Raws li cov tseem ceeb tivthaiv ntawm cov khoom siv hluav taws xob zoo nkauj, cov kev ua haujlwm ntawm Rigid Flex Sau cov khoom siv hluav taws xob tsuas yog siv cov khoom siv, cov txheej txheem raug, thiab tsim qauv kev ntseeg tau. Cov hauv qab no yog cov ncauj lus kom ntxaws kev tshuaj xyuas ntawm cov nyom thiab cov kev daws teeb meem:
1, nyuaj nyob rau hauv cov ntaub ntawv thiab Lamination ua yeeb yam
Coefficient ntawm thermal expansion (CTE) tsis sib xws
CTE qhov sib txawv ntawm cov khoom siv nyuaj (F4) Thiab cov chaw tso nyiaj (pi substrate) yog qhov loj, thiab nws yog tus mob delamination lossis warping thaum lamination vim cua sov kev ntxhov siab.
Kev daws: Xaiv cov ntaub ntawv sib txuas tau sib xws (xws li excepreg), ua kom zoo dua lub compression kub nkhaus (xws li segmented cua sov) thiab tswj hwm siab.
Kev sib xyaw ntawm cov khoom hloov chaw
Kev hloov los ntawm tuab tooj liab (1oz) ntawm cov nyuaj board rau nyias tooj liab (0.5oz) ntawm Flex Board yuav tsum tau du kom tsis txhob muaj kev ntxhov siab.
2, precision machining thiab cov kev sib tw
Qhov ua kom muaj qhov tseeb ua ntej
Cov txheej txheem sib thooj ntawm ntau {{}}}}}}}}}}}}}}} {μ 1 μ m, txwv tsis pub nws yuav ua rau cov kev ua haujlwm ntawm cov hluav taws xob lossis tsheb sib nrug.
Kev daws: Txais yuav cov txheej txheem kho kho kho qhov muag (qhov tseeb ± 10 μ m) thiab ntau cov txheej txheem kev pom.
Drilling thiab Etching tswj
Cov neeg kho tshuab drilling yog txwv tsis pub muaj thaj chaw hloov tau (nquag ua kua muag), thiab laser dig muag qhov (aperture tsawg dua lossis sib npaug nrog 0.2 hli) yuav tsum muaj.
Kev daws: laser drilling + lub nplhaib ntiv nplhaib ntau dua los yog sib npaug rau 0.3mm kom tsis txhob tawg.
3, vuam thiab kev ntseeg tau teeb meem
Refleflow Soldering kev ntxhov siab tawg
Lub chaw muag khoom nyuaj rau kev tawg lossis kev hloov pauv ntawm cov yas sib koom ua ke vim cua sov thaum lub siab {}}} kub refrow soldering.
Kev daws: Ua kom zoo Pad Tsim (te teDrop zoo li lub rooj zaum qhib) thiab nkhaus kub (xws li txo qis kub).
Dunamic bending qaug zog
Rov qab khoov rau hauv thaj chaw hloov tau yooj yim tuaj yeem ua rau muaj kev nkees nkees tawg (xws li tooj liab ntawv ci).
Kev daws: Cov kev taw qhia yog sib tshuam rau cov khoov tus kab mob Axis, thiab cov burnively voj voog yog ntau dua los yog sib npaug ntawm 10 zaug tuab ntawm lub rooj tsavxwm.
4, Tsim kev tsim qauv thiab kev siv tau
Kev Cuam Tshuam Kev Kho Lus
Qhov sib txawv ntawm lub dielectric constant ntawm thaj chaw sajible (ε r ≈ 3.5) thiab cov kab sib zog ntawm 50 / 6Mil rau 5 / 7mil).
Kev Kuaj Siab Beliability
Nws yuav tsum tau raug txheeb xyuas los ntawm kev kub siab thiab cov av noo (85 qib
5, Ntau Lawm Ua hauj lwm thiab tus nqi tswj
Ntev Ntau Lawm
Piv txwv li, lub voj voog tsim ntawm 12 txheej Rigid Flex Sau Cov Hluav Taws Xob Hluav Taws Xob yog 30% ntev dua li cov pcb tsis tu ncua.
Kev daws: Cov khoom siv rau cov khoom siv (xws li kev tshawb nrhiav Aoi) thiab cov txheej txheem tswj kev tswj hwm.
YUG kev txhim kho
Cov khoom siv tau muaj siab (pi substrate yog 2-3 zaug kim dua li fr4), thiab cov txiaj ntsig xav tau txhim kho los ntawm cov txheej txheem ua kom zoo dua (xws li Lamination tsis sib xws).