Hauv kev tsim ntawm cov khoom siv hluav taws xob siab, thermal kev tswj hwm yog qhov kev sib tw uas tsis tuaj yeem tsis quav ntsej cov khoom siv kub ua tiav yog qhov tseem ceeb tshaj plaws.
Tshaj Tawm Cua Sov Dissipation Tsim Tsim
1. teeb tsa optimization: tsim nyog tivthaiv cov khoom siv uas ua kom sov ib puag ncig cov cua sov nyob ib puag ncig cov cua sov
2.}} Thermal interface cov khoom siv: Tims tuaj yeem hloov cua sov los yog lwm yam cua sov dissipation qauv {}}
{3. Cov dab dej sov so, xws li ua kom sov sov li lub zog
4. Cov Yeeb Nkab Team Technology: Lub cev kub hnyiab ua kom sov los ntawm kev hloov ua haujlwm kub thiab cua sov
{{05. Ntxuam thiab Airflow Kev Tswj Xyuas yog ib txoj kev ua kom sov li cas los ntawm cov kiv cua muaj peev xwm ua kom muaj cua sov all
Cov khoom siv xaiv
{{01. siab thermal conductivity substrate: Xaiv cov ntaub ntawv substrate nrog lub thermal conductivity, xws li ceramic puvFr -4lossisHlau Raws Li Board, tuaj yeem txhim kho lub tshav kub zuag qhia tag nrho kev ua haujlwm ntawm PCB .
2. hyper ntawv ci thickness: nce cov thickness ntawm innerper tooj liab muaj peev xwm thiab pab faib kom kub sab hauv pcb .
3.} i thermal conductive adhesive thaum sib txawv tuaj yeem tsim kev ua kom zoo thermal thiab txo cov pa hluav taws xob zoo .
4.} theem hloov cov khoom siv: theem hloov chaw (PCMS) tuaj yeem nqus cov cua sov {
Pcb Board Raug
Pcb Luam Circuit Co Board Raug
WireCing PCB raug
Pcb Board Los Ua Ke Chaw Tsim Tshuaj
Yuav ua li cas yog PCB tsim
multilayer pcb raug
PCB Cov laug cam raug