Cov Yield Rate Ntawm PCB Ultra Me Me Kev Tsim Khoom Rau Cov Khoom Siv Kho Mob Implantable Tau Tshaj Tawm Kev Lag Luam Benchmark

Kev tsim cov khoom lag luam ntawm ultra me me luam tawm Circuit boards rau implantable kho mob cov cuab yeej tau tshaj qhov kev lag luam kev lag luam, nrog rau cov tuam txhab saum toj kawg nkaus tau ua tiav cov txiaj ntsig ruaj khov ntawm ntau dua 99.7%, deb tshaj qhov kev lag luam yav dhau los nruab nrab ntawm 85%.

Kev lag luam benchmarks thiab cov ntaub ntawv tawg
Cov tshuaj implantable kho mob PCB kev lag luam kev lag luam loj cov txiaj ntsig tau txais txiaj ntsig tau khaws cia nyob ib puag ncig 85% rau lub sijhawm ntev, thaum cov txiaj ntsig ntawm qee qhov me me HDI boards tsuas yog 35%.

Los ntawm 2026, cov tuam txhab kho mob saum toj kawg nkaus PCB yuav ua rau cov khoom lag luam ntau ntau ntawm cov khoom siv hluav taws xob me me rau ntau tshaj 99.7% los ntawm tag nrho cov txheej txheem optimization, nrog rau seem seem qis dua 0.3%, qis dua qhov kev lag luam nruab nrab ntawm 1.2%.

Kev sib dhos cov txiaj ntsig ntawm kev txhawb nqa micro PCBA tau synchronously nce los ntawm cov tsoos 93% mus rau 99.2%, ua tiav ob qho kev sib tw hauv tag nrho cov txheej txheem tsim tawm.

Core yield breakthrough technology txoj kev
Microcircuit etching precision upgrade: siv LDI laser direct imaging technology, kab dav / kab sib nrug siab yog tswj nyob rau hauv ± 2 μ m, thiab luv luv-circuit tsis ua hauj lwm tus nqi ntawm lub Circuit Court yog txo kom qis dua 0.03%, uas yuav stably tsim 25 μ m ultra-thin circuits.

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2. Micro qhov electroplating yield tswj: UV laser drilling txhim kho qhov tseeb ntawm micro qhov ua rau 25 μ m, nrog rau qhov tob rau txoj kab uas hla piv tswj hauv 1: 0.8. Ua ke nrog pulse electroplating thev naus laus zis, tooj liab tsis muaj qhov tsis xws luag hauv lub qhov yog txo kom qis dua 0.1%.

   Kev ua txhaum ntawm kev sib raug zoo ntawm interlayer alignment raug: Nrog siab Tg substrates (Tg Ntau dua lossis sib npaug li 170 degree) thiab interlayer alignment them algorithms, interlayer alignment raug raug tswj tsis pub dhau ± 10 μ m, tag nrho daws qhov teeb meem kev hloov pauv impedance tshwm sim los ntawm interlayer misalignment.

   Kev tswj hwm qib micro zoo thoob plaws hauv tag nrho cov txheej txheem: Tsim kom muaj kev tshuaj xyuas peb zaug ntawm AOI, X-ray, thiab AXI, npog tag nrho cov txheej txheem los ntawm cov txheej txheem sab hauv mus rau qhov chaw mounting, thiab cuam tshuam 99.9% ntawm qhov tsis xws luag ua ntej.

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   Kev ua raws qib kev kho mob thiab kev ruaj ntseg
   Tag nrho cov substrates thiab solder tiv thaiv tau dhau ISO 10993 biocompatibility kuaj, nrog hnyav hlau cov ntsiab lus hauv qab 0.1ppm, ua tau raws li qhov yuav tsum tau muaj kev nyab xeeb rau kev cog qoob loo mus ntev.

   Cov khoom tiav lawm tau dhau 500 lub voj voog thermal los ntawm -40℃mus rau +150 degree, thiab qhov kev hloov pauv ntawm micropores tsis tshaj 10%. Lub neej kev pabcuam tsim tuaj yeem ncav cuag ntau tshaj 10 xyoo.

   Lub impedance kam rau ua yog nruj me ntsis tswj nyob rau hauv ± 5% kom ruaj ntseg kis tau tus mob ntawm microvolt theem physiological teeb liab rau implantable neural stimulators, pacemakers, thiab lwm yam khoom siv.