Rigid flex printed circuit boardsmuab cov kev daws teeb meem tshwj xeeb rau cov khoom siv hluav taws xob niaj hnub nrog lawv cov duab sib txawv thiab ntau thiab tsawg.
Qee qhov nruj flex luam tawm Circuit boards (xws li cov ntawv luam tawm hauv Circuit Court boards siv hauv cov khoom siv hnov lus) yog qhov nyuaj heev rau kev tsim khoom vim lawv qhov me me. Txawm li cas los xij, tsis hais qhov loj npaum li cas, qhov tsim ntawm qhov kev hloov pauv ntawm flex Board thiab lub rooj tsavxwm nyuaj cuam tshuam rau kev ntseeg siab ntawm kev tsim khoom thiab kev siv tom ntej. Qhov chaw hloov pauv yog raug rau cov neeg kho tshuab thiab thermal stresses, uas yog los ntawm kev tsim khoom thiab kev sib dhos, nrog rau ntau yam kev siv hauv lub neej txhua hnub. Yog li ntawd, thaum tsim qauv, nws yog ib qho tsim nyog yuav tsum paub meej txog qhov muaj feem cuam tshuam los ntawm kev tsim tsis zoo.
Raws li tus qauv IPC-6013, qhov kev hloov pauv ntawm rigid flex printed circuit board tau txhais tias yog thaj chaw uas muaj qhov dav ntawm 3 hli nyob rau ntawm ntug axis ntawm lub rooj tsavxwm nyuaj (saib daim duab 1).
(Daim duab 1: Kev Hloov Hloov Cheeb Tsam ntawm rigid flex printed circuit board Joint Plate (Source: NCAB rigid flex printed circuit board Joint Plate Design Guidelines))
Cov kev sib tw tshwj xeeb hauv kev tsim khoom
Cov txheej txheem ntau lawm ntawm flex rigid board yog txawv ntawm cov pa rigid board. Tom qab lamination tiav nyob rau hauv lub flex board cheeb tsam, tag nrho cov ntaub ntawv yuav undergo kawg lamination rau daim ntawv cog lus flex board rau lub hardboard cheeb tsam. Ua ntej thib ob nias, shims yuav muab tso rau hauv pawg kom tiv thaiv cov resin los ntawm qhov chaw mos ntawm lub rooj tsavxwm, thiab tom qab ntawd cov shims hauv Felix printed board cheeb tsam yuav raug tshem tawm los ntawm cov txheej txheem milling.
Daim duab 1 kuj tseem teev qee qhov kev tsis txaus ntseeg nyob rau hauv thaj chaw hloov pauv, uas yuav muaj kev cuam tshuam tsis zoo rau qhov kev ua tau zoo kawg ntawm flex rigid board yog tias muaj cov yam ntxwv ua haujlwm tau siv nyob rau hauv thaj chaw hloov pauv.
Nov yog qee qhov tsis xws luag thiab lawv qhov cuam tshuam:
Cracking thiab Halo
Nyob rau ntawm qhov sib txuas ntawm lub hardboard thiab flex board, cov khoom delamination, resin cracking, los yog tooj liab foil tawg feem ntau tshwm sim vim lub thickness hardboard thiab nyias flex board, uas tsim ib tug stepped qauv tom qab lamination. Thaum khoov lossis thermal cycling, kev ntxhov siab yog nyob ze ntawm txoj kab kev hloov.
Lamination Voids
Qhov sib txawv laminated nyob rau hauv qhov chaw hloov pauv tau txais. Flex rigid boards feem ntau yog tsim los ntawm FR4 cov khoom thiab polyimide. Lub prepreg ntawm cov boards zoo tib yam yog siv los ntws thiab sib khi cov txheej tooj liab thaum tiv thaiv kev sib txawv ntawm interlayer. Lub FR4 prepreg ntawm lub flex rigid board muaj "tsawg txaus" los yog "tsis txaus" cov yam ntxwv, uas tiv thaiv resin los ntawm ntws mus rau hauv lub flex board cheeb tsam, yog li tej zaum yuav muaj lamination qhov sib txawv nyob rau hauv qhov chaw hloov.
Resin overflow (Squeezeout)
Txawm hais tias pcb cov chaw tsim khoom siv tsis ntws PP los tsim cov flex rigid boards, qee zaum cov resin ntawm cov khoom nplaum tseem dhau los ntawm ntug ntawm lub rooj tsavxwm nyuaj thiab nkag mus rau qhov chaw hloov pauv. Rau qhov yuav tsum tau muaj ntawm ib qho -lub sij hawm Flex rau nruab, qhov no yuav tsis muaj teeb meem; Txawm li cas los xij, vim yog daim ntawv thov ntawm Dynamic Flex, cov npoo ntse ntawm cov khoom siv kho mob tuaj yeem ua rau lub flex board puas.
