1, Ua ntej nkag siab: qhov kev kho saum npoo yog dab tsi daws tau tiag tiag
Tooj liab liab oxidizes los ntawm lub caij nws yog etched thiab tsim ib txheej oxide nyob rau hauv ob peb teev. Lub hom phiaj tseem ceeb ntawm kev kho saum npoo tsuas yog ob qho:
Tiv thaiv tooj liab nto los ntawm oxidation thiab vulcanization thaum khaws cia thiab vuam txheej txheem;
Xyuas kom meej tias lub solder tuaj yeem ntub cov ntaub so ntswg thaum vuam.
Cov txheej txheem peb txoj kev no ua tiav tib lub hom phiaj nyob rau hauv ntau txoj kev sib txawv, uas txiav txim siab lawv qhov sib txawv hauv kev sib luag, kev ua kom sov, lub neej cia, thiab tus nqi. Nco ntsoov cov kab lus no: tsis muaj kev kho qhov chaw zoo tshaj plaws, tsuas yog qhov zoo tshaj plaws match.
Dimension tin spraying HASL immersion kub ENIG OSP
Nto muaj pes tsawg leeg: Tin silver tooj liab alloy (dawb lead-dawb), nickel txheej + kub txheej, organic tiv thaiv zaj duab xis
Kev tsis zoo (nrog cov tin nodules thiab meniscus), siab heev (≈ 0.1 μ m theem), siab tshaj
Lub sijhawm khaws cia 3-12 lub hlis 6-12 lub hlis lossis ntau dua 3-6 lub hlis
Zoo reflux kuj (ntau zaus), zoo heev (4-10 zaug), pluag (1-2 zaug)
2-3 theem qis tshaj ntawm tin txau nrog tus nqi qis tshaj plaws
Tej yam scenario plugins, coarse spacing, tswj vaj huam sib luag BGA / zoo spacing, siab cia siab rau ib tug pass rauv, neeg siv khoom batch board
2, ENIG (Chemical Nickel Kub) - Kev ntseeg siab nyiam, tab sis los ntawm tus nqi
Txheej txheem txheej txheem: Tshuaj deposition, thawj deposit ib 3-6 μ m nickel txheej ntawm liab qab tooj liab raws li ib tug diffusion barrier txheej, thiab ces tso ib tug nyias nyias txheej (0.05-0.1 μ m) los tiv thaiv nickel oxidation. Hauv qab 100℃thoob plaws hauv cov txheej txheem, tsis muaj thermal shock. Cov txheej kub nws tus kheej tsis koom nrog vuam, thiab vuam cov ntaub ntawv Ni Sn intermetallic compounds.
Core zoo
Kev sib tw siab heev: roughness tuaj yeem tswj tau ntawm 0.1 μ m theem, BGA solder npas nrog qhov sib nrug ntawm 0.3mm tuaj yeem sib npaug sib npaug, thiab cov khoom zoo pin tsis txuas;
Lub neej cia ntev: Weldability tseem tsis hloov pauv rau ntau tshaj 12 lub hlis hauv lub tshuab nqus tsev;
Ntau yam reflow tsis kam: tuaj yeem tiv taus 4-10 reflow soldering cycles, haum rau ntau qhov sib dhos lossis kho, nrog lub qhov rais dav dav;
Muaj zog corrosion kuj: Kub yog chemically inert thiab ua tau zoo nyob rau hauv high humidity thiab siab ntsev tsuag ib puag ncig tshaj tin spraying, ua rau nws yuav tsum-muaj rau automotive electronics, industrial tswj, zog cia, thiab lwm yam scenarios.
