Dab tsi yogHDI?
HDI board (high-density interconnect board) is a printed circuit board that uses micro blind buried hole technology to achieve higher line density, and has the characteristics of "light, thin, short, and small". Nws cov txiaj ntsig tseem ceeb nyob hauv cov kab me me dav / qhov sib nrug (txog 3mil / 3mil), me aperture (tsawg kawg 0.1mm), thiab siab dua interlayer interconnect ntom, ua rau nws haum rau siab -kawg miniaturized li xws li smartphones thiab smartwatches.
The production process of HDI board (high-density interconnect board) is centered on laser drilling and layering method, achieving micro holes, fine lines, and thin layers. Cov txheej txheem tseem ceeb yog raws li nram no:
1. Tsim theem
Siv cov software tshaj lij los npaj qhov chaw ntawm cov kab, qhov faus, thiab qhov muag qhov muag kom ntseeg tau tias muaj kev ua tau zoo ntawm - kev sib txuas ceev ceev.
2. Kev npaj khoom siv
Xaiv cov dielectric tsis tu ncua, siab kub tsis kam substrates (xws li hloov kho epoxy resin) thiab cov ntawv ci tooj liab ntshiab kom ntseeg tau cov teeb liab ruaj khov.
3. Cov txheej txheem tseem ceeb ntws
Sab hauv txheej ntau lawm: Laser drilling los tsim micro qhov (yam tsawg kawg nkaus 0.075mm), etching tooj liab ntawv ci los tsim cov txheej txheej sab hauv.
Stacking thiab qhov muag tsis pom qhov txhaws: hloov cov txheej txheem txheej txheem thiab cov ntawv kho ib nrab, txhaj cov tshuaj tom qab siab - kub thiab siab - siab kho kom ua tiav kev sib txuas ntawm interlayer.
Kev kho txheej txheej txheej: laser drilling ntawm cov qhov hluav taws xob, electroplating kev sib txuas ntawm sab hauv thiab txheej txheej, kev kho deg (xws li npib tsib xee kub plating) txhawm rau txhim kho weldability.
Kev tshuaj xyuas zoo: Ua kom raug thiab kev ntseeg tau los ntawm AOI, X-Ray, thiab lwm txoj hauv kev.
4. Technical nta
Laser drilling: zam qhov teeb meem ntawm rab koob tawg hauv cov tshuab drilling thiab txhawb kev sib txuas hauv txhua txheej.
Multi order HDI: 1st order (txuas cov khaubncaws sab nraud povtseg) mus rau 7th order (complex interconnects) technology, ua tau raws li qhov yuav tsum tau muaj kev koom ua ke siab.