xyuas, nrog rau qib siab ntawm cov txheej txheem tsim nyog. Nws tau dhau los ua lub hauv paus tseem ceeb hauv high-kawg teb xws li 5G kev sib txuas lus, kev txawj ntse txawj ntse, thiab kev kho mob hluav taws xob, txhawb kev txhim kho cov khoom siv hluav taws xob mus rau siab - ntom ntom, siab - zaus, thiab qis - zog cov lus qhia.