Risks thiab Shortcomings
Dub Pad: Thaum lub sij hawm immersion nyob rau hauv kub, qhov kev daws teeb meem tawm tsam cov nickel txheej ntau dhau, ua rau oxidation thiab corrosion ntawm cov nickel txheej los ua ib tug nkig dub txheej. Cov tsos mob tseem yuav ci ntsa iab, tab sis lub zog ntawm cov pob qij txha yog qhov tsawg heev. Cov pob qij txha zais xws li BGA / QFN yog qhov txaus ntshai tshwj xeeb, thiab cov teeb meem feem ntau siv sijhawm ntau lub hlis lossis ntau xyoo los nthuav tawm. Cov ntsiab lus tseem ceeb tswj: pH tus nqi ntawm immersion tov (yuav tsum tau khaws cia ntawm 5.0-5.5), phosphorus cov ntsiab lus ntawm nickel txheej (7-10%), thiab thickness ntawm kub txheej;
Lub thicker txheej kub, qhov zoo dua: kub tuab heev yuav yaj mus rau hauv lub solder thiab daim ntawv nkig AuSn ₄, uas yuav ua tau kom txo tau lub zog ntawm solder sib koom. IPC-4552B qhia meej tias cov nickel txheej yuav tsum yog 3.0-6.0 μ m thiab cov txheej kub yuav tsum yog 0.05-0.10 μ m, uas yog qhov zoo tshaj plaws tom qab kev txheeb xyuas dav dav;
Cov txheej kub nyias, tsis hnav-tiv taus: Cov ntiv tes kub txheem yuav tsum tau plated nrog cov kub kub, thiab kub kub yog siv los ntsaws thiab tshem tawm cov kev sib tshuam, feem ntau nthuav tawm tooj liab hauv 50 zaug;
Tsis haum rau kub hlau sib txuas: Nickel yuav tsiv teb tsaws thiab oxidize ntawm txheej kub, thiab nickel palladium kub (ENEPIG) yuav tsum tau siv los hloov;
Tus nqi siab: Siv cov hlau zoo nkauj kub thiab cov txheej txheem tshuaj lom neeg, tus nqi yog kwv yees li 2-3 npaug ntawm cov tshuaj txau.
3, HASL (kub cua leveling) - tus huab tais ntawm tus nqi-zoo, tab sis nrog meej ciam teb
Cov txheej txheem txheej txheem: Lub cev thermal txheej txheem, PCB yog immersed nyob rau hauv molten tin alloy ntawm txog 260 degree, thiab tom qab tshem tawm, tshaj solder yog tshuab nrog ib tug high-pressure kub cua kub riam, tawm hauv lub tin alloy txheej nrog hnyav thermal shock. Muaj cov hmoov txhuas (63Sn / 37Pb, maj mam phased tawm) thiab tsis muaj txhuas (SAC305, melting point txog 217 degree).
Irreplaceable qhov chaw
Cov cuab yeej siv zog siab ntawm cov pob qij txha: cov tin txheej yog tuab (1-40 μ m), uas ncaj qha fuses nrog lub vuam thaum vuam, sib sau ua ke ruaj khov;
Tus nqi qis tshaj: cov khoom siv thiab cov khoom siv nkag tau pheej yig dua, cov txheej txheem paub tab, thiab kho yooj yim;
Zoo meej yoog rau yoj soldering thiab plug-nyob rau hauv cov txheej txheem, cov laug cam nrog los ntawm-lub qhov Cheebtsam raws li lub ntsiab tivthaiv tseem yog nws qhov zoo tshaj plaws scenario.
Tuag tsis muaj zog
Tsis zoo flatness: Ib nrab lub hli nkhaus nto thiab tin nodules yog muaj nyob rau hauv tus txheej txheem, thiab BGA / QFN nrog ib tug sib nrug ntawm tsawg tshaj li 0.5 hli yog ncaj qha tshem tawm. Qhov sib nrug zoo yog qhov yooj yim rau kev sib txuas thiab virtual soldering;
High thermal shock: Qhov kub siab ntawm 260℃tam sim no ua rau muaj kev pheej hmoo ntawm warping thiab delamination rau nyias daim hlau (tsawg dua lossis sib npaug li 0.8mm) thiab ntau txheej phaj;
Lub neej luv luv: Cov tin txheej oxidizes loj heev tom qab 3-6 lub hlis ntawm huab cua, thiab ntau yam kev tiv thaiv xws li lub tshuab nqus tsev ntim khoom yuav tsum tau rau export shipping lossis cov khoom muag mus ntev.
4, OSP (organic solder mask) - Tus nqi qis thiab siab flatness, tab sis lub qhov rais nqaim
Txheej txheem txheej txheem: Siv ib txheej ntawm cov organic compound zaj duab xis (feem ntau yog benzimidazole) nrog ib tug tuab ntawm 0.2-0.5 μ m ntawm cov tooj liab huv si, thiab weld ntawm kub kub kom decompose cov zaj duab xis txheej, exposing tshiab tooj liab nto thiab khi nws nrog solder. Tsis muaj hlau txheej.
