Aerospace PCB Tshwj Xeeb Substrate Xaiv Phau Ntawv Qhia Tshaj Tawm, Npog Siab Tshaj, Kev Kub Ceev, Thiab Kev Ua Haujlwm Tsis Txaus Siab Daim Ntawv Thov

Nov 06, 2026 Tso lus

Qhov tseem ceeb ntawm kev ua tau zoo rau cov substrates hauv aerospace scenarios

Qhov chaw huab cua tau ntsib los ntawm cov cuab yeej siv dav hlau dav dav tshaj li ntawm cov xwm txheej kev lag luam zoo tib yam, thiab tsib qhov kev xav tau nruj tau muab tso rau pem hauv ntej rau lub substrate:

Kev hloov pauv kub heev: Nws yog ib qho tsim nyog los npog qhov kub ntau ntawm -65℃~ +260℃kom tsis txhob cuam tshuam interlayer delamination thiab pore tooj liab tawg los ntawm mismatched thermal expansion

Kev tiv thaiv hluav taws xob muaj zog: Tag nrho cov tshuaj ionizing (TID) yuav tsum tau tiv thaiv cosmic ray raug tshaj 100krad (Si) los tiv thaiv dielectric parameter drift

Tsawg dielectric thiab siab stability: Tswj ruaj khov Dk / Df tsis nyob rau hauv millimeter yoj zaus band, kom ntseeg tau tias distortion dawb high-ceev teeb liab kis tau tus mob

Tsawg lub tshuab nqus tsev tso tawm: Tag nrho cov khoom tsis hloov pauv hauv lub tshuab nqus tsev ib puag ncig tsawg dua lossis sib npaug li 1% kom tsis txhob kis cov khoom siv kho qhov muag thiab qhov tseeb hauv chav tsev.

Cov neeg kho tshuab siab zog: muaj peev xwm tiv taus random vibrations ntawm 20-2000Hz, mechanical impacts tshaj 50g, thiab kev pab mus sij hawm ntev yam tsis muaj cov yam ntxwv tsis ua hauj lwm

news-608-442

Cov kev xaiv tseem ceeb rau cov xwm txheej ceev thiab cov xwm txheej ceev

Rau high-frequency thiab high-ceev daim ntaub ntawv xws li kev sib txuas lus spaceborne thiab radar, phau ntawv qhia qhia ob tug tseem ceeb xaiv qhov ntev:

Kev tswj xyuas qhov tseeb ntawm dielectric tsis: cov ntaub ntawv nrog Dk kub drift Tsawg dua los yog sib npaug rau ± 0.05 thiab Df Tsawg dua lossis sib npaug rau 0.007 ntawm 10GHz yog qhov nyiam kom tsis txhob muaj teeb meem lub sijhawm drift thiab ntau dhau qhov tso tawm.

Tus neeg xyuas pib poob: Paired nrog ultra-low profile HVLP tooj liab ntawv ci los yog dov tooj liab ntawv ci, nws txo qhov siab-frequency ntxiv poob los ntawm cov tawv nqaij nyhuv thiab xyuas kom meej lub qhov muag daim duab zoo ntawm 56G-PAM4 thiab saum toj no ultra high speed links

 

  • news-521-382

Cov ntsiab cai tseem ceeb thiab kev ua raws li lub hauv paus rau kev xaiv

Phau ntawv qhia txog peb lub hauv paus ntsiab lus rau kev xaiv thiab muab cov ntaub ntawv pov thawj muaj cai:

Qhov tseem ceeb rau kev hloov pauv ib puag ncig: PI / cyanate ester substrates nrog cov hluav taws xob tiv thaiv thiab qhov kub ntau yog nyiam rau lub ntiaj teb qis orbit spacecraft, thaum lub teeb yuag polyphenylene ether substrates tuaj yeem hais qhia rau huab cua huab cua

Kev ua tau zoo sib npaug yam tsis muaj kev rov ua dua: Cov txheej txheem tswj hwm qhov tseem ceeb ntawm kev ntseeg siab, thaum tsis yog cov teeb liab modules tswj cov nqi thaum lub rooj sib tham tshwj xeeb, zam qhov muag tsis pom ntawm cov khoom siv loj thiab pov tseg.

Kev Ua Tau Zoo thiab Kev Ua Tau Zoo: Kev xaiv yuav tsum ua raws li cov qauv tshwj xeeb hauv tsev thiab txawv teb chaws xws li MIL-P-50884, EN24900, GJB2438A, thiab lwm yam.

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Feem ntau xaiv cov ntsiab lus kom tsis txhob pitfalls

Phau ntawv qhia tshwj xeeb qhia txog peb hom kev xaiv ntau zaus tsis meej pem hauv kev lag luam:

Txhawm rau kom tsis txhob tso siab rau tus neeg muab khoom siv nkaus xwb rau ib qho taw qhia Dk / Df tsis, nws yog qhov tsim nyog los koom ua ke cov kev sim ntsuas raws li IPC-TM-650 tus qauv txhawm rau tshem tawm qhov sib txawv ntawm kev simulation thiab kev sim tiag tiag.

Kev sib raug zoo ntawm Z-axis CTE ntawm lub substrate thiab txheej tooj liab tsis tuaj yeem tsis quav ntsej. Rau aerospace daim ntawv thov, Z-axis CTE yuav tsum tau tswj ntawm 12-15ppm / degree, ua raws li cov parameter ntawm 16ppm /℃ntawm cov tooj liab txheej, tiv thaiv lub qhov phab ntsa tawg nyob rau hauv thermal shock.

nruj me ntsis ua ntej hauv, ua ntej tawm (FIFO) kev tswj cov khoom siv rau cov boards thiab cov ntawv kho ib nrab kom tiv thaiv cov khoom siv tas sij hawm los ntawm kev ua rau txo qis hauv lamination adhesion thiab dielectric parameter sib txawv.