Protruding Rigid Dielectric Khoom
Thaum milling lub flex board cheeb tsam, me ntsis protrusion ntawm lub hard board dielectric txheej yuav tshwm sim vim laminated voids los yog resin overflow. Qhov kev tsis zoo no tsis cuam tshuam rau kev ua haujlwm thiab ua tau raws li tus qauv IPC-6013.
Tooj liab Deformation
Vim yog cov khoom tsis ruaj khov nyob rau hauv qhov chaw hloov pauv, tooj liab cov yam ntxwv tuaj yeem ua rau deformation thiab tej zaum yuav pom cov kab nrib pleb lossis delamination. Qhov no yog vim tooj liab tuaj yeem cuam tshuam cov resin filling, ua rau cov resin tsis txaus. Tsis tas li ntawd, qhov tseeb ntawm interlayer alignment kuj tseem cuam tshuam.
Coverlay Protruding
Muab cov ntaub ntawv npog rau hauv qhov chaw hloov pauv kuj yuav ua rau muaj teeb meem. Kev tsim ntawm lub npog zaj duab xis tsis haum rau kev sib txuas nrogFR4cov khoom siv, thiab yog tias nws txuas mus rau thaj tsam kev hloov pauv, nws yuav ua rau delamination vim kev sib raug zoo tsis zoo.
Kev tsim tshwj xeeb hauv thaj chaw hloov pauv: kev pheej hmoo thiab kev txiav txim siab
Cov lus nug tseem ceeb yog: nyob deb npaum li cas tuaj yeem ua haujlwm ntev mus rau thaj chaw hloov pauv yam tsis muaj kev cuam tshuam cov khoom lag luam lossis ua rau muaj kev ntxhov siab ntau dhau? Cov lus teb yog: nws yuav luag tsis yooj yim sua kom txuas ntxiv. Raws li pom nyob rau hauv daim duab 2, txawm hais tias nws yog technically muaj peev xwm tsim thiab tsim cov yam ntxwv nyob rau hauv lub hloov chaw thiab txawm lub flex board cheeb tsam, qhov no tsis yog ib tug paub tab mus kom ze. Yog li ntawd, kev sib txuas lus ze nrog koj tus neeg muag khoom pcb yog qhov tseem ceeb. Pab pawg kws tshaj lij ntawm pcb tus neeg muag khoom yuav tsum nkag siab txog qhov txwv qhov tseem ceeb ntawm txhua tus txheej txheem muaj peev xwm, thiab lawv yuav qhia koj txog qhov chaw muaj nyob hauv thaj chaw hloov pauv raws li lub Hoobkas muaj peev xwm thiab cov lus qhia tshwj xeeb.
(Daim duab 2: Advanced Manufacturing Capability (Source: NCAB rigid flex printed circuit Board Design Guidelines))
Hauv daim duab 2, cov txiaj ntsig pom zoo tau teev nyob rau sab laug muaj qhov pheej hmoo tsawg tshaj plaws. Yog tias siv cov lus qhia tshwj xeeb hauv kab "Advanced" ntawm sab xis, yuav tsum tau ceev faj ntxiv kom ntseeg tau tias txhua tus neeg muaj feem cuam tshuam nkag siab txog qhov muaj feem cuam tshuam.
Qhov sib txawv ntawm miniaturization thiab kev txhim kho ntawm kev tsim muaj peev xwm
Nrog rau kev hloov kho tas mus li thiab rov ua dua tshiab ntawm cov cuab yeej siv hluav taws xob, cov kev daws teeb meem tshiab thiab cov txheej txheem tsim khoom txuas ntxiv mus kom tau raws li cov kev xav tau tshiab niaj hnub ntawm cov khoom siv niaj hnub no. Qhov sib txawv ntawm miniaturization yuam cov txheej txheem soft hard bonding board mus tas li los ntawm cov txheej txheem txwv. NCAB ib txwm txhawb kom tshawb nrhiav kev tsim kho tshiab thiab txiav- cov thev naus laus zis hauv pcb tsim, yog tias nws ua tau raws li cov kev xav tau ntawm daim ntawv thov thiab txhua tus neeg muaj feem tau paub txog cov kev pheej hmoo.
