4L immersion kub siab PCB
1. Xa lus piav qhia
4L immersion kub siab PCB
Daim ntawv thov: kev lag luam tswj
Txheej: 4
Cov txheej txheem tshwj xeeb: sib xyaw ua ke
Kev kho qhov hauv npoo: kev kub (immersion) (2u ")
Khoom siv: ROGERS 4350 + FR4.
Sab nrauv kab / kab nrug: 7 / 7mil.
Sab hauv kab / kab nrug: 5 / 5mil.
Thickness: 2.3 hli
Lub aperture qis tshaj: 0.6mm.
Uniwell circuits txhawb nqa koj pib tam sim ntawd nyob rau hauv cov qauv tsim. Peb pab koj nrhiav kev tsim nyog substrates, ntsuas qhov dav dav dav thiab qhov nris, xam cov impedances, thiab.
2. Qhia cov ntaub ntawv
Uniwell circuits tau tsim nyob rau hauv 2007, raws li nyob rau hauv Shenzhen, Tuam Tshoj, tshwj xeeb nyob rau hauv lub ntawm luam tawm Circuit Court boards. Raws li keeb kwm Tuam Tshoj raws li PCB chaw tsim khoom, Uniwell manufactures ntau hom PCB, xws li ib tog PCB, ob chav PCB thiab ntau txheej PCB, mus txog 40 txheej. Peb cov khoom siv sib txawv yog siv rau cov teeb pom kev zoo xws li LED teeb, lub hwj chim, kev ntsuas, kev sib txuas lus, kev siv tshuab hluav taws xob, tsheb electronics thiab lwm yam lag luam. Peb muab ntau yam kev pab cuam los ntawm PCB prototypes kom ntim loj PCB.
Peb kev rau HF Circuit Court boards:
● HF-khoom (tsawg-poob), xws li PTFE substrate
● Thaj chaw tswj hwm ntawm cov neeg coob coob
● Sandwich buildup rau cov khoom siv ua ke
● Microvias strating ntawm 75μm
● Tshaj tawm cov kab ntau ntxiv / nrog daim ntawv pov thawj qhia ntawv, raws li xav tau
● Backdrill
3.Certification
Uniwell tau pom zoo los ntawm cov ntawv pov thawj zoo: ISO9001, ISO14001, TS16949 thiab UL.
4.Luag kev paub --- Hhow xaiv cov khoom siv rau PCB qhov siab
Xaiv ib qho khoom siv Circuit Court rau lub Board-Circuit Board (PCB) feem ntau yog kev lag luam, feem ntau ntawm cov nqi thiab kev ua tau zoo. Tab sis PCB cov ntaub ntawv kuj raug xaiv los ntawm ob yam tseem ceeb: qhov zoo npaum li cas lawv ua tau raws li cov kev xav tau ntawm kev siv cov ntaub ntawv kawg thiab muaj peev xwm ua dab tsi los tsim ib lub tswv yim xav nrog cov khoom.
Cov teeb meem no ob qho yuav tsis mesh: ib cov khoom siv tau zoo rau ib qho kev thov tab sis tej zaum yuav ua teeb meem ntawm kev sib cog lus ntawm circuit, thiab vice versa. Yog tsis muaj txoj kev tsis muaj tswv yim, cov txheej txheem theem-ntawm-theem rau kev xaiv cov khoom PCB. Tab sis yog cia siab rau qee cov txheej txheem tangible tsim los ntsuam xyuas cov ntaub ntawv raws li nws qhov kev tsim nyog rau kev sib cog khoom thiab kev ua raws li cov cai ntawm daim ntawv thov, tus txheej txheem xaiv PCB rau ib daim ntawv thov tau yooj yim. Cov kev qhia yuav ua kom pom nrog qee cov PCB nrov tshaj plaws cov ntaub ntawv, thiab qhov twg txhua tus sawv cev ntawm kev tsim kom zoo thiab tsim kom tiav rau cov ntawv thov.
