Los ntawm kev sib koom ua ke ntawm kev xaiv cov khoom siv, kev tswj xyuas thermal, kev tsim qauv tsim hluav taws xob, thiab kev tswj cov txheej txheem precision, siab - zaus PCB boards tuaj yeem ua tau raws li qhov xav tau nruj ntawm RF thiab microwave siab - lub zog amplifiers, daws peb qhov mob tseem ceeb ntawm cov teeb liab poob, thermal tsis ua hauj lwm, thiab impedance mismatch nyob rau hauv siab zog.
Core substrate xaiv: Ntsuas RF kev ua tau zoo thiab thermal conductivity
Qhov tseem ceeb ntawm qhov tsis sib xws ntawm siab - lub zog amplifiers yog qhov sib npaug ntawm cov teeb liab poob qis thiab muaj peev xwm ua kom muaj cua sov siab, thiab nws yog qhov tsim nyog los xaiv cov laug cam kom haum.
Me thiab nruab nrab fais fab PA scenarios: Rogers RO4350B nrog lub thermal conductivity ntawm 0.69W / m · K yog nyiam, Dk@10GHz =3.48, Df@10GHz =0.0037, thermal conductivity yog ob npaug ntawm qhov zoo tib yam FR-4, thiab nws yog sib xws nrog cov pa PCB tsim cov txheej txheem.
High power RF/microwave scenario: RT/duroid 6035HTC raug xaiv, nrog cov thermal conductivity ntawm 1.44W/m · K, uas yog 2.4 npaug ntawm tus qauv siab - cov ntaub ntawv zaus. Nws yog tsim tshwj xeeb rau siab - lub zog ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntawm GaN cov raj xa hluav taws xob.
Me me PA module scenario: Siv Rogers TMM10, Dk=9.20 tuaj yeem txo qhov loj me ntawm 1/4 wavelength txuam network, nrog rau thermal conductivity ntawm 0.76W / m · K, ntsuas qhov me me thiab cov cua kub dissipation.
Copper foil xaiv: Lub siab -frequency signal path siv ultra- low profile tooj liab foil (HVLP, Rz<2 μ m) to suppress conductor loss caused by skin effect; The high current carrying path uses 2oz-4oz thick copper foil to enhance the current carrying capacity.
Thermal Management System Tsim: Tshem tawm cov cua kub tsis ua haujlwm ntawm cov khoom siv hluav taws xob
Kev ua haujlwm ntawm GaN cov cuab yeej hauv siab - lub zog amplifiers tsuas yog 50% -65%, thiab 35% -50% ntawm lub zog siv hluav taws xob hloov mus rau hauv tshav kub, xav tau kev tsim kho ntawm ntau theem hluav taws xob cov kab hluav taws xob:
Cov txheej txheem cua sov yooj yim: Ib qho siab - ntom thermal los ntawm - qhov array nrog ib txoj kab uas hla ntawm 0.2-}0.3 hli yog teem rau hauv qab lub thermal ncoo ntawm lub hwj chim raj, thiab lub qhov yog tag nrho metalized kom ncaj qha tshav kub mus rau hauv qab loj-thaj av grounding tooj liab txheej, txo thermal kuj ntau tshaj 40%.
Kev siv lub zog ua kom muaj zog: Kev siv cov khoom siv tooj liab npib, cov tooj liab ntshiab yog embedded nyob rau hauv txoj hauj lwm installation ntawm PCB fais fab khoom, thiab cov cua sov tuaj yeem xa ncaj qha los ntawm dielectric txheej rau kev xa tawm, tsim rau ultra- kub kub flux density scenarios saum 10W / cm ².
Layout optimization: Ua kom muaj cua sov siab lub hwj chim raj ntawm ntug ntawm PCB ze ntawm lub dab dej sab nraud kom tsis txhob muaj qhov kub thiab txias; Lub hwj chim txoj kev tooj liab ntawv ci ib feem qhib qhov rais kom nthuav tawm tooj liab, thiab ncaj qha txuas mus rau sab nraud tshav kub dissipation qauv los ntawm thermal conductive silicone roj, ntxiv txo qhov cuam tshuam thermal kuj.
Electromagnetic qauv optimization: kom ntseeg tau cov teeb liab kev ncaj ncees thiab stability
Qhov sib txuam network ntawm siab - lub zog amplifiers yog qhov tseem ceeb heev rau kev hloov pauv ntawm impedance thiab yuav tsum tau tsim cov qauv tsim los txhawm rau txo cov teeb meem kev xav thiab kev xav ntawm tus kheej
Kev tswj nruj impedance: tus yam ntxwv impedance kam rau ua ntawm 50 Ω yog tswj nyob rau hauv ± 5%, thiab 1/4 wavelength microstrip kab yog qauv thiab calibrated ua ntej siv electromagnetic teb simulation software (HFSS) kom tsis txhob kub hloov ua rau Dk drift thiab txuam network offset.
Grounding thiab shielding tsim: Txais ib tug multi- txheej board "cib av teeb liab" sandwich qauv, ib tug tiav thiab undivided grounding dav hlau yog teem rau hauv qab ntawm lub hauv paus cheeb tsam ntawm lub hwj chim amplifier; Hlau los ntawm laj kab yog teem rau ntawm ob sab ntawm lub teeb liab txoj kev kom cais crosstalk ntawm txawv amplifier raws thiab suppress tus kheej -zoo siab oscillations tshwm sim los ntawm parasitic coupling.
Ntim thiab los ntawm kev ua kom zoo: txo qis ntawm lub zog transistor ncoo thaj tsam raws li kev simulation kom txo tau cov kab mob cab; Lub siab -ceev teeb liab los ntawm- qhov tau txais cov cuab yeej rov qab drilling kom tshem tawm cov seem seem ntawm tus ncej tooj liab thiab tsis txhob hnov qab cov ntsiab lus nyob rau hauv cov zaus band siab tshaj 20GHz, uas yuav ua rau muaj kev sib tsoo.
Precision txheej txheem tswj: ua tiav kev ntseeg siab ntau lawm
Kev kho qhov saum npoo: Cov tshuab siv nyiaj tso nyiaj yog nyiam rau siab - cov teeb liab zaus txoj hauv kev, txo tus neeg xyuas pib poob los ntawm 0.2dB piv rau kub deposition / inch@10GHz Tib lub sijhawm, xyuas kom meej qhov flatness ntawm cov ntaub qhwv thiab tsis txhob tshaj qhov vuam void tus nqi siab - cov khoom siv fais fab.
Laminated raug: nruj me ntsis tswj lub thickness kam rau ua ntawm lub dielectric txheej nyob rau hauv ± 0.02mm los xyuas kom meej impedance sib xws; Lub PTFE thiab FR-4 sib xyaw nias phaj txais cov txheej txheem cua sov thiab nias kom tsis txhob delamination thiab dielectric qhov sib txawv.
Kev txheeb xyuas ib puag ncig: Lub rooj tsavxwm tiav tau dhau 100 lub voj voog kub ntawm -40℃mus rau +85℃kom paub tseeb tias lub zog amplifier tso tawm lub zog hloov pauv tsawg dua 0.5dB ntawm qhov kub sib txawv, ua tau raws li qhov xav tau ntawm kev ua haujlwm hnyav xws li chaw nres tsheb sab nraum zoov thiab tsheb radars.