Qee lub tuam txhab pcb tuaj yeem txhawb nqa cov khoom lag luam nruj flex luam tawm Circuit Court boards nrog cov chaw hloov pauv me me, tab sis nws tseem pom zoo kom koj ua cov kev tshuaj xyuas nruj rau lawv. Nyob rau tib lub sijhawm, kev saib xyuas yuav tsum tau them rau:
Tsis txhob tso cov haujlwm tseem ceeb hauv thaj chaw hloov pauv
Sib tham nrog cov neeg muag khoom kom nkag siab txog lawv lub peev xwm tsim khoom thiab qhov kev pheej hmoo txaus ntshai
Ntsuas kev tsim kho tshiab thiab kev ntseeg tau raws li cov ntawv thov, kom ntseeg tau tias tus qauv tsim yog ob qho tib si txiav -ntev thiab siv tau
Engineering xyaum ntawm Rigid Flex Printed Circuit Board Transition Zone Tsim
1. Kev soj ntsuam kev pheej hmoo thiab kev sib txuas lus thaum lub sij hawm tsim qauv
Kev sib koom tes thaum ntxov nrog cov neeg muab khoom siv: Kev sib txuas lus yuav tsum tau tsim nrog tus neeg muag khoom pab neeg ua haujlwm engineering thaum lub sijhawm tsim qauv. Cov kev qhia tshwj xeeb ntawm thaj chaw hloov pauv (xws li qhov dav, kev xaiv cov khoom siv) yuav txawv nyob ntawm qhov chaw tsim khoom muaj peev xwm, thiab qee tus neeg muag khoom tuaj yeem txhawb nqa qhov kev hloov pauv me me (xws li 3 hli hauv qab IPC 6013 tus qauv), tab sis qhov no yuav tsum muaj kev pom zoo sib faib kev pheej hmoo.
Simulation thiab kev ntsuam xyuas kev ntxhov siab: Qhia txog FEA (Finite Element Analysis) cov cuab yeej hauv kev tsim los simulate qhov kev ntxhov siab nyob rau hauv qhov kev hloov pauv nyob rau hauv cov cuab yeej khoov thiab thermal cycling, uas tuaj yeem pab txheeb xyuas cov ntsiab lus tsis muaj zog, tshwj xeeb tshaj yog nyob rau hauv dynamic dabtsi yog khoov daim ntawv thov. Piv txwv li, txoj kev taw qhia ntawm cov xaim nyob rau hauv qhov chaw hloov pauv yuav tsum tsis txhob ua rau qhov sib npaug ntawm cov axis dabtsi yog khoov kom ntau li ntau tau kom tsis txhob muaj kev pheej hmoo ntawm kev puas tsuaj.
2. Kev xaiv cov khoom siv thiab kev hloov chaw optimization
Ntsuas cov yam ntxwv ntawm qhov qis qis / tsis muaj dej ntws PP: Hauv cov haujlwm tseem ceeb, nws raug nquahu kom tham nrog cov neeg muag khoom seb puas tuaj yeem siv cov khoom sib xyaw ua ke, xws li siv cov nplaum tshwj xeeb hauv cov chaw hloov pauv kom sib npaug ntawm cov khoom ntws tswj thiab interlayer bonding zog.
Kev kho thaj tsam ntawm qhov npog zaj duab xis thiab thaj chaw nyuaj: Kev nthuav tawm cov npog zaj duab xis (Coverlay) mus rau qhov chaw hloov pauv yuav ua rau muaj teeb meem delamination. Hauv cov xwm txheej ua tau zoo, tej zaum yuav muaj qhov xwm txheej uas qhov hloov pauv hloov pauv ntawm lub rooj tsav xwm Circuit Court boards tshem tawm vim qhov tsim tsis zoo ntawm lub npog zaj duab xis. Nws raug nquahu kom ua kom muaj kev nyab xeeb ntawm qhov tsawg kawg nkaus ntawm 0.5 hli ntawm ntug ntawm lub npog zaj duab xis thiab ciam teb ntawm lub rooj tsav xwm nyuaj thaum tsim, thiab kom paub meej tias tus neeg muag khoom qhov kev ua haujlwm raug ua ntej tsim khoom.
3. Cov ntsiab lus tseem ceeb ntawm kev tswj kom zoo thaum lub sijhawm tsim khoom
Cov qauv tsim nyog rau kev hloov pauv tsis xws luag: Txawm hais tias IPC -6013 tus qauv tso cai rau qee qhov kev tsis xws luag hauv thaj chaw hloov pauv (xws li laminated voids, resin overflow), nws raug nquahu kom cov neeg siv khoom thov cov lus qhia ntxaws ntxaws los ntawm cov neeg muag khoom thaum txais kev lees paub, tshwj xeeb tshaj yog rau cov khoom muaj kev ntseeg siab (xws li kev kho mob lossis kev siv dav hlau ntev), uas tuaj yeem pab txheeb xyuas qhov muaj feem cuam tshuam txog kev pheej hmoo.