Qhov muag loj tshaj plaws
Tus nqi qis heev (ze ze rau qhov nce ntxiv), qhov smoothest nto, thiab zoo meej compatibility nrog 0201 ultra me me li thiab ntom BGA pins;
Tsis cuam tshuam rau lub teeb liab impedance, nws yog ib qho ntawm cov txheej txheem tseem ceeb rau HDI cov laug cam siab ceev, ib puag ncig tus phooj ywg thiab tsis muaj txhuas.
Cov kev txwv pom tseeb
Lub sijhawm khaws cia luv tshaj plaws: txog li 6 lub hlis nyob rau hauv cov xwm txheej kaw, nkag siab rau cov av noo, thiab yuav tsum tau siv sai li sai tau tom qab qhib. Tes hws thiab cov ntiv tes yuav ua rau cov yeeb yaj kiab tiv thaiv puas tsuaj;
Tsawg reflux tsis kam: feem ntau tsuas yog 2-3 zaug, tom qab ntawd nws deteriorates;
Tsis haum rau yoj soldering thiab dhau-qhov txheej txheem;
Tsis tuaj yeem ua kom muaj kev sib cuag, txuas cov qauv, lossis cov cuab yeej siv tau ntev.
5, Xaiv los ntawm scenario: Plaub nqe lus nug los txiav txim qhov kev daws teeb meem
Xaiv Txoj Kev Txiav Txim Siab (Nug koj tus kheej hauv kev txiav txim)
Puas muaj cov khoom siv lossis BGA nrog qhov sib nrug tsawg dua 0.5 hli? Tsis suav nrog tin spraying;
Lub rooj tsavxwm yuav tsum khaws cia ntev npaum li cas? Tshaj 6 lub hlis → txiav txim tawm OSP;
Puas muaj tej yam yuav tsum tau rau high-frequency/xov tooj cua zaus ntsuas? Qhov tseem ceeb yuav tsum tau muab rau cov dab dej los yog kub;
Puas yog tus nqi rhiab rau cov neeg siv khoom batch board? Yog → OSP lossis tin deposition.
Kev sib piv scenario
BGA / nplua qhov sib nrug, high-density precision board → kub deposition, ruaj ntseg tshaj plaws;
Automotive electronics, cov khoom siv kho mob, cov servers, cov khoom lag luam ntev ntev precision → Kub deposition (pom zoo nickel txheej 4-5 μ m thiab kub txheej 0.05-0.1 μ m raws li kev cai automotive);
High zaus / xov tooj cua zaus (5G kav hlau txais xov, microwave module, radar) → nyiaj immersion (tsawg-zaus zaus poob) los yog kub immersion;
Plug nyob rau hauv oriented, ntxhib sib nrug, nqi rhiab → tin spraying (lub hwj chim board, me me khoom, zoo tib yam industrial tswj board);
Ib zaug dhau, luv-term turnover neeg siv batch board → OSP;
Qhov chaw zoo kom txuag tau nyiaj → Tin deposition (lub tiaj tus qauv ntawm tin spraying raws li ib qho kev xaiv, ib tug nqi-zoo nruab nrab xaiv);
Kub ntiv tes, connectors, khawm hu → electroplated hard kub (hnav-tiv taus), uas tsis tuaj yeem hloov los ntawm qhov zoo tib yam immersion kub.
Peb txoj kev xav tsis zoo
Lub thicker cov kub siv rau immersion, qhov zoo dua ": Ntau thickness ua tau nce brittleness. Ib txheej kub ntawm 1-3 μ" yog txaus, thiab cov uas xav tau tiag tiag tuab kub yog hu rau zoo li kub ntiv tes, uas yuav tsum tau coated nrog nyuaj kub;
Yog tias OSP pheej yig, ces txhua tus yuav tsum siv OSP. "Thaum muaj ntau phau ntawv ua haujlwm ntawm cov kab ntau lawm thiab cov laug cam yuav tsum tau xa mus rau hauv cov khoom siv, qhov tsis txaus ntawm OSP yuav raug nthuav tawm sai;
Kev kho deg tsis cuam tshuam rau impedance: Kev kho saum npoo yuav hloov me ntsis cov thickness thiab poob ntawm tus neeg xyuas pib nto, thiab cov xwm txheej loj heev yuav tsum tau suav nrog hauv qhov simulation.