Hauv thaj teb ntawmsiab - zausKev sib txuas lus, Rogers cov ntaub ntawv tau dhau los ua qhov kev xaiv tseem ceeb rau kev ua tau zoo - kev ua tau zoo ntawm cov ntawv luam tawm Circuit Board vim lawv qhov tsis tshua muaj hluav taws xob tsis tu ncua, qhov poob qis, thiab thermal stability zoo heev. Hom pcb no yog siv dav hauv cov xwm txheej uas yuav tsum tau muaj cov teeb liab sib kis tau zoo, xws li 5G hauv paus chaw nres tsheb, kev sib txuas lus satellite, radar systems, thiab lwm yam.fr4 ualuam tawm Circuit Board, thiab kev tswj cov txheej txheem meej yog yuav tsum tau ua kom ntseeg tau cov khoom siv siab tshaj plaws.
Kev khiav dej num ntawm siab - zaus Rogers pcb
Kev ua haujlwm ntawm siab - zaus Rogers pcb xav tau kom sib npaug cov yam ntxwv ntawm cov khoom siv thiab siab -frequency kev ua tau zoo, thiab cov txheej txheem tuaj yeem muab faib ua rau cov kauj ruam tseem ceeb:
1. Kev xaiv cov khoom siv thiab pretreatment
Rogers cov ntaub ntawv xws li RO4350B, RO4003C, thiab lwm yam yuav tsum tau ua kom raug raws li qhov dielectric tas li thiab thickness yuav tsum tau ntawm cov khoom tsim. Kev soj ntsuam nruj nruj yog xav tau tom qab tau txais cov ntaub ntawv los tshem tawm cov khawb ntawm qhov chaw thiab oxidation los ntawm kev thauj mus los tsis zoo lossis kev cia khoom.
2. Sab hauv txheej Circuit Court ntau lawm
Lub hauv paus txheej hauv Circuit Court yog lub hauv paus thauj khoom ntawm cov teeb liab kis tau tus mob, thiab qhov tseeb yuav tsum tau ua kom ntseeg tau los ntawm cov kauj ruam hauv qab no:
Daim ntawv thov zaj duab xis thiab raug: siab- zaj duab xis qhuav yog siv, thiab lub tshuab nqus tsev laminating yog siv los xyuas kom meej tias cov zaj duab xis txheej yog nruj nreem rau saum npoo ntawm substrate, tsis txhob muaj npuas seem; Cov txheej txheem raug siv cov khoom siv laser ncaj qha mus rau qhov tseeb hloov cov qauv hauv Circuit Court rau cov zaj duab xis qhuav, kom ntseeg tau tias kab dav qhov tseeb.
Etching thiab nrhiav kom pom: siv cov kua qaub etching, ua tiav cov etching ntawm Circuit Court los ntawm kev tswj qhov kub thiab txias ntawm cov tshuaj tsuag; Tom qab etching, tshuaj xyuas qhov tsis xws luag xws li qhov tsis sib xws ntawm Circuit Court thiab luv luv Circuit Court los ntawm AOI cov cuab yeej los xyuas kom meej qhov kev ncaj ncees ntawm cov txheej txheej hauv Circuit Court.
3. Laminated txheej txheem
Txheej txheej yog qhov tseem ceeb hauv kev txiav txim siab qhov kev ua tau zoo ntawm Rogers pcb, thiab nws yog ib qho tsim nyog los daws cov teeb meem sib xws ntawm cov khoom sib txawv, xws li Rogers thiab FR4 mix lamination.
Stacking tsim: xam lub thickness ntawm cov khaubncaws sab nraud povtseg raws li impedance yuav tsum tau, thiab tsim nyog teem ib semi-kho daim ntawv ntawm Rogers substrate thiab FR4 los xyuas kom meej interlayer bonding zog.
Compression parameter tswj: Kev siv lub tshuab cua sov thiab kev ua haujlwm siab, qhov siab tshaj plaws kub thiab siab yog teem raws li cov qauv ntawm cov khoom kom tsis txhob delamination hauv zos los ntawm qhov tsis sib xws.
4. Drilling thiab qhov metallization
High zaus signals yog rhiab heev rau kis tau tus mob kev ua tau zoo ntawm vias thiab yuav tsum tau cov hauj lwm meej los txo cov teeb liab poob
Drilling: Siv ib qho nyuaj alloy laum me ntsis, kho qhov drilling ceev thiab pub tus nqi tsim nyog raws li qhov siab hardness ntawm Rogers cov khoom, thiab tsis txhob burrs lossis residue residue ntawm lub qhov phab ntsa.