Kev tswj xyuas qhov tseeb ntawm cov txheej txheem milling: Thaum milling qhov chaw mos ntawm lub rooj tsavxwm, qhov tseeb machining ncaj qha cuam tshuam rau dielectric protrusion lossis resin ntse ntug teeb meem nyob rau hauv qhov chaw hloov. Hauv peb qhov kev coj ua, peb tau ntsib qhov teeb meem ntawm qhov chaw mos board puas tsuaj los ntawm kev sib txawv ntawm milling, uas tau daws thaum kawg los ntawm kev kho cov milling tsis (xws li ceev thiab pub tus nqi) nrog tus neeg muag khoom. Nws raug nquahu kom ua me me - ntsuas kev tsim khoom nyob rau theem pib ntawm kev tsim khoom los xyuas cov txheej txheem kev ruaj ntseg.
4. Sib phim daim ntawv thov scenarios nrog kev hloov chaw tsim
Qhov txawv ntawm ib qho -lub sij hawm khoov thiab dynamic dabtsi yog khoov: Hauv kev xyaum, peb tau pom tias ntau tus neeg siv khoom tsis meej qhov txawv ntawm ob qhov kev thov no, ua rau muaj kev saib xyuas dhau los lossis kev tsim qauv nruj heev. Piv txwv li, ib qho - lub sij hawm khoov cheeb tsam tuaj yeem lees txais cov khoom ntws tawm kom tsim nyog, thaum lub zog khoov yuav tsum muaj kev tswj hwm nruj ntawm txhua qhov ntse hauv cheeb tsam kev hloov pauv.
Cov kev sib tw nyob rau hauv cov qauv ntawm miniaturization: Nrog rau kev thov kom nruj flex luam tawm Circuit Court boards vim cov cuab yeej miniaturization (xws li cov khoom siv hnav, cov khoom siv hnov lus), qhov chaw tsim ntawm qhov chaw hloov pauv tau ntxiv compressed. Nws raug pom zoo tias cov neeg siv khoom tseem ceeb ua kom zoo dua qub, xws li txo cov thickness ntawm lub rooj tsavxwm nyuaj lossis kho qhov chaw ntawm lub rooj tsavxwm hloov tau yooj yim, kom tso tawm ntau qhov chaw hloov pauv, thaum tshawb xyuas qhov tsim los ntawm kev ntsuam xyuas kev ntseeg siab (xws li bending cycle test).
5. Hom kev ua tsis tau zoo nyob hauv thaj chaw hloov pauv
Piv txwv li, tooj liab kab tawg, interlayer delamination, los yog txo dielectric zog. Cov teeb meem no feem ntau cuam tshuam nrog kev xav tsis txaus ntawm ib puag ncig yam tseem ceeb (xws li qhov kub thiab txias caij tsheb kauj vab) thaum lub sij hawm tsim qauv. Nws raug nquahu kom cov neeg siv khoom ua Accelerated Aging Test nyob rau theem tom ntej ntawm kev tsim cov khoom lag luam kom simulate kev ntxhov siab nyob rau hauv cov kev siv tiag tiag.
Kaw voj kev sib koom tes los ntawm kev tsim mus rau kev tsim khoom
Kev tuav ntawm qhov kev hloov pauv hauv cov ntawv nruj flex luam tawm Circuit Board muaj kev sib koom tes ntawm kev tsim, tsim khoom, thiab daim ntawv thov scenarios. Peb ib txwm pom zoo:
Kev tsim qauv rau pem hauv ntej: Ua tib zoo xav txog txhua yam thiab thermal stresses nyob rau hauv qhov chaw hloov pauv thaum lub sij hawm tsim, thiab siv cov cuab yeej simulation thiab cov tswv yim tswv yim los txhim kho cov kev daws teeb meem.
Kev tswj hwm kev tsim khoom: Ua haujlwm nrog cov neeg muag khoom kom ntseeg tau tias cov txheej txheem tsim khoom (xws li milling thiab lamination) ua tau raws li qhov xav tau ntawm kev tsim, thiab ua qhov kev txheeb xyuas zoo ntawm cov nodes tseem ceeb.
Kev hloov pauv ntawm daim ntawv thov: Kho cov tswv yim tsim raws li cov khoom siv yuav tsum tau ua (ib qho -lub sij hawm khoov lossis dynamic dabtsi yog khoov) kom muaj kev sib npaug ntawm kev ua tau zoo thiab kev ntseeg tau.
Yog hais tias koj muaj tej yam yuav tsum tau hais txog nruj flex printed Circuit Court boards, thov koj xav tiv tauj peb thiab peb yuav muab kev pab txhawb nqa rau koj.
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