Multi-layer PCB board pressing yog txheej txheem uas ib lossis ntau txheej txheej sab hauv yog etched rau hauv ntau txheej txheej substrate (tom qab kev kho mob oxidation dub) los ntawm cua sov thiab kho ntawm qhov kub thiab txias, thiab tom qab ntawd cov ntawv ci tooj liab txuas nrog. multi-layer substrate. Nias yog txheej txheem tseem ceeb hauv cov txheej txheem ntawm kev ua ntau txheej PCBs.
Yog li dab tsi yog cov teeb meem nrog txoj kev tsuj?
1. Kev kub ntxhov.
Thaum tsim cov boards multilayer uas muaj peev xwm ua tau kom muaj qhov kub thiab txias thiab cov thawv ntim siab, cov qauv laminate tuaj yeem muab tso rau qee lub sijhawm, thiab cov dej vapor tuaj yeem raug yuam mus rau sab hauv ntawm lub thawv. Ces muab nws tawm. Muab cov qauv tso rau ntawm qhov chaw kub-melt tin thiab ntsuas thiab nias nws.
2. Txoj kev tsuj tsoos tsho
Cov txheej txheem lamination ntawm PCB board thaum ntxov. Thaum ntawd, lub" txheej txheej" feem ntau yog siv los laminate thiab nias ib sab ntawm cov ntawv tooj liab. Siv cov ntawv loj tooj liab nias hom.
3. Folding teeb meem
Vim yog kev tuav tsis raug ntawm daim ntawv tooj liab, wrinkles feem ntau tshwm nyob rau hauv nias ntawm multilayer board. Yog li zam qhov teeb meem folding
4. Teeb meem kev nyuaj siab
hais txog kev nyuaj siab thiab sib xws ntawm tooj liab nto thaum ua PCB board. Yog hais tias qhov tooj liab nto yog corroded vim lub zos protrusion ntawm steel phaj siv los ntawm cov xovxwm, cov kev tsis xws luag nyob rau hauv txoj kab, lub high-speed kis tau tus mob impedance yog tsis ruaj tsis khov, thiab lub PCB board tshwm suab nrov.
5. Copper foil compression txoj kev
Nws yog hais txog cov uas twb muaj lawm multilayer board thiab plhaub, ncaj qha compressed nrog tooj liab ntawv ci thiab zaj duab xis los tsim ib tug multilayer board. Thawj zaug ib sab zaj duab xis substrate nias txoj kev. Tau dhau los ua ntau kab loj-loj compression txoj kev.