Txhawm rau ua kom lub sijhawm ntev ruaj khov ntawm cov ntawv luam tawm ntawm cov ntawv luam tawm ntawm -55 ° C txog 125 ° C, kev tswj hwm yuav tsum tau ua los ntawm plaub qhov loj me: xaiv cov khoom siv, kev tsim qauv, kev tswj cov txheej txheem, thiab kev soj ntsuam xyuas, sib piv qhov kub thiab txias ntawm cov xwm txheej hnyav xws li kev tswj kev lag luam, automotive electronics, aerospace, thiab lwm yam.
Kev xaiv cov khoom tseem ceeb
Kev xaiv substrate: Cov phaj kub resistant nrog Tg Ntau dua lossis sib npaug ntawm 170℃yuav tsum nyiam, xws li Shengyi S1170, uas nws X / Y axis CTE tsawg dua los yog sib npaug rau 13ppm / degree, kom tsis txhob substrate softening thiab deformation ntawm 125 degree; Rogers RO4350B carbon hydrogen ceramic composite board tuaj yeem xaiv rau cov xwm txheej siab kom ntseeg tau ruaj khov Dk / Df tsis nyob hauv qhov kub thiab txias.
Cov khoom siv sib xyaw ua ke: Lub solder tiv thaiv siv lub hnub ci number case SF-600 hom kub kub, uas tsis muaj xim lossis tev tawm tom qab 1000 teev ntawm 150 degree; Kev kho saum npoo siv cov txheej txheem tshuaj nickel kub deposition, nrog ib txheej npib tsib xee ntawm 3-5 μ m thiab txheej kub ntawm 0.1-0.2 μ m, ntsuas oxidation tsis kam thiab solder kev ntseeg tau.
solder xaiv: SnAgCu tsis muaj txhuas solder (Sn96.5Ag3.0Cu0.5) yog siv, nrog ib tug melting point ntawm 217 degree, kom ua tau raws li cov creep kuj yuav tsum tau ntawm solder pob qij txha nyob rau hauv dav kub mus rau lub dav thiab tsis txhob softening thiab tawg ntawm solder pob qij txha ntawm kub kub.
Tus qauv tsim optimization
Thermal stress relief design: Lub thermal expansion pub ntawm ntau dua los yog sib npaug ntawm 0.5mm yog tseg rau ntawm ntug ntawm PCB pawg thawj coj saib, thiab 0.3mm dav kev ntxhov siab zawj yog teem rau hauv qhov tseem ceeb kom tsis txhob tawg ntawm lub rooj tsavxwm nyob rau hauv kub cycling; Cov teeb liab analog txuas tau txais cov kab nkhaus kom txo tau cov ntsiab lus kev ntxhov siab.
Copper balance thiab pore qauv optimization: nruj me ntsis tswj qhov uniformity ntawm tooj liab faib thoob plaws hauv lub rooj tsavxwm kom tsis txhob warping tshwm sim los ntawm ntau sib txawv nyob rau hauv lub zos tooj liab thickness; Lub qhov los ntawm qhov tau txais cov qauv tooj liab thickened, thiab HDI micro dig muag qhov taub yog tswj nyob rau hauv 0.1 hli los txhim kho cov axial tensile kuj.
Thermal tswj layout: Lub hwj chim cheeb tsam txais ib tug "daim phiaj + khoom" composite tooj liab daim tawv nqaij tsim, ua ke nrog ib tug thermal ntawm array rau ceev ceev ceev; Kev faib tawm ntawm cov khoom siv cua sov kom tsis txhob muaj cua sov hauv zos los ntawm cov cua kub sib xyaw.
Cov txheej txheem tswj
Nias thiab qhov kev kho mob: meej tswj cov kauj ruam nias tsis, cua sov tsawg dua los yog sib npaug li 2℃/ min, tso siab rau sab hauv, thiab tswj lub warpage ntawm ntau txheej boards nrog ntau tshaj 20 txheej hauv qab 0.5%; Txhim kho cov txheej txheem ntawm kev tshem cov khib nyiab drilling thiab roughening lub qhov phab ntsa kom ntseeg tau tias cov uniformity thiab interlayer adhesion ntawm tooj liab txheej ntawm lub qhov.
Vuam txheej txheem optimization: Reflow soldering txais kev tiv thaiv nitrogen (cov ntsiab lus oxygen tsawg dua lossis sib npaug li 500ppm), thiab teeb tsa qhov kub thiab txias cheeb tsam curves: preheating cheeb tsam 150℃± 10℃/ 60s, qhov kub thiab txias cheeb tsam 180℃± 10℃/ 80s, ncov tus nqi 245℃/ 1 MC ens thickness 1 vib nas this. ntawm qhov sib koom ua ke yog tswj ntawm 0.5-3 μm kom txo qis kev ntxhov siab.
Tag nrho cov txheej txheem zoo tswj: Los ntawm AOI tsis siv neeg kho qhov muag tshuaj ntsuam xyuas, X-Ray solder sib koom ua ke tsis pom kev (void npaum li cas tsawg dua los yog sib npaug li 5%), thiab micro slices tsom xam, cov txheej txheem tsis xws luag raug txheeb xyuas thoob plaws hauv tag nrho cov txheej txheem kom tsis txhob muaj kev phom sij zais cia.
Kev ntsuas kub dav thiab kev tiv thaiv
Kev ntsuas ib puag ncig: Raws li IPC-TM-650 2.6.7 thiab MIL-STD-202 cov qauv, ua kom tiav 1000 qhov kub thiab txias ntawm -55℃~ 125 degree, yuav tsum tau hloov impedance tsawg dua lossis sib npaug li 5% thiab rwb thaiv tsev tiv thaiv ntau dua lossis sib npaug ntawm 100M Ω tom qab kev caij tsheb kauj vab; ntxiv kev ntsuas txias thiab kub kub hauv qhov xwm txheej huab cua, ua kom tiav qhov kub thiab txias hloov tsis pub dhau 1 feeb, thiab tshuaj ntsuam sai rau cov thermal qaug zog.
Kev tiv thaiv kev tiv thaiv ntxiv: Cov khoom tseem ceeb tuaj yeem coated nrog silicone raws li peb cov pov thawj xim los yog ultra-thin fluorine nano txheej kom cais cov dej noo thiab corrosive media, thaum tsis cuam tshuam nrog cov teeb liab ntau zaus; Nyob rau hauv muaj zog vibration scenarios, fr4 reinforcement tuav yuav tsum tau nyob rau hauv lub zos ntxiv mus ntxiv txhim khu kev qha kev tiv thaiv kev co.