Txhawm rau daws qhov teeb meem poob ntawm qhov siab - zaus pcb Circuit Court boards, nws yog ib qho tsim nyog yuav tsum tau synchronously siv peb qhov loj me: xaiv cov khoom siv, kev tsim kom zoo, thiab kev tswj cov txheej txheem, txhawm rau tswj cov kev puas tsuaj loj xws li dielectric poob thiab cov neeg xyuas pib poob hauv lub hom phiaj.
Kev xaiv cov khoom tseem ceeb thiab cov phiaj xwm txo qis
Tsawg poob substrate xaiv: High zaus substrates nrog Df tus nqi Tsawg dua los yog sib npaug rau 0.005, xws li Rogers RO4350B thiab PTFE series daim hlau, yog qhov zoo dua los hloov cov FR-4 zoo tib yam (Df Ntau dua lossis sib npaug rau 0.02) thiab txo cov dielectric poob los ntawm cov hauv paus hniav.
Tswj cov ntawv ci tooj liab roughness: Siv cov ntawv tsis tshua muaj tooj liab (HVLP), qhov kev ntxhib los mos ntawm qhov chaw yog tswj tsis pub dhau 0.2 μ m, uas tuaj yeem txo cov neeg xyuas pib poob los ntawm cov tawv nqaij los ntawm ntau tshaj 30% hauv millimeter yoj zaus band.
Kev sib txuam ntawm cov khoom siv ruaj khov: Xaiv cov boards nrog Dk kam rau ua tsawg dua lossis sib npaug ntawm ± 0.1 thiab qhov nqus dej hauv qab 0.1% kom tsis txhob muaj kev hloov pauv tam sim ntawm dielectric tas li tshwm sim los ntawm qhov chaw ntub dej lossis kub hloov pauv, uas tuaj yeem ua rau cov teeb liab poob ntxiv.
Optimization thiab Poob Txo Scheme rau Circuit Court Design
Kev sib txuam nruj impedance: Los ntawm kev suav cov kab dav dav, kab sib nrug, thiab dielectric thickness los ntawm electromagnetic simulation, kev tswj tsis tu ncua ntawm lub hom phiaj impedances xws li 50 Ω ib qho kawg thiab 100 Ω sib txawv tuaj yeem ua tiav, nrog impedance tolerances tswj nyob rau hauv ± 10% kom tsis txhob muaj hluav taws xob poob los ntawm cov teeb liab xav txog.
Optimize wiring structure: High zaus teeb liab kab yuav tsum luv thiab ncaj li sai tau, siv 45℃los yog voj arc ces kaum es tsis txhob ntawm lub kaum sab xis kom txo cov teeb liab distortion los ntawm ntxiv inductance ntawm cov ces kaum; Teem siab -ntau zaus cov cim qhia nyob rau hauv txheej sab hauv ze ntawm lub dav hlau hauv av thiab siv lub dav hlau tiv thaiv hauv av kom txo qis hluav taws xob.
Txhim kho grounding thiab reflux tsim: txais ntau-point grounding technology los muab txoj hauv kev qis impedance reflux rau siab- zaus tam sim no, zam kev poob ntxiv los ntawm qhov muaj peev xwm hloov pauv hauv av; Muab cov capacitors decoupling nyob ze ntawm lub chip fais fab pins kom lim tawm siab - lub suab nrov ntawm cov kab hluav taws xob.
Manufacturing txheej txheem tswj thiab poob kev npaj
nruj me ntsis tswj qhov tseeb ntawm txoj kab: xyuas kom meej tias qhov kam rau ntawm kab dav thiab qhov sib nrug yog tswj tsis pub dhau ± 0.5mil, zam kev hloov pauv sai ntawm kab impedance, thiab txo qis hauv zos poob thaum lub teeb liab kis tau tus mob.
Optimize interlayer alignment: Interlayer alignment deviation of multi -layer boards yog tswj nyob rau hauv ± 2mil los xyuas kom meej qhov sib tshooj ntawm lub teeb liab txheej thiab cov ntaub ntawv hauv av siv dav hlau, thiab kom tsis txhob impedance discontinuity tshwm sim los ntawm kev siv dav hlau offset.
Kev kho qhov poob qis: Qhov tseem ceeb yuav tsum tau muab rau cov txheej txheem kho saum npoo uas tsis tshua muaj roughness, xws li nyiaj thiab kub deposition, kom tsis txhob qhia ntxiv cov neeg xyuas pib poob nyob rau hauv ntau zaus vim cov tuab oxide txheej los yog siab roughness nto.