Cov qauv tsim teeb meem ntawm nruj flex printed boards mas tsom rau kev tswj ntawm thermal expansion coefficient nyob rau hauv cov txheej txheem lamination thiab cov khoom txuam, uas ncaj qha cuam tshuam rau kev ntseeg tau thiab kev ua tau zoo ntawm cov khoom.
Lub complexity ntawm lamination txheej txheem
Cov txheej txheem lamination yog ib kauj ruam tseem ceeb hauv kev tsim cov rigid flex printed boards, uas yuav tsum tau cov rigid thiab saj zawg zog boards yuav tsum tau nias ua ke nyob rau hauv qhov kub thiab txias. Vim muaj qhov sib txawv tseem ceeb hauv lub cev ntawm cov khoom tsis zoo thiab cov khoom siv tau yooj yim, cov teeb meem xws li misalignment, cov kua nplaum ntau dhau, lossis kev sib txuas tsis muaj zog tuaj yeem tshwm sim thaum txheej txheem lamination. Piv txwv li, qhov yooj ntawm lub rooj tsavxwm nruj thiab cov rigidity ntawm lub rooj tsavxwm hloov tau yooj yim sib cuam tshuam ib leeg, uas yuav ua rau delamination lossis tawg. Rau lub hom phiaj no, siab - cov cuab yeej sib dhos ua kom zoo (xws li cov tshuab kho qhov muag kho qhov muag nrog micrometer qib raug) thiab cov kev sib txuas ua kom zoo (xws li siab, kub, thiab lub sijhawm) yuav tsum tau ua kom muaj kev sib raug zoo ntawm interlayer.
Coefficient ntawm thermal expansion (CTE) piv
Kev tswj ntawm thermal expansion coefficient ntawm cov tawv tawv sib xyaw phaj yog lwm qhov kev sib tw loj. CTE qhov sib txawv ntawm ridig board cov ntaub ntawv (xws li polyimide PI) thiab cov ntaub ntawv nyuaj (xws li FR-4) yog qhov tseem ceeb, uas tuaj yeem ua rau muaj kev ntxhov siab thaum lub sij hawm hloov kub, ua rau Circuit Court deformation lossis kev sib txuas tsis ua haujlwm. Piv txwv li, CTE ntawm PI yog kwv yees li 50 ppm /℃C, thaum CTE ntawm FR-4 yog 14-17 ppm /℃C. Qhov no mismatch yuav ua rau delamination los yog solder leeg qaug zog. Cov kev daws teeb meem suav nrog xaiv cov khoom siv sib xws, txhim kho pawg tsim qauv (xws li cov qauv sib luag), thiab ua qhov kev ntsuam xyuas kev ntseeg siab (xws li kev caij tsheb kauj vab siab thiab qis).
Lwm yam kev sib tw tsim
Tus qauv tsim: Nws yog ib qho tsim nyog los npaj qhov chaw nruj thiab hloov tau yooj yim, tsis txhob muaj kev ntxhov siab, thiab khaws cia txaus bending radius.
Teeb liab kev ncaj ncees: impedance txuam thiab crosstalk tswj yuav tsum tau txiav txim siab thaum xa high -frequency signals.
Tus nqi thiab lub voj voog: Cov txheej txheem nyuaj ua rau cov nqi ntau lawm thiab cov voj voog ntau lawm ntev. Hoteo.
Daim ntawv thov scenarios
Dav siv nyob rau hauv siab - cov cuab yeej precision, xws li:
Consumer electronics (lub koob yees duab xov tooj ntawm tes, folding screen pob khawm)
Cov khoom siv kho mob (endoscopes, pacemakers)
Aerospace, automotive electronics (hauv tsheb koob yees duab, sensors) Daim ntawv thov scenarios
Dav siv nyob rau hauv siab - cov cuab yeej precision, xws li:
Consumer electronics (lub koob yees duab xov tooj ntawm tes, folding screen pob khawm)
Cov khoom siv kho mob (endoscopes, pacemakers)
Aerospace, automotive electronics (hauv tsheb koob yees duab, sensors)
rigid flex printed boards, fr4 pcb, siab -frequency printed circuit board