Copper deposition thiab electroplating: Tshuaj tooj liab deposition yog siv los tsim ib tug niaj hnub conductive txheej ntawm lub qhov phab ntsa, ua raws li cov kua qaub tooj liab plating txheej txheem kom thicken lub qhov tooj liab, xyuas kom meej lub conductivity thiab mechanical zog ntawm lub.
5. Txheej txheej thaiv thiab kho qhov chaw
Cov txheej txheej sab nraud ntawm Circuit Court ncaj qha cuam tshuam qhov zoo ntawm cov teeb liab kis tau tus mob, thiab cov hauv qab no yuav tsum tau ua tib zoo tswj:
Circuit etching: Siv tib lub LDI raug thiab acid etching txheej txheem raws li cov txheej txheem sab hauv, kom ntseeg tau meej kev sib raug zoo ntawm cov txheej txheem sab nrauv thiab sab hauv ntawm lub voj voog.
Kev kho saum npoo: txhawm rau txhim kho cov khoom siv thiab oxidation tsis kam ntawm cov ntaub qhwv, siab - zaus Rogers luam tawm Circuit Board feem ntau siv cov tshuab kub immersion los tswj cov thickness ntawm txheej kub thiab npib tsib xee txheej, tsis txhob teeb liab kis tau los ntawm cov txheej kub ntau dhau.
6. Moulding thiab kev soj ntsuam zaum kawg
Raws li tus neeg siv khoom tsim qhov ntev, CNC milling tshuab yog siv los ua cov txheej txheem, thiab cov cuab yeej xaiv yuav tsum tau ua kom haum rau cov yam ntxwv hardness ntawm Rogers cov ntaub ntawv kom tsis txhob muaj ntug tawg. Kev tshuaj xyuas zaum kawg suav nrog kev ntsuas impedance (siv TDR impedance tester kom ntseeg tau tias impedance tus nqi sib txawv nyob rau hauv qhov tsim nyog), kev ntsuas kev tiv thaiv rwb thaiv tsev, thiab kev tshuaj xyuas tag nrho kom tshem tawm cov khoom tsis zoo - ua raws li cov khoom tsis xws luag thiab lub qhov phab ntsa voids.
Kev ceev faj rau High Frequency Rogers pcb ua
Kev ua haujlwm ntawm siab - zaus Rogers pcb yuav tsum zam kom tsis txhob ua haujlwm poob vim los ntawm cov khoom siv tsis zoo thiab cov txheej txheem. Cov ntsiab lus tseem ceeb suav nrog:
Kev tswj cov khoom siv sib xws: Muaj qhov sib txawv ntawm cov thermal expansion coefficient ntawm Rogers cov khoom thiab FR4. Thaum sib tov thiab nias, nws yog ib qho tsim nyog yuav tau xaiv ib daim ntawv kho ib nrab, xws li siv cov dej ntws qis PP thiab kev ua kom zoo dua cov kev nias kom txo qis interlayer kev ntxhov siab thiab tsis txhob delamination thaum siv tom qab.
Impedance raug lees paub: Ntxiv nrog rau kev xaiv substrate, hloov maj mam hloov hauv qhov dav ntawm lub voj voog, tooj liab thickness, thiab dielectric thickness tuaj yeem cuam tshuam rau impedance qhov tseem ceeb. Thaum lub sij hawm ua, tiag tiag - lub sij hawm saib xyuas ntawm etching yam thiab calibration li niaj zaus LDI cov cuab yeej yuav tsum tau los xyuas kom meej impedance stability.
Cov txheej txheem kev kho deg: Rogers cov khoom muaj qhov sib luag zoo, thiab kev kho mob tshwj xeeb micro etching (xws li siv cov tshuaj sib xyaw ntawm sulfuric acid thiab hydrogen peroxide) yuav tsum tau ua ua ntej tooj liab deposition kom roughness saum npoo, txhim kho txheej adhesion, thiab tsis txhob co coatings.
Kev tswj huv huv: Tag nrho cov txheej txheem ua haujlwm yuav tsum muaj qhov chaw huv si kom tsis txhob muaj plua plav thiab roj paug rau saum npoo ntawm substrate, tshwj xeeb tshaj yog thaum lub sij hawm stacking theem ua ntej lamination. Lub substrate yuav tsum raug xa mus los ntawm lub tshuab nqus tsev nqus tsev kom txo tau cov pa phem los ntawm tib neeg kev sib cuag.