Cov ntaub ntawv coj mus muag PCB ua tau zoo li yog ib qho ntawm xya hom khoom, raws li tau qhia hauv daim ntawv 1. Kev ua tau zoo hauv FR-4 yog muaj nyob rau hauv Table 1 vim tias feem ntau siv nrog lwm cov khoom siv rau ntau yam rau qee cov kev siv thiab kev xav tau. Txawm li cas los xij, raws li kev tsim hluav taws xob, FR-4 tsis suav tias yog cov khoom muaj tseeb cov khoom siv high-frequency circuit.
Daim 1: Cov khoom sib txuas rau hauv cov qauv siv high-frequency PCB.
Xaiv cov khoom raws li teeb meem ntawm circuit teeb meem
Ntau hom kev sib txawv ntawm txhua yam yuav tsum tau ua raws li ib feem ntau ntawm PCB fabrication. Feem ntau, qhov tseem ceeb tshaj ntawm cov no yuav tsum tau drilling, plated-through-hole (PTH) npaj, multilayer lamination, thiab sib sau ua ke. Cov txheej txheem drilling yog feem ntau txhawj xeeb nrog tsim cov qhov dej huv, uas yuav tom qab muab hlau rau tsim viaholes rau hluav taws xob txuas los ntawm ib cov txheej txheem tawm mus rau lwm tus.
Qee qhov kev txhawj xeeb nrog cov txheej txheem drilling muaj xws li smear, burring, thiab fracturing ntawm cov khoom. Smearing yuav ua kom tuag rau PCB fabrication siv cov khoom PTFE raws li, vim tsis muaj ib txoj kev los tshem tus neeg haus luam yeeb. Fracturing tuaj yeem ua kom tuag rau qee yam ntawm cov ntaub ntawv cov roj nonwoven hydrocarbon; Txawm li cas los xij, feem ntau ntawm cov ntaub ntawv khom iav hydrocarbon tsis muaj qhov kev txhawj xeeb no.
PTH cov txheej txheem tsim yog zoo tsim thiab ncaj nraim rau feem ntau non-PTFE cov ntaub ntawv, txawm hais tias tshwj xeeb ua yuav tsum tau thaum tsim PTHs rau cov ntaub ntawv PTFE. Tej yam khoom uas muaj Pamic-based PTFE ua rau PTH npaj cov kev xaiv uas ntau dua kev zam txim. Txawm li cas los xij, cov ntaub ntawv tsis-ceramic PTFE yuav tsum muaj txheej txheem tshwj xeeb uas tuaj yeem txo qhov kawg ntawm cov khoom siv cog qoob loo.
Fabricating Multilayer PCBs nthuav tawm ntau yam kev cov nyom. Ib qho yog qhov tseeb uas txawv cov ntaub ntawv ntau yam ua ke ua ke, thiab cov ntaub ntawv sib txawv no muaj peev xwm ua rau cov teeb meem drilling thiab PTH npaj cov txheej txheem. Tsis tas li ntawd, ib qho kev sib haum xeeb ntawm cov khoom siv, xws li coefficient ntawm thermal expansion (CTE), tuaj yeem ua rau muaj teeb meem ntawm kev cia siab thaum lub Circuit Court thermally nyuab siab thaum lub rooj sib txoos. Lub hom phiaj ntawm kev xaiv cov txheej txheem yog los nrhiav kev sib xyaw ua ke ntawm cov khoom siv hauv circuit rau lub PCB multilayer uas pab tsim cov ntaub ntawv tsim ua thaum tseem yuav tsum tau siv cov kev siv xaus.
Cov kws tsim thiab cov kws tsim khoom muaj ntau txoj hau kev xaiv los siv ua ke nrog cov khoob khoob khoob khoob khoob khoob uas ua tiav rau qhov kawg ntawm PCB. Raws li Table 2 qhia, cov ntaub ntawv txawv ntawm qhov dielectric qhov chaw, qhov kev tshaj tawm, thiab kev ua haujlwm txias. Feem ntau, qis dua cov xim lam tau lam ua dua. Tab sis yog tias tus PCB yuav tsum tau siv cov phom sij los yog lwm hom thermal raug, nws yuav tsum siv cov khoom sib txuas nrog high reflow (re-melt) kub, ib qho uas ua haujlwm ruaj khov thiab tsis thim rau qhov kub ua kom txias.
Table 2: Cov ntaub ntawv txhim kho siv rau cov ntaub ntawv ntau cov PCBs uas muaj high-frequency multilayer.
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