Raws li tus neeg nqa khoom tseem ceeb rau siab -frequency signal transmission, the layout and optimization of the laminated structure of RF pcb ncaj qha txiav txim siab qhov ruaj khov, poob qib, thiab tiv thaiv - cuam tshuam muaj peev xwm ntawm cov teeb liab kis tau tus mob. Piv nrog rau cov ntawv luam tawm zoo tib yam, cov qauv laminated ntawm RF luam ntawv Circuit Court boards xav tau kev npaj ntau dua nyob rau hauv cov khoom sib txuam, interlayer layout, thickness tswj, thiab lwm yam kom tau raws li cov kev cai nruj ntawm impedance txuam thiab teeb liab kev ncaj ncees thaum kis tau tus mob siab - zaus signals.
Laminated qauv ntawm RF pcb
Kev sib raug zoo ntawm cov qauv laminated thiab xov tooj cua zaus ua haujlwm
RF teeb liab tau yooj yim cuam tshuam los ntawm cov yam ntxwv xws li dielectric poob thiab electromagnetic cuam tshuam thaum kis tau tus mob, thiab cov qauv laminated yog thawj kab ntawm kev tiv thaiv cov teebmeem no. Lub laj thawj ntawm cov qauv laminated yog tshwm sim hauv kev tswj hwm ntawm cov teeb liab txoj kev - los ntawm kev sib xyaw ntawm cov substrates sib txawv thiab cov txheej txheem interlayer, tus nqi impedance thaum lub teeb liab kis tau zoo tuaj yeem hloov kho kom ntseeg tau tias impedance txuam thiab txo cov teeb liab kev xav.
Lub caij no, qhov nruj ntawm cov qauv laminated kuj tseem ceeb heev. Lub firmness ntawm interlayer bonding ncaj qha cuam tshuam rau stability ntawm cov teeb liab kis tau tus mob. Yog tias muaj qhov khoob lossis npuas ntawm cov khaubncaws sab nraud povtseg, nws tuaj yeem ua rau lub teeb liab tawg thiab poob thaum sib kis, thiab tseem ua rau muaj teeb meem cuam tshuam. Tsis tas li ntawd, tag nrho cov tuab tuab ntawm cov qauv laminated tuaj yeem cuam tshuam rau kev ua haujlwm ntawm cov khoom siv hluav taws xob thiab cov cua sov ntawm RF luam tawm Circuit Board. Cov txheej txheem laminated tuab dhau los yog tsis sib xws tuaj yeem ua rau lub teeb liab sib kis qeeb lossis cuam tshuam rau lub sijhawm ntev - lub sijhawm ua haujlwm ntawm cov khoom siv vim muaj cua sov tsis zoo.
Cov ntaub ntawv xaiv logic rau RF pcb laminated qauv
Cov qauv laminated ntawm RF pcb muaj cov kev xav tau siab heev rau kev ua haujlwm ntawm lub substrate, thiab kev xaiv ntawm substrates ntawm ntau qib yuav tsum tig mus rau "tsawg poob, siab stability". Lub substrate siv rau lub teeb liab txheej feem ntau yuav tsum muaj qhov tsis tshua muaj dielectric tsis tu ncua thiab dielectric poob qhov tseem ceeb kom txo tau lub zog poob ntawm qhov siab - zaus cov cim thaum kis tau tus mob. Xws li cov substrates feem ntau muab tso rau ntawm theem uas cov tub ntxhais teeb liab txoj kev nyob rau hauv lub laminated qauv.
Lub substrate siv rau kev txhawb nqa thiab kev sib cais yuav tsum sib npaug ntawm cov neeg kho tshuab lub zog thiab kev ua haujlwm rwb thaiv tsev, kom ntseeg tau tias cov qauv laminated tsis yooj yim deformed thaum lub sij hawm ua tom qab thiab siv, thaum tsis txhob muaj kev cuam tshuam ntawm interlayer signals. Nyob rau hauv cov txheej txheem lamination, qhov sib piv ntawm thermal expansion coefficient ntawm lub substrate kuj yog ib qho tseem ceeb rau kev txiav txim siab. Yog tias cov thermal expansion coefficients ntawm cov substrates sib txawv ntau dhau lawm, nws yuav ua rau tawg ntawm cov qauv laminated hauv qhov kub thiab txias, cuam tshuam rau kev ntseeg siab ntawm RF pcb.
Qhov cuam tshuam ntawm interlayer layout ntawm teeb liab cais
Nyob rau hauv lub laminated qauv ntawm RF pcb, lub interlayer layout yog tus yuam sij rau kev ua tiav cov teeb liab cais. Los ntawm kev teeb tsa txoj haujlwm sib raug zoo ntawm cov txheej hauv av, txheej txheej hluav taws xob, thiab txheej txheej teeb liab, kev tiv thaiv hluav taws xob zoo tuaj yeem tsim los txo cov kev cuam tshuam ntawm cov teeb liab sib txawv. Piv txwv li, teeb tsa cov txheej hauv av ua tiav hauv qab qhov siab - zaus teeb liab txheej tuaj yeem siv cov nyhuv thaiv ntawm cov txheej hauv av kom nqus tau hluav taws xob ntau dhau thiab txo cov teeb liab cuam tshuam.
Tsis tas li ntawd, kev tswj ntawm interlayer spacing kuj plays lub luag haujlwm tseem ceeb hauv kev sib cais ntawm cov teeb liab. Qhov kev ncua deb ntawm cov txheej txheem ua haujlwm sib txawv yuav tsum tau hloov kho raws li qhov tsis xws li teeb liab zaus thiab lub zog. Yog tias qhov kev ncua deb me me dhau lawm, nws yuav ua rau muaj kev cuam tshuam ntau dhau ntawm interlayer capacitance, uas cuam tshuam rau lub teeb liab kis ceev; Kev sib nrug ntau dhau tuaj yeem txo qhov kev ruaj ntseg tag nrho ntawm cov qauv thiab ua kom cov teeb liab sib kis qeeb. Hauv ntau- txheej RF luam tawm Circuit Boards, kev kho kom zoo ntawm cov txheej txheem interlayer yog qhov tseem ceeb tshwj xeeb vim nws ua kom muaj kev ywj pheej ntawm ntau pawg ntawm siab - zaus teeb liab hauv qhov chaw txwv.