Hauv kev tsim kho ntawm cov laug cam ntau zaus, drilling burrs thiab laminated txheej tuaj yeem daws tau los ntawm kev sib xyaw ua ke ntawm cov khoom xaiv, txheej txheem parameter optimization, thiab tag nrho cov txheej txheem tswj.
Targeted daws rau drilling burrs
Cov cuab yeej thiab cov kev hloov pauv: Xaiv cov khoom zoo tshaj plaws tungsten steel laum cov khoom (cov qoob loo loj 0.2-0.4 μ m), nce qhov ceev mus rau 35-45krpm, txo tus nqi pub los ntawm 20-30%, thiab hloov mus rau cov khoom tshwj xeeb ntawm cov phaj siab.
nti tshem tawm thiab txhawb kev ua kom zoo dua qub: Kev siv cov txheej txheem tshem tawm cov ntu ntu (pecking laum), cov cuab yeej raug tshem tawm txhua 0.2 hli kom tso tawm tag nrho cov chips; Paired nrog high-density aluminium cover phaj thiab composite pad, nws txo burrs ntawm lub qhov hluav taws xob qhov hluav taws xob los ntawm qhov chaw.
Tom qab kev txhim kho kev txhim kho: Tom qab drilling, ntxiv cov txheej txheem tshem tawm cov ntshav los yog cov tshuaj slag tshem tawm kom huv si tshem tawm cov khoom seem ntawm cov khib nyiab thiab cov iav fiber ntau protrusions ntawm phab ntsa ntawm lub qhov, tsis txhob muaj qhov cuam tshuam tom qab electroplating.
Kev tswj kom meej: Muab cov khoom siv ntau zaus ntsej muag rau hauv lub qhov drilling, xav kom thaj chaw dawb nyob ib ncig ntawm lub qhov qhib tsis pub ntau tshaj 2.5 hli ntawm ntug, raws li cov txheej txheem txiav txim siab rau lub qhov phab ntsa zoo.
Kev tiv thaiv thiab tswj kev npaj rau siab stratification
Ua ntej sib piv ntawm cov ntaub ntawv: Xaiv cov nplooj ntawv qis qis qis (RC%<40%), add a transition buffer layer between high-frequency materials and FR-4, control CTE deviation within 3ppm/℃, and significantly reduce interlayer stress.
Kev kho kom zoo ntawm compression nkhaus: Txais cov cua kub qis ntawm 1-2℃/ min, lub sij hawm compression txuas ntxiv los ntawm 30-50% piv rau FR4 daim hlau zoo tib yam, thiab tus nqi cua txias yog nruj me ntsis tswj ntawm<1 ℃/min to avoid delamination caused by thermal shock.
Ib puag ncig thiab khoom lav: Siv lub tshuab nqus tsev los tswj lub tshuab nqus tsev kawm ntawv hauv 10Pa. Ua ntej nias, lub tshuab nqus tsev ziab kom qhuav lub siab zaus ntawm 80℃rau 4 teev kom huv si tshem tawm cov dej noo ntawm lub rooj tsavxwm thiab tshem tawm cov npuas seem.
Kev ua kom zoo ntawm cov qauv: Kev siv cov qauv tsim symmetrical stacking, cov khoom siv ntau zaus txheej yog symmetrically faib nrog lub hauv paus axis raws li kev siv, ntsuas qhov kev ntxhov siab thaum lub sij hawm compression txheej txheem thiab txo qhov kev pheej hmoo ntawm warping thiab delamination los ntawm cov hauv paus hniav.
Cov ntsiab lus tseem ceeb rau kev tswj hwm kev tsim khoom loj
Tsim kom muaj cov ntaub ntawv tshwj xeeb rau kev them nyiaj rau kev nthuav dav thiab kev cog lus ntawm cov rooj sib txawv siab zaus, thiab nws tus kheej teeb tsa cov nyiaj coefficients hauv X / Y cov lus qhia kom tsis txhob cuam tshuam kev sib txuas ntawm interlayer los ntawm deformation tsub zuj zuj.
Tom qab compression, lub xeev interlayer tau soj ntsuam tag nrho siv ultrasonic scanning microscopy thev naus laus zis los xyuas kom meej tias tsis muaj npuas zais nrog ib txoj kab uas hla ntau dua 0.2 hli, thiab cuam tshuam qhov muaj peev xwm delamination ua ntej.
Txhua batch yog ua piv txwv rau thermal shock kev ntseeg tau pov thawj, thiab tom qab 288℃soldering xeem, tsis muaj delamination lossis tooj liab tawg tshwm sim, kom ntseeg tau tias kev siv lub davhlau ya nyob twg.