Kev kho deg ntawm Circuit Boards plays lub luag haujlwm tseem ceeb hauv kev tsim hluav taws xob. Nws tsis tsuas yog cuam tshuam rau kev ua tau zoo thiab kev ntseeg siab ntawm Circuit Court boards, tab sis tseem cuam tshuam ncaj qha rau kev ua haujlwm thiab kev tswj tus nqi ntawm cov txheej txheem ntau lawm; Nws lub luag haujlwm feem ntau yog tshwm sim hauv cov hauv qab no:
Tiv thaiv cov txheej tooj liab kom tiv thaiv oxidation
Cov txheej tooj liab ntawm lub rooj tsav xwm Circuit Court yog nquag oxidation thaum raug huab cua, ua rau muaj teeb meem xws li tsis zoo soldering thiab txo conductivity. Kev kho deg zoo tiv thaiv tooj liab oxidation los ntawm kev tsim cov yeeb yaj kiab tiv thaiv ntawm txheej tooj liab.
Piv txwv: Organic solder mask (OSP): Ib txheej ntawm cov organic tiv thaiv zaj duab xis yog tsim rau saum npoo ntawm tooj liab los tiv thaiv tooj liab oxidation thaum ua kom muaj kev ua haujlwm vuam. Chemical npib tsib xee kub (ENIG) plating: Ib txheej ntawm npib tsib xee thiab kub tau tso rau saum npoo ntawm tooj liab, nrog cov nickel txheej ua haujlwm los tiv thaiv kev sib txawv ntawm tooj liab thiab kub, thaum txheej kub muab cov khoom zoo thiab cov khoom siv hluav taws xob.
Txhim kho vuam kev ua tau zoo
Kev kho deg tuaj yeem txhim kho qhov ntub dej ntawm lub rooj tsav xwm hauv Circuit Court, ua kom zoo dua adhesion ntawm solder rau cov ntaub qhwv thiab txhim kho qhov zoo thiab kev ntseeg siab ntawm soldering.
Piv txwv: Huab cua kub leveling (HASL): Los ntawm tshuab cov cua kub ntau dhau, cov txheej txheem vuam yog tsim los txhim kho vuam kev ua tau zoo. Immersion Tin: Plating ib txheej ntawm tin rau saum npoo ntawm tooj liab los muab kev ua tau zoo ntawm kev ua haujlwm zoo, haum rau ntau txoj hau kev.
Txhim khu kev hnav tsis kam thiab corrosion kuj
Rau cov rooj sib tham hauv Circuit Court uas yuav tsum tau txuas ntau zaus lossis raug rau qhov chaw hnyav, kev kho saum npoo tuaj yeem txhim kho lawv cov hnav tsis kam thiab tiv thaiv corrosion, ncua lawv lub neej kev pab cuam.
Piv txwv li: Electroplating Hard Gold: Plating ib txheej ntawm cov kub kub rau saum npoo ntawm tooj liab, uas yog du, tawv, hnav-resistant, thiab haum rau tej thaj chaw xws li kub ntiv tes uas yuav tsum tau nquag ntxig thiab tshem tawm. ENEPIG: Plating ib txheej ntawm palladium thiab kub ntawm ib txheej npib tsib xee los muab kev tiv thaiv corrosion zoo heev thiab hnav tsis kam.
Ua tau raws li qhov yuav tsum tau ua haujlwm tshwj xeeb
Xaiv txoj kev kho saum npoo kom tsim nyog raws li cov kev xav tau tshwj xeeb ntawm cov khoom, xws li siab -frequency signal transmission, high reliability interconnection, etc.
Piv txwv li: Immersion Silver: Tsim nyog rau siab - zaus circuits, muab cov conductivity zoo thiab teeb liab ncaj ncees. Kev xaiv electroplating: electroplating nyob rau hauv ib qho chaw kom tau raws li cov kev cai tshwj xeeb xws li siab - zaus teeb liab kis tau tus mob thiab muaj kev ntseeg siab rau kev sib txuas.
Kev tiv thaiv ib puag ncig thiab kev ua raws cai
Nrog rau cov kev cai ib puag ncig nruj zuj zus, kev xaiv cov txheej txheem kev kho saum npoo kuj yuav tsum tau xav txog ib puag ncig los xyuas kom meej tias cov khoom ua raws li cov kev cai tswj hwm.
Piv txwv: Lead Free HASL: Siv cov hlau lead -dawb alloy es tsis txhob tin txhuas alloy raws li ib puag ncig. Organic solder mask (OSP): ib puag ncig tus phooj ywg, nyab xeeb, thiab ua raws li RoHS cov qauv.
Optimize cov txheej txheem ntau lawm thiab tswj tus nqi
Kev xaiv cov txheej txheem kho saum npoo kuj yuav tsum xav txog cov txheej txheem tsim khoom thiab kev tswj hwm tus nqi, thiab xaiv cov txheej txheem kho saum npoo nrog tus nqi siab -kev ua tau zoo thiab cov txheej txheem paub tab.
Piv txwv: cua kub theem (HASL): Tus nqi qis, txheej txheem yooj yim, haum rau loj- nplai ntau lawm. Organic solder mask (OSP): Tus nqi qis, txheej txheem yooj yim, haum rau ntau txoj kev vuam, thiab tus phooj ywg ib puag ncig.
Cov hauv qab no yog ib qho kev qhia txog kev ua tau zoo ntawm kev kho mob thiab xaiv txoj kev kho deg:
