TusTuab tooj liab hluav taws xob boardAdopts ib qho chaw tuab tuab tuab, thiab tsuas yog siv tooj liab nrog cov kab mob siab (xws li lwm cov teeb liab cov teeb liab tseem siv 35 μ m μ m dog dig tooj liab ntawv ci. Cov qauv siv no tsis tsuas yog ua tau raws li cov kev yuav khoom sib kis siab tam sim no, tab sis kuj tswj cov nqi.
Cov Qauv Txheej Txheem
Kev xaiv substrate: Hloov F-4 lossis polyimide (PI) Piv txwv li, tom qab 1000 qhov ntsuas kub thiab txias rau 125 degree), lub tev tuab ua ke nrog 0.25mm tuab substrate yog tseem siab dua li ntawm dedstrate.
Tooj liab txheej kho: los ntawm kev siv electroplating thev naus laus zis los ua kom cov tuab tuab ntawm tooj liab yog ntsug thiab ua kom zoo dua qub, thiab txhim kho kev coj ua. Cov chaw tooj liab hauv zos yog cov khoom lag luam me me tau muab faib tawm los ntawm cov txheej txheem etching.
Ntau txheej txheej txheej txheem: txhawb nqa ib txheej txheej li txheej, nrog ib qho tuab ntawm lub siab txog 4 hli, thiab ua tiav qhov kev sib xyaw ua ke los ntawm cov tshuab Lamination.
yam uas pab
High tam sim no nqa muaj peev xwm: tuab txheej tooj liab txheej (txog li 500 μ μ}}} cov khoom siv hluav taws xob siab xws li cov khoom siv tsheb hluav taws xob tshiab.
Nqi ua kom tau zoo: tsuas yog zos thickening high cov kab tam sim no, ntsuas ntsuas kev ua tau zoo thiab tus nqi.
Kev ntseeg tau: Lub substrate muaj cov nplaum ua kom muaj zog nrog lub tooj liab txheej thiab tseem ruaj khov txawm tias tom qab high - kub cycling kuaj.